SHIN-ETSU SILICONES LAUNCHES CLG SERIES GAP FILLERS WITH IMPROVED RESISTANCE AGAINST PUMP-OUT FOR ADVANCED THERMAL MANAGEMENT ELECTRONICS APPLICATIONS. Akron, OH | February 2018 - In an effort to provide progressive options to thermal engineers in the growing electronics cooling market sector for silicone TIM (Thermal Interface Materials), Shin-Etsu Silicones of America, … [Read more...]
Join the Electronics Cooling Community of Authors and Bloggers!
Electronics Cooling invites you to share your expertise, knowledge, and perspective on critical aspects, foundational education, and trends with electronics thermal management technology. Electronics Cooling stands strong as one of the foremost resources for thermal management engineers and professionals, and much of this success is the result of a dedicated community of … [Read more...]
Rising Demand for Thermal Management in Consumer Electronics Prime Factor for Exponential Growth of Market
According to the new market research report "Thermal Management Market by Material Type (Adhesive, Non-Adhesive), Devices (Conduction, Convection, Advanced, Hybrid), Service (Installation & Calibration, Optimization & Post Sales), End-Use Application - Global Forecast to 2022", The thermal management market is expected to be worth USD 14.24 Billion by 2022, growing at a … [Read more...]
Thermally Conductive Laminate Material for Demanding PCB Applications
Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, has added to its extensive thermally conductive laminate and prepreg range with the launch of the VT-5A2, a next generation best-in-class, high Tg thin-core and prepreg material. VT-5A2 is designed for the world's most thermally demanding PCB (Printed … [Read more...]
Application of Metallic TIMs for Harsh Environments and Non-flat Surfaces
Co-authored by: David L. Saums and Tim Jensen DS&A LLC and Indium Corporation INTRODUCTION Electronic systems, implemented in such diverse industries as aerospace, vehicle, geothermal exploration, and mobile devices with a range of more challenging application conditions, create new challenges for component and material reliability. Non-flat mounting conditions, … [Read more...]
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