Rogers Corp. has introduced TC350 Plus laminates. TC350 Plus laminates are ceramic filled PTFE-based woven glass reinforced composite materials providing a cost effective, high performance, thermally enhanced material for the circuit designer. With a thermal conductivity of 1.24W/mK, this next generation PTFE-based laminate is ideally suited for higher power microwave and … [Read more...]
New Diafilm TM220 from Element Six Offers Thermal Conductivity in Excess of 2200W/mK
At the 2019 International Microwave Symposium (IMS) Element Six, part of the De Beers Group, launched a new diamond thermal material grade designated Diafilm TM220. Said to be the world’s first diamond thermal material engineered to offer industrial users thermal conductivity in excess of 2200 W/mK, Diafilm TM220 was developed in response to the increasing demand for more … [Read more...]
Molex QSFP-DD BiPass Module Cooler Helps Designers on the Path to 112 Gbps PAM-4
As industry prepares for the launch of next-generation copper and optical QSFP-DD transceivers, thermal management strategies are critical. The new Molex QSFP-DD thermal solution can cool a range of 15W to 20W in different configurations with a 15 degree Celsius change from ambient temperature. In data centers and telecommunication infrastructure, 56 and 112 Gbps … [Read more...]
Are Power Electronic Modules a New Growth Opportunity for Conductive Pastes?
Power electronics is a growing market thanks to the electrification of many industries such as the automotive industry. The power electronic modules being used are growing in performance; in particular, they are becoming smaller, lighter weight, more tightly integrated, and better able to handle higher power levels. In some cases the semiconductor technology is also shifting … [Read more...]
INTERVIEW: Dr. Marta Rencz, Mentor Graphics
Dr. Marta Rencz has been nominated for a Lifetime Achievement Award by the ST35 Thermal Hall of Fame. She is a faculty member and former Head of Department at the Budapest University of Technology and Economics, and a member of the Hungarian Academy of Sciences. Dr. Rencz is also the Development Engineering Director of Mentor’s MicReD group, now a Siemens business. Dr. … [Read more...]
