Fujipoly® America announces the release of its new SARCON® SPG-70A. It is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0 W/m°K and has the lowest thermal resistance among our dispensable SPG products. When applied between […]

The Laird™ Ttape™ 1000A thermally conductive adhesive tape delivers best-in-class thermal resistance WILMINGTON, Del., June 3, 2022 – Laird Performance Materials, part of DuPont Interconnect Solutions, has capitalized on collaborative innovation with DuPont to introduce Laird™ Ttape™ 1000A thermally conductive […]

Introduction The growth of battery powered applications is presenting new challenges for designers of electronic motor-driven solutions. Targeting higher performance and efficiency, the power stages of these products must manage high currents while meeting strict power dissipation and size requirements. […]

Digital Edge to achieve Power Usage Effectiveness and Water Usage Effectiveness sustainability goals with StatePoint® Oklahoma City, (May 17, 2022)—Digital Edge (Singapore) Holdings Pte. Ltd., (“Digital Edge”), a leading Asian data center developer and operator, leverages StatePoint® liquid cooling technology […]

Company will use the investment to accelerate product development and scale up manufacturing of its Liquid Metal-based thermal interface materials (TIMs). May 17, 2022 8:00 AM Eastern Daylight Time PITTSBURGH–(BUSINESS WIRE)–Arieca Inc., the leader in liquid-metal based thermal interface materials […]

May 17, 2022 8:00 AM Eastern Daylight Time PITTSBURGH–(BUSINESS WIRE)–Arieca, a leader in liquid-metal-based Thermal Interface Materials (TIM), entered into a joint research agreement with ROHM Co., Ltd., a leading provider of power semiconductor devices for the xEV market, to […]

Power densities in electronic subsystems continue to increase, driving demand for more extreme cooling power alternatives that increasingly include liquid cooling as a viable candidate. To optimize thermal management efficiency, sustainability and reliability, designers of systems that use liquid cooling […]

The previous articles in this series [1, 2] described how the mean and standard deviations of a set of data are calculated and how they can be used to estimate the characteristics of a population using the normal distribution. Since […]

Osaka, Japan – Panasonic Corporation announced today that its Industry Company has developed MEGTRON 8[1] Multi-Layer Circuit Board Materials Featuring Low Transmission Loss [2], designed for high-speed communication networking equipment such as routers and switches. The worldwide deployment of the fifth-generation […]

Authored by Ross Wilcoxon and Genevieve Martin Associate Technical Editors for Electronics Cooling   For a number of reasons, including cost, simplicity, power consumption, noise, etc., natural convection is the preferred approach for cooling electronic systems. However, it is often […]