Statistical analysis is needed because data always have some degree of uncertainty; a value that we determine from a single measurement, or even set of measurements, is not necessarily going to tell us exactly what value we will determine […]

A little over a pandemic ago, the first article in this series on statistical analysis mentioned that a fundamental aspect of statistics is that one assumes a mathematical model that describes the distribution of a data set and then uses […]

CENTUM® C3 Chips are designed for higher performance low profile architecture of solid-state thermal management systems that is not possible with current designs January 10, 2023 AUSTIN, TX–Sheetak is expanding their flagship CENTUM® product line, based on newly patented thermoelectric […]

Written by: Mark Hepokoski, ThermoAnalytics and Alex Ockfen, Meta Reality Labs Introduction ASHRAE defines thermal comfort as “that condition of mind that expresses satisfaction with the thermal environment” [1]. While engineers and designers are typically familiar with the thermal safety […]

Written by: Sevket U. Yuruker, Raphael K. Mandel, Amir Shooshtari and Michael M. Ohadi – Department of Mechanical Engineering, University of Maryland Conventional microchannel cooling has been proven capable of removing high heat fluxes, but usually at significant pressure drops. […]

Written by: Dr. Amy Marconnet and Meghavin Bhatasana – Purdue University Although miniaturization of electronic components has helped advance computing power and accelerated technology development, it has increased power densities and exacerbated the already challenging issue of electronics cooling at […]

Since the size of electronic components keeps on decreasing, the need for improved heat dissipation on these components keeps increasing. This dichotomy presents thermal engineers with a formidable challenge: how to design smaller coolers that dissipate more heat. Adding to […]

This article reviews integration approaches and, by employing finite element analysis (FEA), compares thermal management solutions for the combined electric motor and power electronics systems for electric vehicles. Integration of power electronics into the electric motor helps achieve higher power […]

Introduction Stringent greenhouse gas-emission legislations have accelerated the electrification of ground and air transportation. Since the electric motor is one of the core components of the electric drivetrain, improving its performance is a key enabler to better performance metrics of […]

In this video demonstration, learn more about EP3HTSDA-1, a thermally conductive die attach epoxy, and see how easily it dispenses. One component Master Bond EP3HTSDA-1 is formulated primarily for die attach applications. It exhibits a die shear strength of 20-22 […]