Events

Key Themes of the Forum: AI-Driven Data Center and Cooling Market Dynamics, Opportunities, and Infrastructure Transformation, Scaling Liquid Cooling, Energy Efficiency, Cost Optimization, and PUE Management in High-Density Environments, Sustainable Data Center Development in Europe: Heat Reuse, Water Efficiency (WUE), and Decarbonization Policies.

Every two years, the world of electronics meets at electronica in Munich, Germany. As the world’s leading trade fair, it showcases the full range of technologies, products, and solutions that are empowering an All Electric Society (AES).

APEC 2027 meets in New Orleans. The Applied Power Electronics Conference covers power conversion hardware, including the thermal design of supplies, magnetics, and components.

The 43rd SEMI-THERM symposium meets in San Jose. Sessions cover thermal measurement, modeling, and management of electronic components and systems.

The 20th European workshop on micropackaging and thermal management meets in La Rochelle. Sessions cover cooling solutions, heat-conductive materials, heat sinks, heat pipes, and liquid cooling.

The 28th EuroSimE conference meets in Regensburg. The program covers thermal, mechanical, and multiphysics simulation and experiments for microelectronics and microsystems.

PCIM Expo & Conference returns to Nuremberg. The 2027 program includes power semiconductors, passive components, and heat management.

IEEE ITherm 2027 meets in Denver alongside the Electronic Components and Technology Conference. The program covers thermal and thermomechanical behavior of electronic devices, packages, and systems.

IEEE ITherm 2027 meets in Denver alongside the Electronic Components and Technology Conference. The program covers thermal and thermomechanical behavior of electronic devices, packages, and systems.

The ASME Summer Heat Transfer Conference meets in Orlando. Tracks include heat transfer in electronic equipment and data-center thermal management.

The ASME Summer Heat Transfer Conference meets in Orlando. Tracks include heat transfer in electronic equipment and data-center thermal management.

The OCP Global Summit meets at the Moscone Center in San Francisco. The program covers data-center design, including power delivery and cooling for AI infrastructure.