The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the JW Marriott Grande Lakes, Orlando, FL, May 26–29, 2026. This was the 25th ITherm, which was first held in 1988. The conference was historically held every other year until 2016 when it switched to an annual schedule, so ITherm 2026 marked the series’ 25th … [Read more...]
Optimizing Thermal Management: A Material Evaluation Success Story in Vietnam
Evaluating thermal management materials for modern electronic applications goes far beyond picking a product from a catalog. Recently, an electronics manufacturer operating in Vietnam engaged T-Global to navigate the entire evaluation process for a new device. The company needed support in identifying a suitable solution based on strict application specifications. Modern … [Read more...]
Electronics Manufacturer Improves Thermal Management Supply Stability Through Localized Support
As electronics manufacturing continues to expand across Vietnam and Southeast Asia, regional production teams are placing greater demands on suppliers to respond quickly, support customization, and maintain reliable delivery from development through mass production. For one electronics manufacturing customer operating in the region, thermal management support had become a … [Read more...]
Stream Data Center Cooling Days 2026
The Full Data Center Cooling Days 2026 Program is Available to Stream Over the past two weeks, engineers from across data center thermal management came together to share practical engineering presentations on liquid cooling, AI infrastructure, coolant management, thermal testing, and more. If you couldn't attend live or missed one of the sessions, you can watch the free … [Read more...]
Designing an Effective Thermal Path in High-Power Electronic Systems
ABSTRACT Power densities continue to increase in AI servers, high-performance computing (HPC) systems, electric vehicles, and semiconductor manufacturing equipment. As a result, thermal management has become a critical system-design requirement. Thermal solutions often fall short not because one material lacks performance, but because the complete … [Read more...]
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