september
05sepAll Day0631st Annual Electronics Packaging Symposium
Event Details
GE Research and IEEC-Binghamton University are proud to host our 31st Annual Electronics Packaging Symposium - Small Systems Integration.We invite you to join us for this two-day event on September 5-6,
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Event Details
GE Research and IEEC-Binghamton University are proud to host our 31st Annual Electronics Packaging Symposium – Small Systems Integration.
We invite you to join us for this two-day event on September 5-6, 2019 at GE Research Center in Niskayuna, NY.
This symposium brings together leaders in academia, industry, and government to discuss the current standing in the field of electronics packaging, and bring value from the varying viewpoints of each respective sector.
There are many pressing challenges that are found within this field as of today, and this symposium provides the grounds to discuss these pressing concerns in both the technical aspect, as seen in the session topics below, and larger scale aspect of market trend and future direction.
The program will also include workshops, student poster sessions, and exhibits to share and spread knowledge, and ultimately have those who attend walk away with invaluable knowledge, added value in career building opportunities, and has become an integral member in advancing the field of electronics packaging.
Session topics for 2019 :
- 2.5/3D Packaging
- 5G Needs in Packaging
- Automotive & Harsh Environments
- Bioelectronics
- Flexible & Additive Electronics
- Materials for Packaging & Energy Storage
- MEMS
- Photonics
- Power Electronics
- Sensors, Embedded Electronics & IoT
- Thermal Challenges
- Wearable and Flexible Electronics for Medical Applications
We hope to see you there.
Time
september 5 (Thursday) - 6 (Friday)
Location
GE Research Center
1 Research Circle, Niskayuna, New York 12309
october
01octAll Day0212th FKFS-Conference: 'Progress in Vehicle Aerodynamics and Thermal Management'
Event Details
The 12th FKFS-Conference 'Progress in Vehicle Aerodynamics and Thermal Management' will take place from 1 - 2 October 2019. The FKFS-Conference is an ideal location to get latest information about new car
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Event Details
The 12th FKFS-Conference ‘Progress in Vehicle Aerodynamics and Thermal Management’ will take place from 1 – 2 October 2019.
The FKFS-Conference is an ideal location to get latest information about new car developments, new or improved testing techniques and new or improved calculation procedures. It is an ideal forum to meet leading experts from industry, universities and other institutions, to exchange ideas and discuss new ones. Furthermore, demonstrations will show state-of-the-art measurement technology applied live in FKFS Wind Tunnels and Laboratories.
Time
october 1 (Tuesday) - 2 (Wednesday)
Location
Haus der Wirtschaft
Willi-Bleicher-Straße 19, 70174 Stuttgart, DE
Organizer
FKFS
22octAll Day24MWC Los Angeles 2019
Event Details
INTELLIGENT CONNECTIVITYWelcome to the era of Intelligent Connectivity – where speed, convenience, and intelligence converge; inspiring new technologies that keep us connected to everything and everyone, while delivering highly contextualized
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Event Details
INTELLIGENT CONNECTIVITY
Welcome to the era of Intelligent Connectivity – where speed, convenience, and intelligence converge; inspiring new technologies that keep us connected to everything and everyone, while delivering highly contextualized and personalized experiences, when and where you want them.
5G deployments in North America are empowering advances in IoT, AI, Immersive Content and Disruptive Innovation. MWC Los Angeles 2019 will bring tech industry influencers together to explore this transformation and discover how they can harness it to impact their success.
Join us, October 22-24, 2019 to explore how Intelligent Connectivity will shape the future of our industry, our businesses, and our world.
Time
october 22 (Tuesday) - 24 (Thursday) PST
Location
Los Angeles Convention Center
1201 S Figueroa St, Los Angeles, CA 90015
Organizer
GSMA
22oct(oct 22)10:00 am23(oct 23)4:00 pmThermal LIVE 2019
Event Details
Thermal LIVE™ is the electronics and mechanical engineer’s free, online resource for education and networking in thermal management. Learn the latest techniques and topics directly from thermal management thought leaders
Event Details
Thermal LIVE™ is the electronics and mechanical engineer’s free, online resource for education and networking in thermal management. Learn the latest techniques and topics directly from thermal management thought leaders without leaving your seat. Join us for two full days of interactive webinars, product demonstrations, whitepapers, and more. Produced by Electronics Cooling® magazine.
Available now On Demand: All Thermal LIVE 2018 Presentations!
Time
22 (Tuesday) 10:00 am - 23 (Wednesday) 4:00 pm
Location
Online Webinar
thermal.live
Organizer
Electronics Cooling
may
26mayAll Day29IEEE ITherm Conference
Event Details
Sponsored by the IEEE's Electronics Packaging Society (EPS), ITherm 2020 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices,
Event Details
Sponsored by the IEEE’s Electronics Packaging Society (EPS), ITherm 2020 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. The first ITherm Conference was held in 1988, making this the 31st year of the Conference Series.
Time
may 26 (Tuesday) - 29 (Friday) PST
Location
Walt Disney World Swan and Dolphin Hotel
1500 Epcot Resorts Boulevard P.O. Box 22653 Lake Buena Vista, FL 32830
Organizer
IEEE
