Abstract As we entered the current century, consumer electronics were primarily cooled using aluminum. Over the last 15 years, flexible graphite heat spreaders have largely replaced aluminum for thermal management in many advanced consumer electronics devices where properties of being thin or lightweight are desired. There are two types of flexible graphite, natural and … [Read more...]
Three Reasons to Add Thermal Simulation to your Circuit Design Workflow
As wireless devices increase in complexity, the challenges around maintaining temperature control continue to mount. As smartphones, for example, require more and more transistors to fit into smaller spaces, there’s simply not as much space for the heat to dissipate. Wireless designers are tasked with finding new ways to keep these devices from overheating without … [Read more...]
Forced-Air Cooling: Should You Push or Pull?
As much as we’d prefer to be able to use just unforced, natural convection cooling, many designs and installations simply cannot be cooled adequately by the low level and uncertainty of airflow that this low-cost, reliable approach offers. Instead, it’s very common to use one or more fans to force the air at a known volume and velocity through the enclosure or chassis … [Read more...]
TC350 Plus Laminates for Higher Microwave & Industrial Heating Applications
Rogers Corp. has introduced TC350 Plus laminates. TC350 Plus laminates are ceramic filled PTFE-based woven glass reinforced composite materials providing a cost effective, high performance, thermally enhanced material for the circuit designer. With a thermal conductivity of 1.24W/mK, this next generation PTFE-based laminate is ideally suited for higher power microwave and … [Read more...]
Thermal Gap Filler Reduces Stress on Sensitive Components
Laird Performance Materials has introduced the Tflex HD80000, a high deflection thermal gap filler combining 6 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination allows minimal stress on sensitive components within a device while also yielding low thermal resistance. As a result, less mechanical and thermal stresses are … [Read more...]
