Three Thermal Simulation & Test Innovations for Electronics Equipment Design
Over the last 50 years, the automotive industry has been going through huge shifts in electrification (Figure 1). And, of course, we are seeing the electric motor starting to replace the mechanical engine with the advent of Electric & Hybrid […]
What is the Right Temperature Set Point for My Electrical Enclosure?
Cooling units are necessary for hot enclosures, but selecting the proper temperature set point for yours can mean the difference between failure and enhanced performance Electrical enclosures serve to protect electrical devices from adverse environmental influences, such as dirt, other […]
Towards Green Technology: Modeling of a Compact Plate Heat Exchanger Condenser for Thermosyphon Cooling of Entire High Power Datacenter Racks
By Raffaele Luca Amalfi, Ph.D., Jackson Braz Marcinichen, and John Richard Thome, Ph.D. CONTEXT AND NEW COOLING TECHNOLOGY Heat dissipations of servers and their racks in datacenters are reaching ever increasing levels, breaching the economical heat removal limits of traditional […]
Thermal Facts & Fairy Tales: Whatever Happened to the Predicted Data Center Energy Consumption Apocalypse?
As the title indicates, since the middle of the last decade, there have been very pessimistic projections regarding the growth of the total annual energy used by data centers in the U.S. One of them suggested that by 2030, the […]
Using Electrical Capacitance to Evaluate the Thermal Mechanical Stability of Thermal Interface Materials
BY: Lauren Boston, Andrew Yu, Timothy Chainer, Edward Yarmchuk, and Michael Gayness To improve cooling of electronic components, a heat spreader is typically attached to the component to spread the heat laterally and facilitate the heat removal by a heat […]
WHAT’S NEW
Smaller footprint cuts real estate and installation costs. Nortek Air Solutions has added the ADHX 35-6B, a 35kW Active Rear Door Heat Exchanger (ADHX), to its ServerCool data center liquid cooling product line. The ADHX 35-6B features upgrades in redundancy, […]
Refrigerant-free SuperCool Peltier Cooler assembly increases cooling performance in a new, smaller form factor Laird Thermal Systems has expanded its SuperCool Series product offering with the development of three high performance ultra-compact Peltier Cooler assemblies. The space-saving SuperCool Series is […]
Baltimore Aircoil Company (BAC) has introduced its HXV Hybrid Cooler, offering the best of both evaporative and dry cooling in a water saving and energy-efficient solution. The HXV is well-suited for maintaining peak performance in a variety of applications where […]
Over the last 50 years, the automotive industry has been going through huge shifts in electrification (Figure 1). And, of course, we are seeing the electric motor starting to replace the mechanical engine with the advent of Electric & Hybrid […]
To protect electronics in an industrial environment, Hammond Manufacturing has added 36 new configurations to its Industry 4.0 1554 and 1555 sealed enclosure families. Available in ABS or polycarbonate with styled, opaque, clear or smoked lids, the six new sizes […]
Cooling units are necessary for hot enclosures, but selecting the proper temperature set point for yours can mean the difference between failure and enhanced performance Electrical enclosures serve to protect electrical devices from adverse environmental influences, such as dirt, other […]
Rogers Corp. has introduced TC350 Plus laminates. TC350 Plus laminates are ceramic filled PTFE-based woven glass reinforced composite materials providing a cost effective, high performance, thermally enhanced material for the circuit designer. With a thermal conductivity of 1.24W/mK, this next generation PTFE-based […]
At the 2019 International Microwave Symposium (IMS) Element Six, part of the De Beers Group, launched a new diamond thermal material grade designated Diafilm TM220. Said to be the world’s first diamond thermal material engineered to offer industrial users thermal […]
By Raffaele Luca Amalfi, Ph.D., Jackson Braz Marcinichen, and John Richard Thome, Ph.D. CONTEXT AND NEW COOLING TECHNOLOGY Heat dissipations of servers and their racks in datacenters are reaching ever increasing levels, breaching the economical heat removal limits of traditional […]
As industry prepares for the launch of next-generation copper and optical QSFP-DD transceivers, thermal management strategies are critical. The new Molex QSFP-DD thermal solution can cool a range of 15W to 20W in different configurations with a 15 degree […]
