By: Lisa Mitterhuber, Julien Magnien, Elke Kraker Introduction Twenty years ago, a lamp had exactly one purpose—to illuminate the room. A typical incandescent lamp lasted a year and failure was caused by a filament or/and a glass breakage [1]. Nowadays typical lighting is based on LED technology, which is considered as durable. Due to the fact that many materials are … [Read more...]
Cool Information from Fujipoly
Carteret, NJ —Tuesday, January 21, 2020— Fujipoly recently added an Engineering Resource section to its website. This technical information library gives engineers unrestricted access to useful whitepapers and webinars as well as an extensive collection of Sarcon® thermal interface material performance datasheets. The whitepapers cover topics such as the Compression … [Read more...]
Tough Epoxy Polysulfide Adhesive Resists High Temperatures
Product: EP21TPHT Release Date: 01/14/2020 Master Bond EP21TPHT is a new two component epoxy polysulfide system designed for bonding applications that require toughened and thermally stable bonds resistant to chemicals. It resists temperatures up to 350°F, much higher than typical epoxy polysulfide systems. This room temperature curable adhesive also features convenient … [Read more...]
Underfill Epoxy Offers Thermal Conductivity and Electrical Insulation
Product: EP29LPTCHT Release Date: 11/21/2019 Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications. It does not need excessive heat for curing and has a long working life at room temperature. This system is electrically insulative and thermally conductive with very fine particle … [Read more...]
Low Compression Force Sarcon
Carteret, NJ — The compression characteristics of thermal gap fillers should be key considerations during a product’s early design phase. For applications that have delicate components or widely varying gap distances, Fujipoly® created a line of Low Compression Force gap filler pads. These TIMs help avoid overstressing the printed circuit board (PCB) and fragile solder joints … [Read more...]
