Introduction The advancement of artificial intelligence (AI) has led to an accelerating development of high-performance AI chips, which are increasingly characterized by ultra-large die areas, extreme interconnect density, and high-power consumptions. Heat dissipation is a bottleneck for the next-generation high-power graphics processing unit (GPU) and necessitates advanced … [Read more...]
Thermal Design for Externally Worn Wearable Electronics
Introduction Thermal management plays a critical role in the performance, reliability, and longevity of wearable devices. Reliability must be considered even when components remain below their absolute maximum operating temperatures. This is due to increased diffusion rates, material fatigue, and electromigration effects which degrade electronics over time. Additional failure … [Read more...]
Direct Liquid Cooling for High-Compute Servers
In today's technological landscape, the demand for high performance computing continues to soar, driven by advances in artificial intelligence, data analytics, and complex simulations. As processors become more powerful, there has been a rise in the power draw of the servers. To increase the compute capability of the data centers, there is a constant push to increase the rack … [Read more...]
Simulation of Solder Fatigue Effects on Typical BGA Package due to Material and Temperature Variations – Part 2
Abstract The past two decades have seen many approaches to solder fatigue and solder joint life published. This subject has proved difficult as various failure mechanisms are proposed and examined. While these theoretical bases are discussed, it often leaves the end developer in a difficult situation as to how to apply an accurate simulation approach to fatigue failure for a … [Read more...]
Report About the THERMINIC 2024 Workshop
By Andras Poppe and Marta Rencz The 30th THERMINIC (Thermal Investigations of ICs and Systems) workshop was held on 25-27 September 2024 in Toulouse, France at the Mercure Toulouse Centre Compans. Jean-Pierre Fradin (Icam, France) and Patrick Tounsi (INSA Toulouse & LAAS – CNRS) as local organizers and co-program chairs of the 2024 THERMINIC did a great job: Over 110 … [Read more...]
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