The selection of heat-spreader materials is an important consideration for cooling modules in handheld electronic systems. Heat spreaders are typically used in close contact with the source of heat. This can be, for example, a subcomponent, chip, or microelectronic package. The heat spreader transfers and distributes heat from the source to a heat sink through a thermal … [Read more...]
Heat-Blocking Defects Detected Acoustically
In the landing gear control module of an aircraft, a high-voltage IGBT is about to fail. In the solder bonding one chip’s ceramic base to its heat sink are three small air bubbles—voids, in the vocabulary of electronic failures. The three voids are close together, and the largest is almost directly under a hot spot on the die. Collectively the voids have diminished … [Read more...]
Headset Comfort Assessment Through Thermal Analysis and IR Imaging
Introduction Wearable technology is a growing market, projected to reach $2.78 billion in revenue by 2024 [1], and comfort is a major factor driving sales for these devices. Ergonomics and ease of use were cited as major factors in the decision to purchase a virtual reality (VR) headset in a recent consumer survey [2]. While weight and form factor are certainly ergonomic … [Read more...]
What Does the Future of Wireless Charging Technology Look Like?
By: Hrishikesh Kadam, Research Content Developer at Global Market Insights (GMI) The world is rapidly going wireless. Within a span of a few decades, phones and internet became wireless, and now charging has become wireless. Even though wireless charging is still pretty much in its early stages, the technology is anticipated to evolve dramatically over the next few … [Read more...]
Thermal Interactions between High-power Packages and Heat Sinks, Part 2
Calculation Corner Bruce Guenin, Assoc. Technical Editor Introduction These days, many thermal engineers face the challenge of defining effective heat sink cooling solutions for high power processors and ASICs (Application-Specific Integrated Circuits). The usual practice would be to calculate a value of ΘJA (junction-to-air thermal resistance) for the … [Read more...]
