The first StatePoint™ Liquid Cooling system, “The World’s First Sustainable Data Center Cooling Technology,” reduces energy and water consumption in data centers. Oklahoma City, Okla., Dec. 16 , 2019 — Nortek Air Solutions (NAS), St. Louis, Mo., a leading provider of custom air handlers, celebrated the completion of its first manufactured StatePoint™ Liquid Cooling (SPLC) … [Read more...]
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Electronics Cooling
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
Schneider Electric Announces Industry’s First Integrated Rack with Immersed, Liquid-Cooled IT for Data Centers
Integrated, fulfilled and supported by Avnet, this solution combines a GPU server with Iceotope’s innovative chassis-based, immersion cooling technology and Schneider Electric’s NetShelter liquid-cooled enclosure system. Marks a milestone in industrializing liquid-cooled server solutions that promise lower operating costs, higher efficiencies, smaller footprint, and fan-less … [Read more...]
Underfill Epoxy Offers Thermal Conductivity and Electrical Insulation
Product: EP29LPTCHT Release Date: 11/21/2019 Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications. It does not need excessive heat for curing and has a long working life at room temperature. This system is electrically insulative and thermally conductive with very fine particle … [Read more...]
Low Compression Force Sarcon
Carteret, NJ — The compression characteristics of thermal gap fillers should be key considerations during a product’s early design phase. For applications that have delicate components or widely varying gap distances, Fujipoly® created a line of Low Compression Force gap filler pads. These TIMs help avoid overstressing the printed circuit board (PCB) and fragile solder joints … [Read more...]
Europe Data Center Cooling Market Size to Exceed $6 Billion by 2024
According to the Graphical Research new growth forecast report titled “Europe Data Center Cooling Market Size By Component (Solution {Chilling Unit, Air Conditioner, Cooling Tower, Control System, Economizer, Liquid Cooling System}, Service {Consulting, Maintenance & Support, Installation & Deployment}), By Cooling Technique (Rack/Row Based, Room Based), By Application … [Read more...]
