How My Electronics Should Be Oriented: A Thermal Point of View Study to Understand the Impact of Orientation on Internal Air Temperature
Authored by: Tejas Manohar Kesarkar and Nitesh Kumar Sardana Abstract— Modern day electronics work in varied thermal conditions. The increase in demand of electronics, has led to miniaturization, use of plastic housing and more applications from the existing electronics in the market. The model for analysis […]
A Preview of Automotive Electronics Thermal Management: AMAA Symposium 2018
The 22nd International Forum on Advanced Microsystems for Automotive Applications (AMAA 2018) starts this week at Berlin, Germany. This international forum covering the progress in connected, automated, and electrified vehicles this year has the theme “Smart Systems for Clean, Safe […]
Laser Cooling Evolves to Meet Industrial and Medical Space Constraints
As lasers with higher output power are produced in smaller packages to meet space requirements, the size of external laser chillers must also be reduced, while offering improved cooling and energy efficiency. Higher laser output power in increasingly smaller packages has many […]
DCIM And Deepmind, Take 2: AI to Control Google’s Data Center Cooling
Readers of Electronics Cooling will no doubt recall our blog Of Deepmind, DCIM, and Data Center Cooling published two years ago where we highlighted some of the good design practices Google uses to improve (i.e., decrease) Power Usage Effectiveness (PUE) metric in its data centers. In that blog we cited one […]
Build Your Portfolio – Write/Edit for Electronics Cooling
Are you a seasoned thermal management veteran looking to share some tricks-of-the-trade? Do you stay up-to-date on the latest and future developments in electronics cooling? Perhaps you’re looking to add to your resume or CV? There may be an opportunity […]
WHAT’S NEW
This top-level technical and scientific event is the most important English-speaking EU annual EMC symposium and exhibition. The program may be downloaded here: https://www.emceurope2018.org/footer/final-programme-opt.pdf It travels always to a different EU country. About 50% of the submitted papers were rejected in the review process. Close to 600 international participants gathered, including 22 exhibitors. This year’s […]
Sponsored by CPC Due to the demand of liquid cooling connections in high performance computing, many engineers are now looking to find the right components that facilitate optimal cooling. The foundation begins with the combination of the right termination and connection. […]
Authored by: Tejas Manohar Kesarkar and Nitesh Kumar Sardana Abstract— Modern day electronics work in varied thermal conditions. The increase in demand of electronics, has led to miniaturization, use of plastic housing and more applications from the existing electronics in the market. The model for analysis […]
Ayer, MA, September 2018 –Creative Materials introduces GPC-251/CA-414, a room temperature curing,two-component electrically conductive epoxy adhesive for making electrical and mechanical attachments on electrical components and devices. This new product, unlike others of its kind, has excellent electrical and mechanical […]
The 22nd International Forum on Advanced Microsystems for Automotive Applications (AMAA 2018) starts this week at Berlin, Germany. This international forum covering the progress in connected, automated, and electrified vehicles this year has the theme “Smart Systems for Clean, Safe […]
As lasers with higher output power are produced in smaller packages to meet space requirements, the size of external laser chillers must also be reduced, while offering improved cooling and energy efficiency. Higher laser output power in increasingly smaller packages has many […]
Noise Suppressing Enclosure Improves User Experience with a 55% Noise Reduction August 14, 2018 – inTEST Thermal Solutions (iTS), Mansfield, MA (inTESTthermal.com)… iTS, manufacturer of the Temptronic® ThermoStream® air forcing system, has developed an enclosure that provides a 55% reduction in the noise caused by […]
Readers of Electronics Cooling will no doubt recall our blog Of Deepmind, DCIM, and Data Center Cooling published two years ago where we highlighted some of the good design practices Google uses to improve (i.e., decrease) Power Usage Effectiveness (PUE) metric in its data centers. In that blog we cited one […]
Sponsored by CPC Connectors are crucial to the safe and reliable operation of liquid cooling systems. However, considerations such as space constraints, required force-to-connect and ease of use are components that are often overlooked. We break down the characteristics and […]
Are you a seasoned thermal management veteran looking to share some tricks-of-the-trade? Do you stay up-to-date on the latest and future developments in electronics cooling? Perhaps you’re looking to add to your resume or CV? There may be an opportunity […]
