In today's technological landscape, the demand for high performance computing continues to soar, driven by advances in artificial intelligence, data analytics, and complex simulations. As processors become more powerful, there has been a rise in the power draw of the servers. To increase the compute capability of the data centers, there is a constant push to increase the rack … [Read more...]
Summary of SEMI-THERM 41 Conference
By Navid Kazem, Lieven Vervecken, and Claire Wemp The SEMI-THERM 41 Symposium was held March 10-13, 2025 at the Double Tree Hotel in San Jose, CA. Program organization was led by General Chair Lieven Vervecken (Diabatix), Program Chair Dr. Navid Kazem (Arieca), and Program Vice Chair Dr. Claire Wemp (DuPont). It featured a variety of activities including technical short … [Read more...]
Alloy Enterprises Unveils Copper Direct Liquid Cooling, Slashing AI Data Center Energy Use and Eliminating the Need for HVAC
Alloy Enterprises, a manufacturing company revolutionizing data center cooling with its novel Stack Forging™ process, today introduced a new copper direct liquid cooling (DLC) solution. As chip power densities and thermal design power rise—pushing AI server rack power densities beyond 120 kW—traditional cooling methods are reaching their limits. With Stack Forging, Alloy … [Read more...]
Data Centre Solutions Division From LFB Group Launches Lennox Branded Fan Wall
Adding to its innovative ‘ApX Series’ range of cooling infrastructure for hyperscale and edge data centres, LFB Group has launched its brand new Fan Wall Unit (FWU) - a high-performance, modular solution built to meet the fast-evolving demands of modern computing environments. LFB Group, following its transition from Lennox EMEA in April 2025, brings over sixty years of … [Read more...]
Solving the Heat Dilemma for Optical Transceivers: What’s Next for TIMs?
TIMs are vital in optimizing the performance, reliability, and longevity of optical components, such as silicon photonics transceivers in data centers. At Thermal Live Spring 2025, Henkel provided valuable insights into the growing computational demands in data centers and the associated thermal stress risks, highlighting how their thermal interface materials are addressing … [Read more...]
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