Rogers Corp. has introduced TC350 Plus laminates. TC350 Plus laminates are ceramic filled PTFE-based woven glass reinforced composite materials providing a cost effective, high performance, thermally enhanced material for the circuit designer. With a thermal conductivity of 1.24W/mK, this next generation PTFE-based laminate is ideally suited for higher power microwave and … [Read more...]
Thermal Gap Filler Reduces Stress on Sensitive Components
Laird Performance Materials has introduced the Tflex HD80000, a high deflection thermal gap filler combining 6 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination allows minimal stress on sensitive components within a device while also yielding low thermal resistance. As a result, less mechanical and thermal stresses are … [Read more...]
Managing Cooling Fan Noise In Product Design
ABSTRACT Cooling fan noise is a system property determined as much by thermal and mechanical design and fan selection as by a fan’s acoustical design. While even the quietest fan can be used in a noisy manner, a significant fraction of unpleasant surprises can be avoided. NOMENCLATURE C Numerical constant D … [Read more...]
10 Must Attend Technical Sessions at SEMI-THERM 35
The 35th Semiconductor Thermal Management conference starts in a week and is being held in Silicon Valley, CA. Electronics Cooling is one of the media sponsors and will have an exhibit booth –stop by to say hello, pick up some literature and chat with us to learn more about what is “hot” in the electronics industry and how it is so “cool” to work on thermal management! … [Read more...]
Thermal Management of Outdoor Enclosures, Part 5A: Passive PCM Cooling Systems
In Part 1 (Thermal Management of Outdoor Enclosures), key aspects for successful design and development of thermal management systems were covered briefly, among these, cooling device selections and its impact on power, battery back-up and maintenance has therefore become of paramount importance for telecommunications enclosures. These are: Full active systems, like air … [Read more...]
