Abstract As we entered the current century, consumer electronics were primarily cooled using aluminum. Over the last 15 years, flexible graphite heat spreaders have largely replaced aluminum for thermal management in many advanced consumer electronics devices where properties of being […]

  As wireless devices increase in complexity, the challenges around maintaining temperature control continue to mount. As smartphones, for example, require more and more transistors to fit into smaller spaces, there’s simply not as much space for the heat to […]

Carteret, NJ —Tuesday, January 21, 2020— Fujipoly recently added an Engineering Resource section to its website. This technical information library gives engineers unrestricted access to useful whitepapers and webinars as well as an extensive collection of Sarcon® thermal interface material […]

Product: EP21TPHT Release Date: 01/14/2020 Master Bond EP21TPHT is a new two component epoxy polysulfide system designed for bonding applications that require toughened and thermally stable bonds resistant to chemicals. It resists temperatures up to 350°F, much higher than typical […]

Calculation Corner Bruce Guenin, Assoc. Technical Editor   Introduction These days, many thermal engineers face the challenge of defining effective heat sink cooling solutions for high power processors and ASICs (Application-Specific Integrated Circuits). The usual practice would be to calculate […]

One of the first practical lessons that electronic-circuit designer learn is to be aware of power-rail voltage drop, commonly called “IR drop,” which is the simple product of current and resistance in the printed-circuit board (PCB) track, wire, or larger […]

The first StatePoint™ Liquid Cooling system, “The World’s First Sustainable Data Center Cooling Technology,” reduces energy and water consumption in data centers. Oklahoma City, Okla., Dec. 16 , 2019 — Nortek Air Solutions (NAS), St. Louis, Mo., a leading provider […]

Integrated, fulfilled and supported by Avnet, this solution combines a GPU server with Iceotope’s innovative chassis-based, immersion cooling technology and Schneider Electric’s NetShelter liquid-cooled enclosure system. Marks a milestone in industrializing liquid-cooled server solutions that promise lower operating costs, higher […]

Product: EP29LPTCHT Release Date: 11/21/2019 Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications. It does not need excessive heat for curing and has a long working life […]

Carteret, NJ — The compression characteristics of thermal gap fillers should be key considerations during a product’s early design phase. For applications that have delicate components or widely varying gap distances, Fujipoly® created a line of Low Compression Force gap […]