ABSTRACT Power densities continue to increase in AI servers, high-performance computing (HPC) systems, electric vehicles, and semiconductor manufacturing equipment. As a result, thermal management has become a critical system-design requirement. Thermal solutions often fall short not because one material lacks performance, but because the complete … [Read more...]
Save Your Seat for Thermal Live Spring 2026, May 19
Registration is open for Thermal Live Spring 2026 Join Electronics Cooling on May 19 for a day of technical sessions and product demos focused on real-world thermal challenges. Register Now Thermal Live Spring 2026 brings together hundreds of engineers and technology leaders to share practical insight into the latest advances in cooling, materials, and system … [Read more...]
Silicone-Free Thermal Gap Pads for Optical and Datacom Systems
Editorial Note The following transcript is adapted from a presentation delivered by Henkel at Thermal Live Fall 2025. It is shared here to provide readers with access to the technical discussion in written form. For the complete presentation experience, including slides and audience Q&A, the full session is available to watch on demand. Introduction In this … [Read more...]
Spacecraft Thermal Control in Extreme Environments: Surviving Lunar Night and Martian Dust
Abstract Extreme conditions in interplanetary environments, like lunar night at -173°C and Martian dust storms, require new thermal control systems that go beyond traditional electronics cooling approaches. Martian dust consists primarily of iron-oxide and silicate particles with diameters ranging from 1 to 3 μm. These particles are electrostatically adhesive, capable of … [Read more...]
Rethinking Thermal Design Priorities in Electronics Packaging
Steady state operating temperature is a critical design parameter for ensuring the reliable operation of modern electronics systems. However, in practice it is but one of many factors that impact overall system health and performance. Modern challenges, like the large transient power draw associated with artificial intelligence (AI) workloads create the potential for more … [Read more...]
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