London, UK – 25th June 2019: This month, thermal simulation provider Future Facilities is celebrating the 10th anniversary of 6SigmaET — its computational fluid dynamics (CFD) solution for the electronics market. First launched at the thermal engineering conference, Semi-Therm, in 2009, 6SigmaET has evolved substantially over the last ten years and now incorporates advanced … [Read more...]
Laird Thermal Systems Expands SuperCool Series with Higher Cooling Power in Smaller Form Factors
Refrigerant-free SuperCool Peltier Cooler assembly increases cooling performance in a new, smaller form factor Laird Thermal Systems has expanded its SuperCool Series product offering with the development of three high performance ultra-compact Peltier Cooler assemblies. The space-saving SuperCool Series is designed for applications that require high cooling capacities … [Read more...]
Baltimore Aircoil Company Announces HXV Hybrid Cooler
Baltimore Aircoil Company (BAC) has introduced its HXV Hybrid Cooler, offering the best of both evaporative and dry cooling in a water saving and energy-efficient solution. The HXV is well-suited for maintaining peak performance in a variety of applications where water is scarce, water costs are high, uptime is critical, or plume is a concern. Applications include demanding … [Read more...]
Hammond Adds 36 Configurations to its IP68 1554 and 1555 Industry 4.0 Families
To protect electronics in an industrial environment, Hammond Manufacturing has added 36 new configurations to its Industry 4.0 1554 and 1555 sealed enclosure families. Available in ABS or polycarbonate with styled, opaque, clear or smoked lids, the six new sizes are 4.13 x 4.13 x 2.36 and 3.54 inches (105 x 105 x 60 and 90mm), 5.51 x 5.51 x 2.36 and 3.54 inches (140 x 140 x 60 … [Read more...]
TC350 Plus Laminates for Higher Microwave & Industrial Heating Applications
Rogers Corp. has introduced TC350 Plus laminates. TC350 Plus laminates are ceramic filled PTFE-based woven glass reinforced composite materials providing a cost effective, high performance, thermally enhanced material for the circuit designer. With a thermal conductivity of 1.24W/mK, this next generation PTFE-based laminate is ideally suited for higher power microwave and … [Read more...]
