Master Bond EP21TP-2NV is a two-part epoxy polysulfide formulated for use as an adhesive, sealant and potting system. It withstands prolonged exposure to many harsh chemicals including fuels, oils, hydrocarbons and hydraulic fluids. It is also fully RoHS compliant, meeting RoHS3 Directive (EU) 2015/863.EP21TP-2NV offers an elongation between 40-80% at room temperature and … [Read more...]
About the Author
Electronics Cooling
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
Pfannenberg Filter Mats Extend Service Life 300%
Fluted Filter Mats Reduce Maintenance in High Airflow Electrical Enclosure CoolingPfannenberg, a leading global manufacturer of thermal management technologies, has re-engineered the filter mat for its 4th generation Filterfans for electrical enclosures. Filterfans 4.0 spin optimized fins and rotor blades to maximize airflow with minimal energy consumption and employ … [Read more...]
Future Facilities celebrates ten years of thermal simulation with new ‘interactive history’ of 6SigmaET
London, UK – 25th June 2019: This month, thermal simulation provider Future Facilities is celebrating the 10th anniversary of 6SigmaET — its computational fluid dynamics (CFD) solution for the electronics market.First launched at the thermal engineering conference, Semi-Therm, in 2009, 6SigmaET has evolved substantially over the last ten years and now incorporates advanced … [Read more...]
New Active Rear Door Heat Exchanger for Data Center Cooling from Nortek
Smaller footprint cuts real estate and installation costs.Nortek Air Solutions has added the ADHX 35-6B, a 35kW Active Rear Door Heat Exchanger (ADHX), to its ServerCool data center liquid cooling product line.The ADHX 35-6B features upgrades in redundancy, user-friendliness, durability, and energy efficiency; but without sacrificing the previous ADHX generation’s … [Read more...]
Laird Thermal Systems Expands SuperCool Series with Higher Cooling Power in Smaller Form Factors
Refrigerant-free SuperCool Peltier Cooler assembly increases cooling performance in a new, smaller form factorLaird Thermal Systems has expanded its SuperCool Series product offering with the development of three high performance ultra-compact Peltier Cooler assemblies. The space-saving SuperCool Series is designed for applications that require high cooling capacities … [Read more...]
