Digital Edge to achieve Power Usage Effectiveness and Water Usage Effectiveness sustainability goals with StatePoint® Oklahoma City, (May 17, 2022)—Digital Edge (Singapore) Holdings Pte. Ltd., (“Digital Edge”), a leading Asian data center developer and operator, leverages StatePoint® liquid cooling technology manufactured by Nortek Data Center Cooling™, Oklahoma City, for … [Read more...]
Arieca Announces $6.5M Series A Funding Round
Company will use the investment to accelerate product development and scale up manufacturing of its Liquid Metal-based thermal interface materials (TIMs). May 17, 2022 8:00 AM Eastern Daylight Time PITTSBURGH--(BUSINESS WIRE)--Arieca Inc., the leader in liquid-metal based thermal interface materials for high performance computing and high power semiconductor devices, … [Read more...]
Neograf Solutions’ New Advanced Graphenes Targets Energy Storage Markets
NeoGraf Solutions, a leading developer and manufacturer of high-performance natural and synthetic graphite sheet and powder products, has extended its range of next-generation graphite materials with the launch of Graf-X™ graphene nanoplatelets (GNP) and graphene precursors (GP). Both high-performance additive materials deliver enhanced strength, performance, and reliability in … [Read more...]
New fanSINKS Cool Hot Components in Sizes from 27mm to 70mm
Advanced Thermal Solutions, Inc. (ATS) now provides fanSINKS™ heat sinks for component sizes ranging from 27mm to 70mm square. The wider size range accommodates hot semiconductor components, including FPGAs, ASICS and other package types used in telecomm, optics, test/measurement, military and other applications. ATS fanSINKS™ feature cross-cut, straight aluminum fins. They … [Read more...]
A Polyimide Single-Component Silver Filled, Electrically Conductive Semiconductor Die-Attach Adhesive
Creative Materials introduces 122-47, a polyimide single-component silver filled, electrically conductive semiconductor die-attach adhesive. This product can be applied by stamping, screen printing, dipping and syringe dispensing, and is designed for die-attachment and surface mount applications. Other applications include assembling electrical and electronic components. The … [Read more...]
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