New Way to Cool Data Center Chips Uses Laser Metal Printing
Figure 1: Researchers tested their technique by printing the Binghampton Univeristy logo with a 3D metal laser printer. Traditionally, electronics are cooled using a heat sink that transfers heat into the air or a liquid coolant. For the heat sink to work, it has to be […]
Making Electrothermal Co-Simulation a Reality
Taking on the challenge of placing ever more powerful electronics into increasingly small and complex devices has meant that electronic and thermal simulation are now vital parts of the engineering design flow. But with smaller geometries and higher power densities these challenges […]
Balancing Local Versus Global Cooling Requirements
When you’re planning how to solve the ongoing problem of keeping things cool enough, it’s easy to mentally blur the lines between hot components and hot boxes. The difficulty is that the solution for one of these may not be adequate or appropriate for the other. Here’s the situation: in most systems, […]
How My Electronics Should Be Oriented: A Thermal Point of View Study to Understand the Impact of Orientation on Internal Air Temperature
Authored by: Tejas Manohar Kesarkar and Nitesh Kumar Sardana Abstract— Modern day electronics work in varied thermal conditions. The increase in demand of electronics has led to miniaturization, use of plastic housing, and more applications from the existing electronics in the market. The model for analysis […]
A Preview of Automotive Electronics Thermal Management: AMAA Symposium 2018
The 22nd International Forum on Advanced Microsystems for Automotive Applications (AMAA 2018) starts this week at Berlin, Germany. This international forum covering the progress in connected, automated, and electrified vehicles this year has the theme “Smart Systems for Clean, Safe […]
WHAT’S NEW
Figure 1: Researchers tested their technique by printing the Binghampton Univeristy logo with a 3D metal laser printer. Traditionally, electronics are cooled using a heat sink that transfers heat into the air or a liquid coolant. For the heat sink to work, it has to be […]
Taking on the challenge of placing ever more powerful electronics into increasingly small and complex devices has meant that electronic and thermal simulation are now vital parts of the engineering design flow. But with smaller geometries and higher power densities these challenges […]
Sponsored by CPC Introducing the liquid cooling fluid connector of the future: the PLQ2. This revolutionary new connector is made from a high performance thermoplastic that offers a host of benefits including: freedom from corrosion, compatibility with engineered cooling fluids and […]
Master Bond EP17HTND-CCM is a new single component epoxy that is not premixed and frozen. It is more convenient to handle, apply and store than typical two component glob top systems. This black, heat curable compound has a flowable paste […]
JARO’s newest addition to its AQUAS family of environmentally protective cooling fans, which target applications with harsh environmental conditions, now meets the waterproof and dustproof parameters of IP-68 water and dirt protection. IP68 means the unit can be dropped into a body of water up to […]
When you’re planning how to solve the ongoing problem of keeping things cool enough, it’s easy to mentally blur the lines between hot components and hot boxes. The difficulty is that the solution for one of these may not be adequate or appropriate for the other. Here’s the situation: in most systems, […]
Recent advancements in electric vehicle batteries now allow them to deliver more power and require less frequent charges. But as a result an increasing challenge is to design an effective cooling system that will need to be able to transfer […]
We’re hiring a talented sales professional to support Interference Technology and our other publications. Read more below! And if you’re interested, contact Graham Kilshaw at graham@item.media Title: Director of Business Development ITEM Media (Publisher of Electronics Cooling), Philadelphia region, PA Compensation […]
Hackensack NJ November 2018. – Apart from their traditional use as fastening materials, adhesives also find wide application in bonding and encapsulation in segments as diverse as military/aerospace, medical, automotive, and industrial. Adhesive systems can differ in temperature resistance, thermal cycling resistance, viscosity, flexibility, cure […]
This top-level technical and scientific event is the most important English-speaking EU annual EMC symposium and exhibition. The program may be downloaded here: https://www.emceurope2018.org/footer/final-programme-opt.pdf It travels always to a different EU country. About 50% of the submitted papers were rejected in the review process. Close to 600 international participants gathered, including 22 exhibitors. This year’s […]
