In Part 1 (Thermal Management of Outdoor Enclosures), key aspects for successful design and development of thermal management systems were covered briefly, among these, cooling device selections and its impact on power, battery back-up and maintenance has therefore become of paramount importance for telecommunications enclosures. These are: Full active systems, like air … [Read more...]
Rosenberg Releases RoVent 10, New Generation Of Fan Selection Software
The latest version of Rosenberg’s RoVent fan selection software, RoVent 10, is now available for download at no cost from the Rosenberg USA Web site, http://www.rosenbergusa.com. RoVent 10 delivers fast operating point-accurate selection of more than 2,900 fan models based on user parameters. It also provides users the capability to configure Rosenberg ECFanGrid … [Read more...]
DegreeC Board-Solderable Air Velocity Sensors, Now With 5V Operation
Since the initial release of our F660 and F661 board mount sensors in 2017, we have received numerous requests for a 5V package. The F660 and F661 have answered the need for both low and tall profile sensors with the smallest possible footprint, and for very high volume applications - a reference circuit design where we supply only the sensor head, and a 4mm x 4mm x 0.9mm … [Read more...]
Thermal Management of Outdoor Enclosures, Part 2: Active Cooling Systems
In Part 1 (Thermal Management of Outdoor Enclosures), key aspects for successful design and development of thermal management systems were covered briefly, among these, cooling device selection and its impact on power, battery back-up and maintenance has therefore become of paramount importance for telecommunications enclosures. These are: Full active systems, like air … [Read more...]
New Product Launch: April 17, 2018 – Thermally Conductive Dispensable PCM Interface Paste, 3.5W/m.K
New from European Thermodynamics - the latest addition to the thermal interface material range from brand Global Component Sourcing (GCS), the phase change material GCS-TRP35-PCM.Ideally suited to fill spaces of up to 0.15mm, the GCS-TRP35-PCM phase change thermal interface material is used to fill air gaps/voids between two surfaces. This provides full thermal contact in … [Read more...]
