As the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD), InterPACK brings together the full systems ecosystem — from advanced materials and thermal management to next‑generation computing
Event Details
As the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD), InterPACK brings together the full systems ecosystem — from advanced materials and thermal management to next‑generation computing architectures and intelligent, connected devices.
Time
October 26, 2026 - October 29, 2026 (All Day)(GMT+00:00)
