Rotary fans have been used to cool electronic devices using forced convection applications to achieve the required heat transfer dissipation. In recent years, there has been an increasing trend to miniaturize the size and maximize the efficiency of the electronic devices which, in turn, increases heat generation. The use of rotary fan cooling conflicts with these new trends due … [Read more...]
Managing Cooling Fan Noise In Product Design
ABSTRACT Cooling fan noise is a system property determined as much by thermal and mechanical design and fan selection as by a fan’s acoustical design. While even the quietest fan can be used in a noisy manner, a significant fraction of unpleasant surprises can be avoided. NOMENCLATURE C Numerical constant D … [Read more...]
Thermal Management of Electronic Equipment using Phase Change Materials (PCMs)
Background The cooling of electronics and telecom equipment is essential to the proper operation of all applications. Removal of generated heat from these systems has been traditionally carried out via heat conduction/convection techniques. Phase Change Materials (PCMs) are a relatively new concept for the cooling of electronic systems. A PCM is used to absorb peak energy … [Read more...]
Integrated Nano-enhanced Thermal Management Techniques May Boost Photovoltaic Efficiencies
With solar energy systems growing in popularity and adoption across the globe, methods for enhancing the efficiency and power density of solar cells are a hot topic for renewable energy research labs. Essentially all photovoltaic technologies currently available suffer from reduced efficiency when operating at higher than nominal temperatures. In an attempt to reduce the … [Read more...]
Estimating Internal Air Cooling Temperature Reduction in a Closed Box Utilizing Thermoelectrically Enhanced Heat Rejection
An earlier article in this column considered the problem of cooling electronic components in a closed box [1]. In outdoor applications for example, it may be necessary to totally seal the box to prevent exposure to airborne particulates, water droplets or other sub- stances in the air that could be injurious to the electronic components. In such an application, heat picked up … [Read more...]
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