Reprinted from the June, 2014 Issue ACTIVE LEDs in a consumer TV product are boosted and dimmed with the video picture content. Boosting and dimming of LEDs is a powerful means to improve visual experience, either through the application of […]

Nomenclature  A1, A2, A3, A4 –  ASHRAE allowable thermal envelopes as defined in Thermal Guidelines for Data Processing Environments that represent where IT manufacturers test equipment to ensure functionality ASHRAE – American Society of Heating, Refrigerating and Air-Conditioning Engineers CAGR […]

Some of the biggest hurdles to widespread adoption of electric vehicles are range anxiety, battery longevity, and safety. As the electric vehicle market grows and for it to reach its full potential, there is an increased need for effective thermal […]

By: Hrishikesh Kadam, Research Content Developer at Global Market Insights (GMI) The world is rapidly going wireless. Within a span of a few decades, phones and internet became wireless, and now charging has become wireless. Even though wireless charging is […]

Abstract As we entered the current century, consumer electronics were primarily cooled using aluminum. Over the last 15 years, flexible graphite heat spreaders have largely replaced aluminum for thermal management in many advanced consumer electronics devices where properties of being […]

  As wireless devices increase in complexity, the challenges around maintaining temperature control continue to mount. As smartphones, for example, require more and more transistors to fit into smaller spaces, there’s simply not as much space for the heat to […]

Carteret, NJ —Tuesday, January 21, 2020— Fujipoly recently added an Engineering Resource section to its website. This technical information library gives engineers unrestricted access to useful whitepapers and webinars as well as an extensive collection of Sarcon® thermal interface material […]

Product: EP21TPHT Release Date: 01/14/2020 Master Bond EP21TPHT is a new two component epoxy polysulfide system designed for bonding applications that require toughened and thermally stable bonds resistant to chemicals. It resists temperatures up to 350°F, much higher than typical […]

Calculation Corner Bruce Guenin, Assoc. Technical Editor   Introduction These days, many thermal engineers face the challenge of defining effective heat sink cooling solutions for high power processors and ASICs (Application-Specific Integrated Circuits). The usual practice would be to calculate […]

One of the first practical lessons that electronic-circuit designer learn is to be aware of power-rail voltage drop, commonly called “IR drop,” which is the simple product of current and resistance in the printed-circuit board (PCB) track, wire, or larger […]