Events

The 30th annual Binghamton University and GE Electronics Packaging Symposium, the premier electronics manufacturing conference in the Northeast, features more than 40 invited technical presentations by academic, industry, and government leaders, influencers, and decision makers. The program includes an IEEE Electronics Packaging Society-sponsored workshop on Heterogeneous Integration, a student poster session and exhibits.

 

Session topics will include:

• 2.5/3D packaging

• 5G needs in packaging

• Automotive and harsh environments

• Bioelectronics

• Flexible and additive electronics

• Flexible electronics for medical applications

• Materials for packaging and energy storage

• MEMS

• Photonics

• Power electronics

• Sensors and embedded electronics/ IoT

• Thermal challenges

Conference sponsored by:

· Binghamton University IEEC

· GE Global Research

· IEEE Electronics Packaging Society

 

BECOME A SPONSOR OR EXHIBITOR AND CONNECT WITH INDUSTRY LEADERS

 

SPONSOR $2,500

3 Complimentary

registrations

1 (6) foot table

1 full-page color ad in

program

Company logo & name

on website & signage

 

EXHIBITOR

$1,000

1 Complimentary

registrations

1 (6) foot table

Company name on

website & signage

For more information: epsymposium.com

Market requirements for power electronics and RF power devices are driver higher power densities and the need to operate in higher temperature environments. As a result, thermal management of devices and systems is a key design and manufacturing challenge.

The aim of this workshop is to bring together the power electronics and power RF communities to discuss trends and  directions in device and systems thermal management to encourage best practice and the development of new supply chain collaborations in R&D.

Topics within scope include:

• The integration of new high performance materials into systems for thermal management and harsh environment performance.
• Active cooling and thermal management designs and configuration in power electronics and power RF systems
• Passive cooling mechanisms and designs.
• Thermal modelling and characterisation

With the start of new vehicle powertrains such as hybrid, electric, and fuel cell vehicles, all thermal management systems, including mobile air conditioning systems, require new concepts to provide passenger compartment heating and cooling, as well as heating and cooling of batteries and cooling vehicle fuel systems.

For 2018, the Thermal Management Systems Symposium will focus on the latest and most pertinent topics in the field of thermal systems technology today. This event will serve as the meeting ground for thermal systems professionals from around the globe to discuss the latest regulatory changes and their impacts on the thermal management systems industry. This symposium represents the perfect opportunity to interact and network with other industry professionals from OEMs, academia, chemical companies, regulatory bodies, and more.

The 51st International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2018 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions on:

TRACK 1: SiP/SiM (System Solutions)	TRACK 2: Wafer Level/Panel Level (Advanced RDL)	TRACK 3: High Performance / High Reliability	TRACK 4: Flip Chip/2.5D/3D/Optical (Advanced Package)	TRACK 5: Advanced Process & Materials (Enabling Technologies)
PLANNED SESSIONS: • System Design & Integration • CPI & Modeling • Embedded/High Voltage • Optical/Automotive • Wearable / Test	PLANNED SESSIONS: • Wafer-Level Fan Out • WLCSP • Advanced Fan Out • Panel-Level Fan Out • MEMS & Sensors	PLANNED SESSIONS: • High Reliability – Defense/Aero • MM Wave / High-Speed Packaging • RF/Wireless Components • High Reliability in Bio/Medical • High Reliability in Extreme Environments	PLANNED SESSIONS: • Large Body / Small Body FC • 2.5D Technologies • Optical  • BUMP & Interconnect • 3D Technologies	PLANNED SESSIONS: • Substrate Technology • Polymer Materials & Processes • Novel Materials & Processes • Advanced Wirebond • Advanced Equipment & Additive Manufacturing
TRACK 6: INTERACTIVE POSTER SESSION – “Posters & Pizza Lunch”

Industry trends towards ever increasing functionality, performance, miniaturization, and less cost result in higher heat density and corresponding higher temperatures. Unfortunately, these have a negative impact on the performance, reliability and lifetime of electronic products, and make thermal design more challenging than ever.

Two very experienced lecturers, Wendy Luiten (winner of the prestigious Harvey Rosten Award 2014) and Clemens Lasance (a.o. SEMI-THERM THERMI Award winner in 2001), teach the participants how to solve the thermal problems inherent in electronics thermal management today. Based on a combined 75-plus years of industrial thermal design experience they present a balanced mix of theory and practice.  The course focusses on recognition and prevention of thermal problems through optimal thermal design and architecture choices in all stages of the industrial product creation process – avoiding re-design, delayed time-to-market and associated costs in time and resources. On the third day, participants practice the acquired thermal know-how by solving a real life case of the current or previous participants.