Introduction As single-component heat dissipations in electronics cooling are increasing, air cooling is not always up to the task and is being replaced by liquid cooling. Key differences between air cooling and liquid cooling are a much higher heat transfer […]

The rapid rise of AI accelerators and high-performance computing has pushed rack power densities to unprecedented levels. While direct-to-chip liquid cooling successfully manages heat at the processor, the power delivery path itself has emerged as the next critical thermal bottleneck.  […]

The GTP thermal pad is an advanced graphene thermal conductive gasket developed for high-end electronics and precision optical equipment. It combines ultra-high thermal conductivity with stable interface performance, helping fill tiny gaps between heat sources and heat sinks to improve […]

The Full Data Center Cooling Days 2026 Program is Available to Stream Over the past two weeks, engineers from across data center thermal management came together to share practical engineering presentations on liquid cooling, AI infrastructure, coolant management, thermal testing, […]

As consumer electronics continue their rapid evolution, each new generation is defined by a familiar yet intensifying mandate: deliver more performance in less space. Today’s devices — whether smartphones, wearables, or portable computing platforms — are expected to be thinner, […]

ABSTRACT Power densities continue to increase in AI servers, high-performance computing (HPC) systems, electric vehicles, and semiconductor manufacturing equipment.   As a result, thermal management has become a critical system-design requirement.   Thermal solutions often fall short not because one […]