Author’s note: This article was initially published in a compilation of some of the articles published in the Electronics Cooling Magazine ‘Statistics Corner’ [4]. However, it was never published as part of a standard ECM issue. Therefore, it seemed appropriate to reintroduce it to the readers to this series on statistical analysis methods. Abstract Reliability … [Read more...]
Performing a Transient Thermal Characterization of Hardware with a Finite Difference Model
Introduction A transient thermal characterization, also known as a thermal survey, aims to characterize the location of greatest thermal inertia within a hardware system—that is, the location with the slowest temperature response to a given environmental stimulus. This manuscript outlines a methodology for developing a finite difference numerical model of a three-resistor, … [Read more...]
Summary of SEMI-THERM 41 Conference
By Navid Kazem, Lieven Vervecken, and Claire Wemp The SEMI-THERM 41 Symposium was held March 10-13, 2025 at the Double Tree Hotel in San Jose, CA. Program organization was led by General Chair Lieven Vervecken (Diabatix), Program Chair Dr. Navid Kazem (Arieca), and Program Vice Chair Dr. Claire Wemp (DuPont). It featured a variety of activities including technical short … [Read more...]
A New Method to Measure Thermal Conductivity
Conventional steady-state thermometry techniques require hours to reach a steady-state temperature rise — but a new method using laser heating takes only seconds. At Thermal Live Spring 2025, presenters from Laser Thermal demonstrated a Thermo-Optical Plane Source (TOPS) technique that offers unmatched speed and flexibility. Designed for high-throughput testing across a wide … [Read more...]
Measuring the Thermal Conductivity of Anisotropic Heat Spreading Materials
By: Aaditya A. Candadai, Aalok Gaitonde, Shanmukhi Sripada, Justin A. Weibel, Amy M. Marconnet Introduction New high thermal conductivity materials have been developed to enable enhanced heat transport within electronics packages and other thermal management applications. Many of these engineered materials have anisotropic thermal properties inherent to their fabrication, … [Read more...]
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