It is clear by the number of component and system recalls, by many of the best companies in the world, that product reliability is not improving. To address the issue,
It is clear by the number of component and system recalls, by many of the best companies in the world, that product reliability is not improving. To address the issue, this seminar is organized by Techwatch in collaboration with prominent experts in the industry and academia.
During the two days, presentations about various aspects of reliability in system and product development will be presented and discussed. Due to its impact and scale, the subject is particularly suited for a multidisciplinary and inter-company approach. Our goal is to stimulate open discussions that might culminate in partnerships, whether or not in a European context.
9 (Thursday) 1:00 am - 10 (Friday) 1:00 am
The Student Poster and Networking Session is open to all students who have an accepted technical paper, and provides opportunities for them to present their research and interact with other
The Student Poster and Networking Session is open to all students who have an accepted technical paper, and provides opportunities for them to present their research and interact with other conference attendees from industry and academia. There will also be a networking element that allows interested students to distribute resumes and get connected to industrial representatives.
Travel Grants Students who apply will be competitively selected for travel grants. For eligibility and submission criteria please visit:
Awards Outstanding posters will be selected for awards based on technical merit, clarity and self-sufficiency of the content, novelty and originality of the work, overall impact of the poster display, and oral presentation at the poster session. The poster awards are independent of the paper awards, and the same work is eligible for winning both awards based on the specific judging criteria for each award.
- Online application form submission: Jan. 18th, 2019
- Poster presentation and travel grant notice: Feb. 22nd, 2019
- Final electronic poster deadline: Mar. 15th, 2019
- Resume submission deadline: May 3rd, 2019
We look forward to your posters!
Student Poster and Networking Session inquiries to: email@example.com
28 (Tuesday) 1:00 am - 31 (Friday) 1:00 am
The Cosmopolitan of Las Vegas
The Design Automation Conference (DAC) is recognized as the premier conference for design and automation of electronic systems. DAC offers outstanding training, education, exhibits and superb networking opportunities for designers,
The Design Automation Conference (DAC) is recognized as the premier conference for design and automation of electronic systems. DAC offers outstanding training, education, exhibits and superb networking opportunities for designers, researchers, tool developers and vendors.
Close to 300 technical presentations and sessions are selected by a committee of electronic design experts offer information on recent developments and trends, management practices and new products, methodologies and technologies.
A highlight of DAC is its exhibition and suite area with approximately 200 of the leading and emerging companies in:
- Design Services
- Electronic Design Automation (EDA)
- Embedded Systems and Software (ESS)
- Intellectual Property (IP)
- Internet of Things (IoT)
The conference is sponsored by the Association for Computing Machinery (ACM) and the Institute of Electrical and Electronics Engineers (IEEE), and is supported by ACM’s Special Interest Group on Design Automation (SIGDA).
2 (Sunday) 1:00 am - 6 (Thursday) 1:00 am
The MIXDES conference series started in Debe near Warsaw in 1994 and has been organized yearly in different Polish cities. This year we would like to invite you to Rzeszow. The
The MIXDES conference series started in Debe near Warsaw in 1994 and has been organized yearly in different Polish cities. This year we would like to invite you to Rzeszow.
The aim of the MIXDES conference is to provide an annual Central-European forum for the presentation and discussion of recent advances in design, modeling, simulation, testing and manufacturing in various areas such as micro- and nanoelectronics, semiconductors, sensors, actuators, and power devices.
The MIXDES conference papers are indexed in INSPEC and available in IEEE Xplore.
The topics of the MIXDES Conference include:
- Design of Integrated Circuits and Microsystems
Design methodologies. Digital and analog synthesis. Hardware-software codesign. Reconfigurable hardware. Hardware description languages. Intellectual property-based design. Design reuse.
- Thermal Issues in Microelectronics
Thermal and electro-thermal modeling, simulation methods and tools. Thermal mapping. Thermal protection circuits.
- Analysis and Modelling of ICs and Microsystems
Simulation methods and algorithms. Behavioral modeling with VHDL-AMS and other advanced modeling languages. Microsystems modeling. Model reduction. Parameter identification.
- Microelectronics Technology and Packaging
New microelectronic technologies. Packaging. Sensors and actuators.
- Testing and Reliability
Design for testability and manufacturability. Measurement instruments and techniques.
- Power Electronics
Design, manufacturing, and simulation of power semiconductor devices. Hybrid and monolithic Smart Power circuits. Power integration.
- Signal Processing
Digital and analog filters, telecommunication circuits. Neural networks. Artificial intelligence. Fuzzy logic. Low voltage and low power solutions.
- Embedded Systems
Design, verification, and applications.
- Medical Applications
Medical and biotechnology applications. Thermography in medicine.
27 (Thursday) 1:00 am - 29 (Saturday) 1:00 am
SEMICON West is where the industry goes to keep up with developments in a world that is rapidly moving BEYOND SMART — and where it goes to find the information
SEMICON West is where the industry goes to keep up with developments in a world that is rapidly moving BEYOND SMART — and where it goes to find the information and resources it needs to keep the good times rolling.
Why SEMICON West?
Three days of presentations with more than 80+ hours of technical and business programming, plus hundreds of exhibitors provide the insights, innovations, and intelligence you need to get ahead and embrace today’s disruptive landscape.
From materials, equipment, design, manufacturing, system integration, and demand channels to new verticals and adjacencies such as Flexible Hybrid Electronics, MEMS & Sensors, you’ll gain access to the best in the business and get a glimpse at what’s next. Immersive, new experiences demonstrating hot-buttons like Smart Transportation, Smart Manufacturing, MedTech, Big Data, IoT, and the cognitive technologies that are transforming the world make this year’s Expo like no other before.
Make the connection.
SEMICON West connects the entire extended electronics supply chain — in one place, at one time. It’s the premier place to re-connect with your contacts and make new ones to drive your business forward. With all-new networking events, three new “Meet the Experts” Theaters, and new immersive Smart Pavilion experiences, this year’s Expo will help you connect with more qualified customers and partners than ever before.
Who Should Attend?
Business and technology leaders, researchers, and industry analysts from across the microelectronics supply chain, including:
9 (Tuesday) 1:00 am - 11 (Thursday) 1:00 am
Moscone Center, San Francisco, CA
GE Research and IEEC-Binghamton University are proud to host our 31st Annual Electronics Packaging Symposium- Small Systems Integration. We invite you to join us for this two-day event on September 5-6, 2019
GE Research and IEEC-Binghamton University are proud to host our 31st Annual Electronics Packaging Symposium- Small Systems Integration.
We invite you to join us for this two-day event on September 5-6, 2019 at GE Research Center in Niskayuna, NY.
This symposium brings together leaders in academia, industry, and government to discuss the current standing in the field of electronics packaging, and bring value from the varying viewpoints of each respective sector.
There are many pressing challenges that are found within this field as of today, and this symposium provides the grounds to discuss these pressing concerns in both the technical aspect, as seen in the session topics below, and larger scale aspect of market trend and future direction.
The program will also include workshops, student poster sessions, and exhibits to share and spread knowledge, and ultimately have those who attend walk away with invaluable knowledge, added value in career building opportunities, and has become an integral member in advancing the field of electronics packaging.
Session topics for 2019 :
- 2.5/3D Packaging
- 5G Needs in Packaging
- Automotive & Harsh Environments
- Flexible & Additive Electronics
- Materials for Packaging & Energy Storage
- Power Electronics
- Sensors, Embedded Electronics & IoT
- Thermal Challenges
- Wearable and Flexible Electronics for Medical Applications
We hope to see you there.
5 (Thursday) 1:00 am - 6 (Friday) 1:00 am
Niskayuna, New York
The 12th FKFS-Conference 'Progress in Vehicle Aerodynamics and Thermal Management' will take place from 1 - 2 October 2019. The FKFS-Conference is an ideal location to get latest information about new car
The 12th FKFS-Conference ‘Progress in Vehicle Aerodynamics and Thermal Management’ will take place from 1 – 2 October 2019.
The FKFS-Conference is an ideal location to get latest information about new car developments, new or improved testing techniques and new or improved calculation procedures. It is an ideal forum to meet leading experts from industry, universities and other institutions, to exchange ideas and discuss new ones. Furthermore, demonstrations will show state-of-the-art measurement technology applied live in FKFS Wind Tunnels and Laboratories.
1 (Tuesday) 1:00 am - 2 (Wednesday) 1:00 am
Thermal Live™ is the electronics and mechanical engineer’s free, online resource for education and networking in thermal management. Learn the latest techniques and topics directly from thermal management thought leaders
Thermal Live™ is the electronics and mechanical engineer’s free, online resource for education and networking in thermal management. Learn the latest techniques and topics directly from thermal management thought leaders without leaving your seat. Join us for two full days of interactive webinars, product demonstrations, whitepapers, and more. Produced by Electronics Cooling® magazine.
Available now On Demand: All Thermal Live 2018 Presentations!
22 (Tuesday) 10:00 am - 23 (Wednesday) 4:00 pm