IP69K rated fans lower the total cost of ownership by reducing maintenance requirements and equipment downtime... DALLAS, TX (February 09, 2021) - Orion Fans has expanded its IP69K rated fans to include both AC and DC versions. Designed for applications that must withstand high temperature and high pressure washdown with water and cleaning chemicals, the IP69K rating offers … [Read more...]
NOW AVAILABLE: R-TOOLS MAXX, THE NEXT GENERATION HEAT SINK CALCULATOR
Free to use, easy to register, available 24/7! Newburyport, MA. January 18, 2021 – Mersen is pleased to announce the availability of R-TOOLS MAXX, Mersen’s next generation heat sink calculator. R-TOOLS MAXX is a no charge, on-line simulation software that allows users to model the optimum air-cooled heat sink solution tailored to their project requirements. It is completely … [Read more...]
Spring Pin Socket for ASE’s SIP LGA
Socket your LGA297 using Extreme Temperature Socket with Superior Electrical Performance January, 2021 Ironwood Electronics recently introduced a new LGA socket addressing high-performance requirements for 0.5mm pitch LGA297 – CBT-LGA-5029. The contactor is a stamped spring pin with 31 gram actuation force per pin and cycle life of 125,000 insertions. The self-inductance … [Read more...]
CoolIT Systems Continued Leadership in Advanced Data Center Cooling Showcased at SC20
CoolIT launches several new products to further support data center leaders Calgary, Alberta. November 18th, 2020 – CoolIT Systems, the global leader in scalable direct liquid cooling technology (DLC) for desktop and data center systems, announces multiple new product developments and launches at Supercomputing 2020. As the leading liquid cooling integration partner for … [Read more...]
Precision-Clad Composite Materials for Heat Spreaders in Handheld Electronics
The selection of heat-spreader materials is an important consideration for cooling modules in handheld electronic systems. Heat spreaders are typically used in close contact with the source of heat. This can be, for example, a subcomponent, chip, or microelectronic package. The heat spreader transfers and distributes heat from the source to a heat sink through a thermal … [Read more...]
