In this video demonstration, learn more about EP3HTSDA-1, a thermally conductive die attach epoxy, and see how easily it dispenses. One component Master Bond EP3HTSDA-1 is formulated primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f and has a high thermal conductivity of 40-45 BTU•in/ft2•hr•°F [5.7-6.5 W/(m•K)]. “This 100% solids … [Read more...]
Future Trends in LED Driver System Modeling
Introduction A decade ago, the major players in the lighting industry decided to make the transition to digital systems and set the pace in connected lighting. At present, only a few companies can maintain their leadership. As a self-fulfilling prophecy, the lighting landscape changed remarkably, with scattered competitors having access to internet of things (IoT) ecosystems … [Read more...]
Upper Air Room Disinfection with UV-C Luminaire – Metrics and Multi-Domain Modeling Approach
In my previous article, I questioned how our simulation community of experts can contribute in this pandemic time? I am coming back to present examples of contributions. While the general topic of this article is outside the typical scope of Electronics Cooling Magazine, it does illustrate how analysis methods that are discussed here, such as computational fluid dynamics, and … [Read more...]
Emerging 5G Networks: Potential Economic Benefits of Two-Phase Thermal Management
The fourth and future industrial revolutions will set new requirements for smart cities / factories, autonomous vehicles, augmented reality, smartphones, etc., resulting in more distributed architectures, expanding the convergence of new technologies and developments thus, transforming the term Internet of Things (IoT) to Internet of Everything (IoE). Centralized cloud … [Read more...]
Thermal Quality Assessment of Semiconductor Components
Introduction Reduction in early life failures and continuous quality improvements are “table stakes” for semiconductor manufacturers servicing the automotive industry. “Industry analysts expect that the automotive semiconductor market will be the fastest growing end use market for chips from 2017–21, with a 6.4 percent CAGR and a total market value of between $39-42 billion … [Read more...]
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