The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the Gaylord Texan Resort and Convention Center, Dallas, TX, May 27 – 30, 2025. This was the 24th ITherm Conference. ITherm Conference series began in 1988 as a companion conference to the broader IEEE Electronic Packaging Society’s (at that time CHMT, later … [Read more...]
The EDS Leadership Summit: Come Prepared. Leave Aligned.
May 19-23, 2025 at Resorts World Las Vegas Come Prepared. Leave Aligned. We all know how busy EDS week is. With four consecutive days of face-to-face meetings and outings, it’s imperative that you come prepared to ensure the ideas shared with prospective channel partners will lead to impactful solutions. When you come to EDS prepared, you leave aligned on a more predictable … [Read more...]
Report About the THERMINIC 2024 Workshop
By Andras Poppe and Marta Rencz The 30th THERMINIC (Thermal Investigations of ICs and Systems) workshop was held on 25-27 September 2024 in Toulouse, France at the Mercure Toulouse Centre Compans. Jean-Pierre Fradin (Icam, France) and Patrick Tounsi (INSA Toulouse & LAAS – CNRS) as local organizers and co-program chairs of the 2024 THERMINIC did a great job: Over 110 … [Read more...]
A New Patented Approach to Diffusion Bonding Offers Speed and Improved Process Control
An innovative process is reducing diffusion bonding time of aluminum and aluminum alloys by up to 50%, energy use by 30%, and improving quality. Contract manufacturers and design engineers in the aerospace, semiconductor, high-power electronics, and energy industries have been turning to diffusion bonded metals to produce new cutting-edge innovations. Diffusion bonding is … [Read more...]
Summary of SEMI-THERM 40 Conference
The SEMI-THERM 40 Symposium was held March 25-28, 2024 at the Double Tree Hotel in San Jose, CA. Program organization was led by General Chair Alex Ockfen (Meta), Program Chair dr. Lieven Vervecken (Diabatix), and Program Vice Chair dr. Navid Kazem (Arieca). It featured a variety of activities including technical short courses, technical sessions, invited presentations, vendor … [Read more...]
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