KEYWORDS Thermal Resistance | Thermal Interface | Semiconductor Test | Durability | Cycling | Device Under Test NOMENCLATURE DUT Device Under Test OSAT Out-Sourced Assembly and Test Rth Thermal Resistance S/TB Semiconductor Test and Burn-In TIM Thermal Interface Material ABSTRACT […]

INTRODUCTION After a couple of decades in the industry, I have observed that a number of experienced engineers can be intimidated by the topic of statistics—these columns will attempt to reduce the level of intimidation. While I have been interested […]

Introduction As power-component technology advances and smaller packaging is required, thermal-management issues threaten to limit the performance of devices. As power dissipation rises, the inability to cool them may force designers to de-rate the devices’ performance by reducing current or […]

ABSTRACT Graphite foils with ultra-high spreading capacity and insulation sheets with ultra-low thermal conductivity were combined in a thermally stressed Google Pixel 3XL (Pixel) to significantly increase steady-state system performance, while maintaining safe device touch (skin) temperatures (TS ), as […]

Introduction These columns on statistics began by describing the field of statistics as using the mathematical laws of probability to deal with data uncertainty [1]. Many statistical tools developed to apply probability do assume that data are drawn from a […]

A heat pipe is a closed system that contains a saturated fluid. When heat is dissipated in one region of the heat pipe, liquid in that area boils or evaporates, which produces vapor that moves to another area in the […]

Abstract The utility of the laser flash thermal conductivity measurement can be greatly expanded to more complex structures by modeling laser flash results using Finite Element Models. This approach is illustrated using a test fixture with 4 heat sinks, where […]

The rapid increase of device connectivity, coupled with constantly growing data transmission rates, increases the demand for new communication channels. Illumination systems employing Light Emitting Diodes (LEDs) have the potential to fulfill this demand. LEDs are versatile components that are […]

Thermal Design Power (TDP) is a term commonly used in the thermal management of consumer electronics. While the usage of this terminology may vary across the industry, it commonly refers to the amount of power that a device may dissipate […]

The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the Sheraton Hotel & Marina in San Diego, CA, May 31 – June 3, 2022. This was the 21st ITherm, which was first held […]