Using Wide Bandgap Materials in Power Electronics Presents a New Set of Thermal Challenges
The power electronics industry has reached the theoretical limits of silicon and now is moving to other semiconductor materials whose performance meets the requirements of today’s high power density systems. A number of techniques are being used to overcome the […]
You’re Sending That Heat “Away” to Where, Exactly?
Engineers are generally hard-nosed realists and don’t rely on the mythical kingdoms of fairy tales where only good things can happen and all problems disappear. Still, there is one magical place which is often called out when dealing with the […]
The Impact of Hybrid Cooling on the Power and Computational Efficiency of Cloud Computing Racks
A noteworthy trend in data centers is to reduce the power consumption of cooling facilities by increasing the supplied temperature to IT services, thereby requiring less work within the cooling facility to provide the targeted temperature. This will result in lower overall power consumption and higher computational effectiveness. However, higher […]
High-loading Graphene Composites Enhance Thermal Conductivity
It is well known that incorporating graphene fillers to the base (matrix) of a composite thermal interface material (TIM) can improve the resulting thermal conductivity of the composite. In fact, the intrinsic thermal conductivity of large graphene layers exceeds that of the […]
Analog Devices’ µModule Regulator Eases Data Center Cooling Requirements
Figure 1 Analog Devices LTM4700 combines high power with the energy efficient performance needed to reduce data center cooling requirements. To reduce data center infrastructure cooling requirements step-down DC/DC power regulators must combine high power with energy efficient performance. To that end Analog Devices has expanded its […]
WHAT’S NEW
Munich, February 13, 2019 — SimScale is announcing a free webinar on 19th of February to teach engineers how to ensure efficient cooling, test multiple design versions and prevent thermal damage in electronics design. CFD simulation of a water-cooled electronic […]
Laird Thermal Systems has introduced a series of thermoelectric assemblies (TEAs) designed for use in outdoor environments. The Outdoor Cooler Series are compact (cooling objects via convection) air-to-air TEAs said to provide a lower total cost of ownership by maintaining […]
The power electronics industry has reached the theoretical limits of silicon and now is moving to other semiconductor materials whose performance meets the requirements of today’s high power density systems. A number of techniques are being used to overcome the […]
Advanced Cooling Technologies, Inc. (“ACT”), a premier thermal management solutions company, announced today that it has completed the acquisition of Parker Hannifin Corporation’s Precision Cooling Business (“PCB”), a leading supplier of Pumped Two Phase Cooling products for power electronics applications. […]
Industrial air conditioner units are typically the solution for cooling sealed enclosures. What designers sometimes fail to consider, however, is that a cooler ambient environment could be used to help cool warmer electrical enclosure, particularly when there is a temperature […]
Engineers are generally hard-nosed realists and don’t rely on the mythical kingdoms of fairy tales where only good things can happen and all problems disappear. Still, there is one magical place which is often called out when dealing with the […]
A noteworthy trend in data centers is to reduce the power consumption of cooling facilities by increasing the supplied temperature to IT services, thereby requiring less work within the cooling facility to provide the targeted temperature. This will result in lower overall power consumption and higher computational effectiveness. However, higher […]
Sponsored by CPC Introducing the liquid cooling fluid connector of the future: the PLQ2. This revolutionary new connector is made from a high performance thermoplastic that offers a host of benefits including: freedom from corrosion, compatibility with engineered cooling fluids and […]
December 18, 2018 — Laird Thermal Systems, an end-to-end thermal management solution provider, is now a fully-operational, independent business owned by Advent International. As a global organization, Laird Thermal Systems has the product portfolio, technical expertise, global manufacturing footprint and […]
It is well known that incorporating graphene fillers to the base (matrix) of a composite thermal interface material (TIM) can improve the resulting thermal conductivity of the composite. In fact, the intrinsic thermal conductivity of large graphene layers exceeds that of the […]
