A misconception that experienced thermal engineers have likely encountered is related to the improper use of Theta JA (θJA) of an electronic component. Many electrical and reliability engineers are taught that the junction temperature of an electronic component in any electronics packaging configuration or application may be calculated by the equation below. Here, TJ represents … [Read more...]
Save Your Seat for Thermal Live Spring 2026, May 19
Registration is open for Thermal Live Spring 2026 Join Electronics Cooling on May 19 for a day of technical sessions and product demos focused on real-world thermal challenges. Register Now Thermal Live Spring 2026 brings together hundreds of engineers and technology leaders to share practical insight into the latest advances in cooling, materials, and system … [Read more...]
Benefits of Boron Nitride Thermal Pads
Thermal interface materials (TIMs) must reduce interfacial thermal resistance while withstanding stresses such as vibration and humidity. Traditional TIMs cannot meet this requirement. Thermal paste, for example, performs well with micron-level surface matching and precise clamping, but is prone to contamination and increases the difficulty of automated assembly. Ordinary … [Read more...]
Silent Solid-State Cooling: How Ionic Wind Technology Is Reshaping Thermal Design
EDITOR'S NOTE: This article is based on a presentation delivered at Thermal Live Fall 2025 by Mark MacDonald, Thermal Technologist at Ventiva, where he outlined how electrohydrodynamic (EHD) air movers — branded as the Ionic Cooling Engine (ICE) — are redefining thermal system architecture. For decades, electronics cooling has relied on mechanical blowers. Bearings spin, … [Read more...]
Simulation of Two-Phase Microchannel Heat Sink Performance: Refrigerant, Inlet Conditions, and Hot Spots Effects
Introduction The introduction of large language models (LLM), such as ChatGPT, has made artificial intelligence highly accessible. One of the key driving forces behind this growth has been the advancement in the processing power of compute devices such as central processing units (CPUs) and graphics processing units (GPUs). An increase in this processing power is … [Read more...]
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