As consumer electronics continue their rapid evolution, each new generation is defined by a familiar yet intensifying mandate: deliver more performance in less space. Today’s devices — whether smartphones, wearables, or portable computing platforms — are expected to be thinner, lighter, and more power-efficient, while simultaneously supporting increasingly demanding workloads … [Read more...]
Designing an Effective Thermal Path in High-Power Electronic Systems
ABSTRACT Power densities continue to increase in AI servers, high-performance computing (HPC) systems, electric vehicles, and semiconductor manufacturing equipment. As a result, thermal management has become a critical system-design requirement. Thermal solutions often fall short not because one material lacks performance, but because the complete … [Read more...]
Thermal Facts and Fairy Tales: Misusing Theta JA to Calculate Junction Temperature
A misconception that experienced thermal engineers have likely encountered is related to the improper use of Theta JA (θJA) of an electronic component. Many electrical and reliability engineers are taught that the junction temperature of an electronic component in any electronics packaging configuration or application may be calculated by the equation below. Here, TJ represents … [Read more...]
Save Your Seat for Thermal Live Spring 2026, May 19
Registration is open for Thermal Live Spring 2026 Join Electronics Cooling on May 19 for a day of technical sessions and product demos focused on real-world thermal challenges. Register Now Thermal Live Spring 2026 brings together hundreds of engineers and technology leaders to share practical insight into the latest advances in cooling, materials, and system … [Read more...]
Benefits of Boron Nitride Thermal Pads
Thermal interface materials (TIMs) must reduce interfacial thermal resistance while withstanding stresses such as vibration and humidity. Traditional TIMs cannot meet this requirement. Thermal paste, for example, performs well with micron-level surface matching and precise clamping, but is prone to contamination and increases the difficulty of automated assembly. Ordinary … [Read more...]
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