Telephone equipment has traditionally been housed in large buildings, sheds and outdoor cabinets. The cooling of these facilities has been carried out using traditional methods. However, in many of the new systems being developed and deployed such as broadband ISDN, cellular and/or cable, heat dissipation densities will increase substantially [1]. Furthermore, the introduction … [Read more...]
Thermal resistance of interface materials as a function of pressure
A very large factor in reducing thermal interface resistance is theapplication of pressure. Even though much effort in recent years has beendevoted to improving the thermal conductivity of interface materials, thethermal conductivity of a material is only a piece of the heat transfer puzzle. As shown in Figure 1, the thermal resistance created by the material itself(RM) for a … [Read more...]
Thermal Interface Materials
Thermattach thermally conductive adhesivetapes Introduction Today's semiconductors, whether discrete power or logic ICs, are smaller,run faster, do more and generate more heat. Some microprocessors dissipatepower levels that were once the exclusive domain of discrete power devices,namely 10 to 25 watts. These power levels require thermal management techniquesinvolving large … [Read more...]
- « Previous Page
- 1
- …
- 41
- 42
- 43
