Abstract This paper presents a novel thermal management approach for power semiconductor modules by integrating active liquid cooling directly into the substrate. Utilizing Direct Bond Copper (DBC) structures embedded within liquid cold plates, the method minimizes thermal interfaces, improves power density, and ensures better reliability. It contrasts traditional … [Read more...]
Thermal Design for Externally Worn Wearable Electronics
Introduction Thermal management plays a critical role in the performance, reliability, and longevity of wearable devices. Reliability must be considered even when components remain below their absolute maximum operating temperatures. This is due to increased diffusion rates, material fatigue, and electromigration effects which degrade electronics over time. Additional failure … [Read more...]
Summary of SEMI-THERM 41 Conference
By Navid Kazem, Lieven Vervecken, and Claire Wemp The SEMI-THERM 41 Symposium was held March 10-13, 2025 at the Double Tree Hotel in San Jose, CA. Program organization was led by General Chair Lieven Vervecken (Diabatix), Program Chair Dr. Navid Kazem (Arieca), and Program Vice Chair Dr. Claire Wemp (DuPont). It featured a variety of activities including technical short … [Read more...]
Solving the Heat Dilemma for Optical Transceivers: What’s Next for TIMs?
TIMs are vital in optimizing the performance, reliability, and longevity of optical components, such as silicon photonics transceivers in data centers. At Thermal Live Spring 2025, Henkel provided valuable insights into the growing computational demands in data centers and the associated thermal stress risks, highlighting how their thermal interface materials are addressing … [Read more...]
Theta-JC Measurements: Steady-State Compared to Transient Methods
Thermal characterization plays a vital role in electronic package reliability testing, design, and verification of manufacturing processes. The reliability of electronic packages is controlled, in part, by ensuring the maximum junction temperature is not exceeded during operation. Systems such as cell phones, electric vehicles and computers, must operate with die temperatures … [Read more...]
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