Master Bond EP21TP-2NV is a two-part epoxy polysulfide formulated for use as an adhesive, sealant and potting system. It withstands prolonged exposure to many harsh chemicals including fuels, oils, hydrocarbons and hydraulic fluids. It is also fully RoHS compliant, meeting RoHS3 Directive (EU) 2015/863.EP21TP-2NV offers an elongation between 40-80% at room temperature and … [Read more...]
3D Printing Allows for Complex, High Surface Area Geometries Optimized for Convection Cooling
3D printing is growing rapidly and has shown the potential to disrupt the manufacturing industry. Like many emerging technologies, initial adoption is being driven by the highest value markets including biomedical and aerospace, where 3D printing for end use parts is now being implemented at commercial scale. Moreover, as 3D printer costs fall and capabilities continue to … [Read more...]
Pfannenberg Filter Mats Extend Service Life 300%
Fluted Filter Mats Reduce Maintenance in High Airflow Electrical Enclosure CoolingPfannenberg, a leading global manufacturer of thermal management technologies, has re-engineered the filter mat for its 4th generation Filterfans for electrical enclosures. Filterfans 4.0 spin optimized fins and rotor blades to maximize airflow with minimal energy consumption and employ … [Read more...]
TC350 Plus Laminates for Higher Microwave & Industrial Heating Applications
Rogers Corp. has introduced TC350 Plus laminates. TC350 Plus laminates are ceramic filled PTFE-based woven glass reinforced composite materials providing a cost effective, high performance, thermally enhanced material for the circuit designer. With a thermal conductivity of 1.24W/mK, this next generation PTFE-based laminate is ideally suited for higher power microwave and … [Read more...]
Thermal Gap Filler Reduces Stress on Sensitive Components
Laird Performance Materials has introduced the Tflex HD80000, a high deflection thermal gap filler combining 6 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination allows minimal stress on sensitive components within a device while also yielding low thermal resistance. As a result, less mechanical and thermal stresses are … [Read more...]
