Abstract The utility of the laser flash thermal conductivity measurement can be greatly expanded to more complex structures by modeling laser flash results using Finite Element Models. This approach is illustrated using a test fixture with 4 heat sinks, where […]

The rapid increase of device connectivity, coupled with constantly growing data transmission rates, increases the demand for new communication channels. Illumination systems employing Light Emitting Diodes (LEDs) have the potential to fulfill this demand. LEDs are versatile components that are […]

Thermal Design Power (TDP) is a term commonly used in the thermal management of consumer electronics. While the usage of this terminology may vary across the industry, it commonly refers to the amount of power that a device may dissipate […]

The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the Sheraton Hotel & Marina in San Diego, CA, May 31 – June 3, 2022. This was the 21st ITherm, which was first held […]

Introduction The exposed surface area of many of today’s high-powered electronic packages is no longer sufficient for the removal of the heat generated during normal operation. Heat sinks are a commonly-used, low cost means of increasing the effective surface area […]

The creation, transport and storage of digital information are growing at rates of 40% to 50% annually, with video, mobile broadband, and machine-to-machine communication being the main drivers. The implementation of 5G wireless networks is enabling this growth and heralding […]

ABSTRACT Reliability verification often requires that a specific number of components be tested to a predetermined level of testing to demonstrate that none of the samples fail. This article describes a statistical approach for justifying the use of fewer samples […]

  Statistical analysis is needed because data always have some degree of uncertainty; a value that we determine from a single measurement, or even set of measurements, is not necessarily going to tell us exactly what value we will determine […]

A little over a pandemic ago, the first article in this series on statistical analysis mentioned that a fundamental aspect of statistics is that one assumes a mathematical model that describes the distribution of a data set and then uses […]

CENTUM® C3 Chips are designed for higher performance low profile architecture of solid-state thermal management systems that is not possible with current designs January 10, 2023 AUSTIN, TX–Sheetak is expanding their flagship CENTUM® product line, based on newly patented thermoelectric […]