Reticulated Metal Foams (RMF) are cost-effective and ultra-high-performance thermal management materials that can be integrated with electronic devices and modules. RMFs are compatible with DI water, inert fluoro-carbons, jet fuel, and inert gases. STRUCTURE OF RMF There are quite a few ways to fabricate RMF [1], however the investment casting method of … [Read more...]
Join the Electronics Cooling Community of Authors and Bloggers!
Electronics Cooling invites you to share your expertise, knowledge, and perspective on critical aspects, foundational education, and trends with electronics thermal management technology. Electronics Cooling stands strong as one of the foremost resources for thermal management engineers and professionals, and much of this success is the result of a dedicated community of … [Read more...]
Rising Demand for Thermal Management in Consumer Electronics Prime Factor for Exponential Growth of Market
According to the new market research report "Thermal Management Market by Material Type (Adhesive, Non-Adhesive), Devices (Conduction, Convection, Advanced, Hybrid), Service (Installation & Calibration, Optimization & Post Sales), End-Use Application - Global Forecast to 2022", The thermal management market is expected to be worth USD 14.24 Billion by 2022, growing at a … [Read more...]
New Heat Exchange Module Launched
CoolIT Systems (CoolIT), world leader in energy efficient liquid cooling solutions for HPC, Cloud, and Enterprise markets, has expanded its Rack DCLC™ product line with the release of the AHx2 Heat Exchange Module. This compact Liquid-to-Air heat exchanger makes it possible for Direct Contact Liquid Cooling (DCLC) enabled servers to be thermally tested during the factory … [Read more...]
Estimating Internal Air Cooling Temperature Reduction in a Closed Box Utilizing Thermoelectrically Enhanced Heat Rejection
An earlier article in this column considered the problem of cooling electronic components in a closed box [1]. In outdoor applications for example, it may be necessary to totally seal the box to prevent exposure to airborne particulates, water droplets or other sub- stances in the air that could be injurious to the electronic components. In such an application, heat picked up … [Read more...]
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