As electronic applications become more sophisticated and higher performing, the need for thermal performance that can keep pace is increasing. Parker is excited to continue pushing the bar and helping their customers accelerate innovation with THERM-A-GAP GEL 120 which offers a game-changing thermal conductivity of 12.0 W/m-K. THERM-A-GAP GEL 120 is a one-component, … [Read more...]
Sheetak Solves Micro-Scale Hotspots with New µCENTUM™ Thermoelectric Coolers
High-power cooling in a sub-1.6mm profile provides critical thermal stability for high-density electronics. AUSTIN, TX - To solve the growing challenge of localized hotspots in high-density electronics, Sheetak Inc. has launched its µCENTUM™ series of micro-thermoelectric coolers (TECs). These compact solid-state devices deliver powerful, component-level cooling to uphold … [Read more...]
Sheetak Expands Thermoelectric Offering with New TEG Solutions for Energy Harvesting Applications
Solid-state power generation modules enable reliable, compact energy sources for remote and rugged environments. AUSTIN, TX – Sheetak Inc., a U.S.-based leader in thermoelectric innovation, is expanding its product line with a new range of thermoelectric generators (TEGs), offering reliable, solid-state energy harvesting for applications where conventional power sources fall … [Read more...]
Direct-Die Liquid Cooling: A Scalable Approach for Power Module Thermal Integration
Abstract This paper presents a novel thermal management approach for power semiconductor modules by integrating active liquid cooling directly into the substrate. Utilizing Direct Bond Copper (DBC) structures embedded within liquid cold plates, the method minimizes thermal interfaces, improves power density, and ensures better reliability. It contrasts traditional … [Read more...]
IEEE ITherm 2025 Conference Highlights
The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the Gaylord Texan Resort and Convention Center, Dallas, TX, May 27 – 30, 2025. This was the 24th ITherm Conference. ITherm Conference series began in 1988 as a companion conference to the broader IEEE Electronic Packaging Society’s (at that time CHMT, later … [Read more...]
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