High-density AI racks no longer fail one signal at a time. Workload, flow, pressure, coolant chemistry, and facility heat rejection now move together. Thermal engineers need an orchestration layer that connects those signals to the heat-transfer and hydraulic models behind the cooling design. The Failure Pattern A modern AI rack does not fail like a light switch. It starts … [Read more...]
Register Now: Thermal Live Fall, October 14-15
Save your spot for Thermal Live Fall 2026, live October 14–15. Electronics Cooling’s flagship virtual event returns for two days of technical presentations and product demonstrations focused on the thermal management challenges engineers are facing today. Register for Thermal Live Fall 2026 Thermal Live brings together engineers, designers, and industry experts to … [Read more...]
Celebrating ITherm’s 25th Conference: A Summary of the 2026 Meeting
The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the JW Marriott Grande Lakes, Orlando, FL, May 26–29, 2026. This was the 25th ITherm, which was first held in 1988. The conference was historically held every other year until 2016 when it switched to an annual schedule, so ITherm 2026 marked the series’ 25th … [Read more...]
Coolant Health as a Reliability Variable in Direct-to-Chip Data Center Cooling
As direct-to-chip liquid cooling moves from pilot projects to larger AI and high-performance computing deployments, maintaining coolant health is becoming an increasingly important part of the thermal reliability equation. Beyond selecting a fluid with the right thermal properties, engineering teams must consider coolant chemistry, system commissioning, sampling and testing, … [Read more...]
Use of Heat Transfer Coefficient and Pressure Drop Correlations for Liquid Cooling of Electronics
Introduction As single-component heat dissipations in electronics cooling are increasing, air cooling is not always up to the task and is being replaced by liquid cooling. Key differences between air cooling and liquid cooling are a much higher heat transfer coefficient, higher pressure drop and much lower fluid heating. This article investigates the use of correlations to … [Read more...]
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