Abstract The utility of the laser flash thermal conductivity measurement can be greatly expanded to more complex structures by modeling laser flash results using Finite Element Models. This approach is illustrated using a test fixture with 4 heat sinks, where heat spreading is a significant factor. If traditional 1D thermal diffusion models for laser flash are used, thermal … [Read more...]
Thermal Modeling of a Silicon Germanium (SiGe) Radio Frequency Integrated Circuit (RFIC) for Wireless Communications
The creation, transport and storage of digital information are growing at rates of 40% to 50% annually, with video, mobile broadband, and machine-to-machine communication being the main drivers. The implementation of 5G wireless networks is enabling this growth and heralding a new era of revolutionary applications and functionality due to bandwidth increases and communication … [Read more...]
Statistics Corner: Weibull Distribution
A little over a pandemic ago, the first article in this series on statistical analysis mentioned that a fundamental aspect of statistics is that one assumes a mathematical model that describes the distribution of a data set and then uses that model to estimate the probability that a given value or set of values will occur [1]. This allows us, for example, to estimate whether … [Read more...]
Machine Learning Optimization to Boost the Effectiveness of Phase Change Material (PCM)-Based On-Chip Passive Thermal Management
Written by: Dr. Amy Marconnet and Meghavin Bhatasana - Purdue University Although miniaturization of electronic components has helped advance computing power and accelerated technology development, it has increased power densities and exacerbated the already challenging issue of electronics cooling at the component level. Continuous operation at high temperatures degrades … [Read more...]
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity
In this video demonstration, learn more about EP3HTSDA-1, a thermally conductive die attach epoxy, and see how easily it dispenses. One component Master Bond EP3HTSDA-1 is formulated primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f and has a high thermal conductivity of 40-45 BTU•in/ft2•hr•°F [5.7-6.5 W/(m•K)]. “This 100% solids … [Read more...]
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