Modern data centers require advanced cooling solutions to operate at peak performance. As one of the most rapidly growing industries in the world, data centers are changing how we develop new cooling technology at a record pace. The data center market is projected to continue growing by 8.5% per year over the next five years, to over $600 billion by 2029.* Artificial … [Read more...]
Condenser Array Design for High-Density Data Centers
Introduction In recent years, the power density of server racks has surged past 100 kW/rack [1] to support compute-intensive workloads such as artificial intelligence and data analytics. Cooling systems play an increasingly important role in enabling such densification improvements and in improving overall data center energy consumption, equipment reliability, and total cost … [Read more...]
Airsys Introduces the PowerOne™ AI-Era Cooling Solutions for Modern Data Centers
As data-center rack densities climb and AI/HPC workloads expand, cooling infrastructure must evolve. Traditional approaches face growing limitations in capacity, scalability, efficiency and footprint. The Airsys PowerOne platform addresses these challenges through a modular, multi-medium cooling architecture engineered for modern compute environments. Technical Highlights … [Read more...]
Rosenberg Introduces New 170W Ecofit EC Fans: More Cooling Power and Efficiency for Your Application
Rosenberg's new generation of Ecofit G9 EC motors offers an increased power rating of 170 watts, providing a higher-performance, more energy-efficient air movement solution. The new motor is available on 48 models of Ecofit backward-curved fans and forward-curved blowers. They provide improved ventilation without impacting the budget or increasing the energy footprint. Another … [Read more...]
Thermal Design for Externally Worn Wearable Electronics
Introduction Thermal management plays a critical role in the performance, reliability, and longevity of wearable devices. Reliability must be considered even when components remain below their absolute maximum operating temperatures. This is due to increased diffusion rates, material fatigue, and electromigration effects which degrade electronics over time. Additional failure … [Read more...]
- 1
- 2
- 3
- …
- 58
- Next Page »
