Steady state operating temperature is a critical design parameter for ensuring the reliable operation of modern electronics systems. However, in practice it is but one of many factors that impact overall system health and performance. Modern challenges, like the large transient power draw associated with artificial intelligence (AI) workloads create the potential for more … [Read more...]
Statistics Corner: A Failure to Fail
Component reliability testing can lead to an inherent disagreement in what different people hope to see from the results. Designers who want to use the components hope that no components fail during qualification testing to verify that they meet the reliability requirement. In contrast, analysts who characterize the reliability of the components need a sufficient number of … [Read more...]
Engineering Leak-Free Performance for Mission-Critical Electronics
Chips are getting hotter, and liquid cooling is moving from niche to necessary. That transition changes what “good” looks like for fluid connections. Quick disconnect couplings have long lived in industrial settings, where design tolerances, qualification habits, and manufacturing controls matched those use cases. Data center liquid cooling—along with aerospace/defense and … [Read more...]
Statistics Corner: Modifying Sample Size
Author’s note: This article was initially published in a compilation of some of the articles published in the Electronics Cooling Magazine ‘Statistics Corner’ [4]. However, it was never published as part of a standard ECM issue. Therefore, it seemed appropriate to reintroduce it to the readers to this series on statistical analysis methods. Abstract Reliability … [Read more...]
Performing a Transient Thermal Characterization of Hardware with a Finite Difference Model
Introduction A transient thermal characterization, also known as a thermal survey, aims to characterize the location of greatest thermal inertia within a hardware system—that is, the location with the slowest temperature response to a given environmental stimulus. This manuscript outlines a methodology for developing a finite difference numerical model of a three-resistor, … [Read more...]
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