By: Aaditya A. Candadai, Aalok Gaitonde, Shanmukhi Sripada, Justin A. Weibel, Amy M. Marconnet Introduction New high thermal conductivity materials have been developed to enable enhanced heat transport within electronics packages and other thermal management applications. Many of these engineered materials have anisotropic thermal properties inherent to their fabrication, … [Read more...]
Simulation of Solder Fatigue Effects on Typical BGA Package due to Material and Temperature Variations – Part 2
Abstract The past two decades have seen many approaches to solder fatigue and solder joint life published. This subject has proved difficult as various failure mechanisms are proposed and examined. While these theoretical bases are discussed, it often leaves the end developer in a difficult situation as to how to apply an accurate simulation approach to fatigue failure for a … [Read more...]
Augmenting Development of Electronics Cooling Technologies with Machine Learning Tools – a Heat Pipe System Example
The traditional pathway for development of thermal management technologies for electronics has been to analyze using heat transfer theory augmented by computational tools such as finite difference or finite element methods, CFD tools, or thermal management system simulation tools, sometimes in tandem with prototype system fabrication and testing. Combining recently available … [Read more...]
Simulation of Solder Fatigue Effects on Typical BGA Package due to Material and Temperature Variations – Part 1
Abstract The past two decades have seen many approaches to solder fatigue and solder joint life published. This subject has proved difficult as various failure mechanisms are proposed and examined. While these theoretical bases are discussed, it often leaves the end developer in a difficult situation as to how to apply an accurate simulation approach to fatigue failure for a … [Read more...]
Theta-JC Measurements: Steady-State Compared to Transient Methods
Thermal characterization plays a vital role in electronic package reliability testing, design, and verification of manufacturing processes. The reliability of electronic packages is controlled, in part, by ensuring the maximum junction temperature is not exceeded during operation. Systems such as cell phones, electric vehicles and computers, must operate with die temperatures … [Read more...]
- 1
- 2
- 3
- …
- 28
- Next Page »
