Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense
INTRODUCTION Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center cabinets have already surpassed 30 kW per cabinet (or 40.4 kW/m2) [1]. It […]
Metal Foam Heat Exchangers
Reticulated Metal Foams (RMF) are cost-effective and ultra-high-performance thermal management materials that can be integrated with electronic devices and modules. RMFs are compatible with DI water, inert fluoro-carbons, jet fuel, and inert gases. STRUCTURE OF RMF There are quite […]
Thermal Management of Outdoor Enclosures, Part 4: Passive Cooling Systems
In Part 1 (Thermal Management of Outdoor Enclosures), key aspects for successful design and development of thermal management systems were covered briefly, among these, cooling device selections and its impact on power, battery back-up and maintenance has therefore become of […]
Thermal Management of Outdoor Enclosures, Part 3: Semi-Active Cooling Systems
In Part 1 (Thermal Management of Outdoor Enclosures), key aspects for successful design and development of thermal management systems were covered briefly, among these, cooling device selections and its impact on power, battery back-up and maintenance has therefore become of […]
Thermal Management of Outdoor Enclosures, Part 2: Active Cooling Systems
In Part 1 (Thermal Management of Outdoor Enclosures), key aspects for successful design and development of thermal management systems were covered briefly, among these, cooling device selection and its impact on power, battery back-up and maintenance has therefore become of […]
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