Thermal characterization plays a vital role in electronic package reliability testing, design, and verification of manufacturing processes. The reliability of electronic packages is controlled, in part, by ensuring the maximum junction temperature is not exceeded during operation. Systems such as cell phones, electric vehicles and computers, must operate with die temperatures … [Read more...]
Tech Brief: Radiation Basics: When Does It Matter?
Introduction This is the first installment in a series of articles that aim to explore a range of practical topics on radiation that will be relevant to those of us focused on electronics cooling and thermal design. While radiation is one of the three fundamental modes of heat transfer, it is often the last topic covered in an introductory heat transfer course. This may … [Read more...]
Why Low Gassing Adhesives Matter
The aerospace, electronic, and optical industries often involve environments where outgassing from adhesives can pose significant challenges. When exposed to vacuum or elevated temperatures, conventional adhesives may release volatile compounds, leading to contamination or performance degradation of sensitive components. To mitigate these risks, engineers might consider low … [Read more...]
Blue Laser Welding Increases Vapor Chamber Fabrication Efficiency
We all understand that higher circuit density and increasingly compact microelectronic devices have created a need for more efficient cooling. Vapor chambers have emerged as a widely employed solution in some of the most demanding microelectronics applications. They are already found in high-performance computers, such as servers, workstations, and personal gaming desktops and … [Read more...]
The Applicability of JESD51-14 for the Determination of Junction to Case Thermal Resistance
Rjc (or sometimes ThetaJC, θjc, Rth_jc), the so-called ‘junction to case’ thermal resistance, is a thermal metric that enables comparison of the thermal performance of packaged semiconductor devices from differing suppliers. The JEDEC standard JESD51-14 [1] documents a method for the experimental determination of Rjc. Although applicable for packages that exhibit a … [Read more...]
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