Registration is open for Thermal Live Spring 2026 Join Electronics Cooling on May 19 for a day of technical sessions and product demos focused on real-world thermal challenges. Register Now Thermal Live Spring 2026 brings together hundreds of engineers and technology leaders to share practical insight into the latest advances in cooling, materials, and system … [Read more...]
Alternative Battery Module Configuration for Fast Thermal Runaway Detection with a Reduced Number of Temperature Sensors
Abstract With increasingly strict regulations on lithium-ion battery (LIB) thermal runaway (TR) and safety, rapid detection has become essential to ensure passengers can evacuate safely in electric vehicles (EVs). Early TR detection requires temperature sensors to monitor battery behavior. Incorporating many sensors increases both cost and system complexity, so commercial … [Read more...]
Benefits of Boron Nitride Thermal Pads
Thermal interface materials (TIMs) must reduce interfacial thermal resistance while withstanding stresses such as vibration and humidity. Traditional TIMs cannot meet this requirement. Thermal paste, for example, performs well with micron-level surface matching and precise clamping, but is prone to contamination and increases the difficulty of automated assembly. Ordinary … [Read more...]
The Physics of Cooling in Confined Spaces: Advanced Driver Assistance Systems (ADAS) Automotive Electronics
Introduction The evolution of modern automotive engineering is defined by a single, escalating conflict: the demand for massive computing power versus the shrinking physical space available to house it. As vehicles transition from mechanical machines to "computers on wheels," the thermal management of Advanced Driver Assistance Systems (ADAS) has moved from a secondary … [Read more...]
Highlights From the 19th ASME InterPACK Conference
The 2025 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2025) was held from October 28–30, 2025, at the Hotel Fera Anaheim, a DoubleTree by Hilton, in Anaheim, California. Hosted by the ASME Electronic and Photonic Packaging Division (EPPD), the conference served as a premier forum for advancing … [Read more...]
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