SEMICON West is where the industry goes to keep up with developments in a world that is rapidly moving BEYOND SMART — and where it goes to find the information
SEMICON West is where the industry goes to keep up with developments in a world that is rapidly moving BEYOND SMART — and where it goes to find the information and resources it needs to keep the good times rolling.
Why SEMICON West?
Three days of presentations with more than 80+ hours of technical and business programming, plus hundreds of exhibitors provide the insights, innovations, and intelligence you need to get ahead and embrace today’s disruptive landscape.
From materials, equipment, design, manufacturing, system integration, and demand channels to new verticals and adjacencies such as Flexible Hybrid Electronics, MEMS & Sensors, you’ll gain access to the best in the business and get a glimpse at what’s next. Immersive, new experiences demonstrating hot-buttons like Smart Transportation, Smart Manufacturing, MedTech, Big Data, IoT, and the cognitive technologies that are transforming the world make this year’s Expo like no other before.
Make the connection.
SEMICON West connects the entire extended electronics supply chain — in one place, at one time. It’s the premier place to re-connect with your contacts and make new ones to drive your business forward. With all-new networking events, three new “Meet the Experts” Theaters, and new immersive Smart Pavilion experiences, this year’s Expo will help you connect with more qualified customers and partners than ever before.
Who Should Attend?
Business and technology leaders, researchers, and industry analysts from across the microelectronics supply chain, including:
9 (Tuesday) 1:00 am - 11 (Thursday) 1:00 am
Moscone Center, San Francisco, CA
GE Research and IEEC-Binghamton University are proud to host our 31st Annual Electronics Packaging Symposium - Small Systems Integration. We invite you to join us for this two-day event on September 5-6,
GE Research and IEEC-Binghamton University are proud to host our 31st Annual Electronics Packaging Symposium – Small Systems Integration.
We invite you to join us for this two-day event on September 5-6, 2019 at GE Research Center in Niskayuna, NY.
This symposium brings together leaders in academia, industry, and government to discuss the current standing in the field of electronics packaging, and bring value from the varying viewpoints of each respective sector.
There are many pressing challenges that are found within this field as of today, and this symposium provides the grounds to discuss these pressing concerns in both the technical aspect, as seen in the session topics below, and larger scale aspect of market trend and future direction.
The program will also include workshops, student poster sessions, and exhibits to share and spread knowledge, and ultimately have those who attend walk away with invaluable knowledge, added value in career building opportunities, and has become an integral member in advancing the field of electronics packaging.
Session topics for 2019 :
- 2.5/3D Packaging
- 5G Needs in Packaging
- Automotive & Harsh Environments
- Flexible & Additive Electronics
- Materials for Packaging & Energy Storage
- Power Electronics
- Sensors, Embedded Electronics & IoT
- Thermal Challenges
- Wearable and Flexible Electronics for Medical Applications
We hope to see you there.
5 (Thursday) 1:00 am - 6 (Friday) 1:00 am
Niskayuna, New York
The 12th FKFS-Conference 'Progress in Vehicle Aerodynamics and Thermal Management' will take place from 1 - 2 October 2019. The FKFS-Conference is an ideal location to get latest information about new car
The 12th FKFS-Conference ‘Progress in Vehicle Aerodynamics and Thermal Management’ will take place from 1 – 2 October 2019.
The FKFS-Conference is an ideal location to get latest information about new car developments, new or improved testing techniques and new or improved calculation procedures. It is an ideal forum to meet leading experts from industry, universities and other institutions, to exchange ideas and discuss new ones. Furthermore, demonstrations will show state-of-the-art measurement technology applied live in FKFS Wind Tunnels and Laboratories.
1 (Tuesday) 1:00 am - 2 (Wednesday) 1:00 am
Thermal LIVE™ is the electronics and mechanical engineer’s free, online resource for education and networking in thermal management. Learn the latest techniques and topics directly from thermal management thought leaders
Thermal LIVE™ is the electronics and mechanical engineer’s free, online resource for education and networking in thermal management. Learn the latest techniques and topics directly from thermal management thought leaders without leaving your seat. Join us for two full days of interactive webinars, product demonstrations, whitepapers, and more. Produced by Electronics Cooling® magazine.
Available now On Demand: All Thermal LIVE 2018 Presentations!
22 (Tuesday) 10:00 am - 23 (Wednesday) 4:00 pm