Thermal management has become one of the defining challenges in modern electronics design. Across data centers, AI and machine learning hardware, power electronics, and compact consumer devices, heat generation continues to rise as performance expectations increase. Higher power densities, faster processing speeds, and smaller form factors are placing sustained pressure on … [Read more...]
High-Performance Copper Tungsten Cold Plates for Direct-to-Chip Single-Phase Liquid Cooling
In April 2025, Google announced its 1 MW 42U rack [1], marking a turning point in data center thermal management where traditional air cooling can no longer support the extreme power densities of modern hardware. As chip thermal design power (TDP) continues to grow, data centers must replace air-cooled heat sinks with liquid-cooled cold plates [2]. Cold plates transfer heat … [Read more...]
Siemens Expands Data Center Partner Ecosystem to Scale Next-Generation AI Infrastructure
Strategic investment in Emerald AI bridges gap between AI compute demand and grid constraints through IT/OT convergence Fluence Energy Inc. (Fluence) energy storage solutions are designed to accelerate grid connection and enable faster data center deployment PhysicsX collaboration introduces AI-accelerated modeling for data center power infrastructure, enabling faster … [Read more...]
Signal SHFWT Series Delivers Superior Efficiency, Thermal Performance and Low EMI noise in High-Frequency Toroidal Inductor
Signal has announced the introduction of its SHFWT Series Helical Wound Flat Wire Toroidal Inductors, broadening the Signal portfolio with a high-performance solution for demanding electronic designs. The SHFWT Series strengthens Signal’s lineup of chokes, coils, and inductors, responding to increasing demand for efficient, low-loss, high-frequency power components. The low … [Read more...]
JetCool Collaborates with Broadcom to Deliver Innovative Liquid Cooling for Next-Generation AI XPUs
JetCool, a Flex company and a leading provider of end-to-end liquid cooling solutions for high-density compute, today announced it has collaborated with Broadcom to deliver liquid cooling for next-generation AI XPUs, backed by Flex's global mass production capabilities. As AI training and inference workloads accelerate, silicon power densities are advancing into sustained … [Read more...]
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