Introduction Thermal management plays a critical role in the performance, reliability, and longevity of wearable devices. Reliability must be considered even when components remain below their absolute maximum operating temperatures. This is due to increased diffusion rates, material fatigue, and electromigration effects which degrade electronics over time. Additional failure … [Read more...]
Choosing the Proper Thermocouple Types for Greatest Accuracy
Most engineers involved with temperature measurement know there are several methods for measuring temperatures of fluids and solids. The oldest and most common method for measuring the temperature of a fluid such as air is the standard mercury-in-glass thermometer. However, this is not acceptable for measuring surface temperatures of solid objects. For surface temperature … [Read more...]
Radiation Basics: Making Sense of Emissivity & Absorptivity
Introduction This is the second installment in a series of articles that aims to explore a range of practical topics on radiation that are relevant to those of us focused on electronics cooling and thermal design. The last article [3] provided guidance regarding when radiation matters, with examples being natural convection environments, space applications, solar collectors, … [Read more...]
Augmenting Development of Electronics Cooling Technologies with Machine Learning Tools – a Heat Pipe System Example
The traditional pathway for development of thermal management technologies for electronics has been to analyze using heat transfer theory augmented by computational tools such as finite difference or finite element methods, CFD tools, or thermal management system simulation tools, sometimes in tandem with prototype system fabrication and testing. Combining recently available … [Read more...]
Theta-JC Measurements: Steady-State Compared to Transient Methods
Thermal characterization plays a vital role in electronic package reliability testing, design, and verification of manufacturing processes. The reliability of electronic packages is controlled, in part, by ensuring the maximum junction temperature is not exceeded during operation. Systems such as cell phones, electric vehicles and computers, must operate with die temperatures … [Read more...]
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