INTRODUCTION Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center cabinets have already surpassed 30 kW per cabinet (or 40.4 kW/m2) [1]. It is not an unreasonable assumption to expect that, in accordance with Moore's Law [2], power could double within the next few … [Read more...]
Thermal Management of Outdoor Enclosures, Part 4: Passive Cooling Systems
In Part 1 (Thermal Management of Outdoor Enclosures), key aspects for successful design and development of thermal management systems were covered briefly, among these, cooling device selections and its impact on power, battery back-up and maintenance has therefore become of paramount importance for telecommunications enclosures. These are: Full active systems, like air … [Read more...]
Thermal Management of Outdoor Enclosures, Part 3: Semi-Active Cooling Systems
In Part 1 (Thermal Management of Outdoor Enclosures), key aspects for successful design and development of thermal management systems were covered briefly, among these, cooling device selections and its impact on power, battery back-up and maintenance has therefore become of paramount importance for telecommunications enclosures. These are: Full active systems, like air … [Read more...]
Thermal Management of Outdoor Enclosures, Part 2: Active Cooling Systems
In Part 1 (Thermal Management of Outdoor Enclosures), key aspects for successful design and development of thermal management systems were covered briefly, among these, cooling device selection and its impact on power, battery back-up and maintenance has therefore become of paramount importance for telecommunications enclosures. These are: Full active systems, like air … [Read more...]
TEAs from Laird Deliver Compact Cooling Performance for Analytical and Medical Instrumentation
When used with an SR-54 Series programmable temperature controller, the Tunnel Series thermoelectric assemblies (TEAs) provides precise temperature control with condensation protection for applications below dew point. April 30, 2018 -- Global technology leader Laird (LRD: London) has expanded its thermoelectric assembly (TEA) product offering to better support heating and … [Read more...]
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