Thermal Management of Displays/Signage in Outdoor Enclosures
Introduction/Background The pace of development in the electronics and telecommunication fields has been accelerating in all aspects of the business. For example, electronics/telecommunications equipment has traditionally been housed in large buildings, smaller buildings (sheds) and outdoor cabinets. The introduction of […]
INTERVIEW: Dr. Marta Rencz, Mentor Graphics
Dr. Marta Rencz has been nominated for a Lifetime Achievement Award by the ST35 Thermal Hall of Fame. She is a faculty member and former Head of Department at the Budapest University of Technology and Economics, and a member of […]
Special Challenges In 3D Simulations of Graphite Heat Spreaders
INTRODUCTION Graphite is a naturally occurring form of pure carbon in which the atomic bonds interlock in the layers of a two-dimensional molecular sheet. In nature, dense, rigid graphite ore is mined, purified, and processed into numerous applications, including the […]
Managing Cooling Fan Noise In Product Design
ABSTRACT Cooling fan noise is a system property determined as much by thermal and mechanical design and fan selection as by a fan’s acoustical design. While even the quietest fan can be used in a noisy manner, a significant fraction of […]
10 Must Attend Technical Sessions at SEMI-THERM 35
The 35th Semiconductor Thermal Management conference starts in a week and is being held in Silicon Valley, CA. Electronics Cooling is one of the media sponsors and will have an exhibit booth –stop by to say hello, pick up some […]
WHAT’S NEW
Introduction/Background The pace of development in the electronics and telecommunication fields has been accelerating in all aspects of the business. For example, electronics/telecommunications equipment has traditionally been housed in large buildings, smaller buildings (sheds) and outdoor cabinets. The introduction of […]
Dr. Marta Rencz has been nominated for a Lifetime Achievement Award by the ST35 Thermal Hall of Fame. She is a faculty member and former Head of Department at the Budapest University of Technology and Economics, and a member of […]
INTRODUCTION Graphite is a naturally occurring form of pure carbon in which the atomic bonds interlock in the layers of a two-dimensional molecular sheet. In nature, dense, rigid graphite ore is mined, purified, and processed into numerous applications, including the […]
ABSTRACT Cooling fan noise is a system property determined as much by thermal and mechanical design and fan selection as by a fan’s acoustical design. While even the quietest fan can be used in a noisy manner, a significant fraction of […]
The 35th Semiconductor Thermal Management conference starts in a week and is being held in Silicon Valley, CA. Electronics Cooling is one of the media sponsors and will have an exhibit booth –stop by to say hello, pick up some […]
In the 1920s, the field of physics was in disarray. The reason was that many careful observations and experimental data could only be explained by conflicting theories; for example, some proved that light was a wave, while others provided it […]
Background The cooling of electronics and telecom equipment is essential to the proper operation of all applications. Removal of generated heat from these systems has been traditionally carried out via heat conduction/convection techniques. Phase Change Materials (PCMs) are a relatively […]
Master Bond’s EP93AOFR is a two-part thermally conductive epoxy adhesive that offers superior heat dissipation for a wide range of electronic applications. It can be used in encapsulation and potting applications, as well as in bonding, sealing, and coating. According […]
Munich, February 13, 2019 — SimScale is announcing a free webinar on 19th of February to teach engineers how to ensure efficient cooling, test multiple design versions and prevent thermal damage in electronics design. CFD simulation of a water-cooled electronic […]
Laird Thermal Systems has introduced a series of thermoelectric assemblies (TEAs) designed for use in outdoor environments. The Outdoor Cooler Series are compact (cooling objects via convection) air-to-air TEAs said to provide a lower total cost of ownership by maintaining […]
