The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the JW Marriott Grande Lakes, Orlando, FL, May 26–29, 2026. This was the 25th ITherm, which was first held in 1988. The conference was historically held every other year until 2016 when it switched to an annual schedule, so ITherm 2026 marked the series’ 25th … [Read more...]
Coolant Health as a Reliability Variable in Direct-to-Chip Data Center Cooling
As direct-to-chip liquid cooling moves from pilot projects to larger AI and high-performance computing deployments, maintaining coolant health is becoming an increasingly important part of the thermal reliability equation. Beyond selecting a fluid with the right thermal properties, engineering teams must consider coolant chemistry, system commissioning, sampling and testing, … [Read more...]
Why High-Density Racks Need Liquid-Cooled Busbars
The rapid rise of AI accelerators and high-performance computing has pushed rack power densities to unprecedented levels. While direct-to-chip liquid cooling successfully manages heat at the processor, the power delivery path itself has emerged as the next critical thermal bottleneck. Recently, Electronics Cooling sat down with Vic Geevarghese, Director of Operations of … [Read more...]
Stream Data Center Cooling Days 2026
The Full Data Center Cooling Days 2026 Program is Available to Stream Over the past two weeks, engineers from across data center thermal management came together to share practical engineering presentations on liquid cooling, AI infrastructure, coolant management, thermal testing, and more. If you couldn't attend live or missed one of the sessions, you can watch the free … [Read more...]
Designing an Effective Thermal Path in High-Power Electronic Systems
ABSTRACT Power densities continue to increase in AI servers, high-performance computing (HPC) systems, electric vehicles, and semiconductor manufacturing equipment. As a result, thermal management has become a critical system-design requirement. Thermal solutions often fall short not because one material lacks performance, but because the complete … [Read more...]
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