You’re Sending That Heat “Away” to Where, Exactly?
Engineers are generally hard-nosed realists and don’t rely on the mythical kingdoms of fairy tales where only good things can happen and all problems disappear. Still, there is one magical place which is often called out when dealing with the […]
The Impact of Hybrid Cooling on the Power and Computational Efficiency of Cloud Computing Racks
A noteworthy trend in data centers is to reduce the power consumption of cooling facilities by increasing the supplied temperature to IT services, thereby requiring less work within the cooling facility to provide the targeted temperature. This will result in lower overall power consumption and higher computational effectiveness. However, higher […]
High-loading Graphene Composites Enhance Thermal Conductivity
It is well known that incorporating graphene fillers to the base (matrix) of a composite thermal interface material (TIM) can improve the resulting thermal conductivity of the composite. In fact, the intrinsic thermal conductivity of large graphene layers exceeds that of the […]
Analog Devices’ µModule Regulator Eases Data Center Cooling Requirements
Figure 1 Analog Devices LTM4700 combines high power with the energy efficient performance needed to reduce data center cooling requirements. To reduce data center infrastructure cooling requirements step-down DC/DC power regulators must combine high power with energy efficient performance. To that end Analog Devices has expanded its […]
New Way to Cool Data Center Chips Uses Laser Metal Printing
Figure 1: Researchers tested their technique by printing the Binghampton Univeristy logo with a 3D metal laser printer. Traditionally, electronics are cooled using a heat sink that transfers heat into the air or a liquid coolant. For the heat sink to work, it has to be […]
WHAT’S NEW
Engineers are generally hard-nosed realists and don’t rely on the mythical kingdoms of fairy tales where only good things can happen and all problems disappear. Still, there is one magical place which is often called out when dealing with the […]
A noteworthy trend in data centers is to reduce the power consumption of cooling facilities by increasing the supplied temperature to IT services, thereby requiring less work within the cooling facility to provide the targeted temperature. This will result in lower overall power consumption and higher computational effectiveness. However, higher […]
Sponsored by CPC Introducing the liquid cooling fluid connector of the future: the PLQ2. This revolutionary new connector is made from a high performance thermoplastic that offers a host of benefits including: freedom from corrosion, compatibility with engineered cooling fluids and […]
December 18, 2018 — Laird Thermal Systems, an end-to-end thermal management solution provider, is now a fully-operational, independent business owned by Advent International. As a global organization, Laird Thermal Systems has the product portfolio, technical expertise, global manufacturing footprint and […]
It is well known that incorporating graphene fillers to the base (matrix) of a composite thermal interface material (TIM) can improve the resulting thermal conductivity of the composite. In fact, the intrinsic thermal conductivity of large graphene layers exceeds that of the […]
Figure 1 Analog Devices LTM4700 combines high power with the energy efficient performance needed to reduce data center cooling requirements. To reduce data center infrastructure cooling requirements step-down DC/DC power regulators must combine high power with energy efficient performance. To that end Analog Devices has expanded its […]
CoolIT Systems has partnered with Intel to develop Direct Liquid Cooling solutions for Intel Xeon Scalable CPUs, including the recently announced Advanced Performance processors (codename Cascade Lake) coming in the first half of 2019. Cascade Lake represents a new class of Intel Xeon Scalable processors designed for […]
Figure 1: Researchers tested their technique by printing the Binghampton Univeristy logo with a 3D metal laser printer. Traditionally, electronics are cooled using a heat sink that transfers heat into the air or a liquid coolant. For the heat sink to work, it has to be […]
Taking on the challenge of placing ever more powerful electronics into increasingly small and complex devices has meant that electronic and thermal simulation are now vital parts of the engineering design flow. But with smaller geometries and higher power densities these challenges […]
Master Bond EP17HTND-CCM is a new single component epoxy that is not premixed and frozen. It is more convenient to handle, apply and store than typical two component glob top systems. This black, heat curable compound has a flowable paste […]
