Abstract The utility of the laser flash thermal conductivity measurement can be greatly expanded to more complex structures by modeling laser flash results using Finite Element Models. This approach is illustrated using a test fixture with 4 heat sinks, where heat spreading is a significant factor. If traditional 1D thermal diffusion models for laser flash are used, thermal … [Read more...]
About the Author
Electronics Cooling
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
Thermal Penalties of Bandwidth Enhancements for Li-Fi Communication
The rapid increase of device connectivity, coupled with constantly growing data transmission rates, increases the demand for new communication channels. Illumination systems employing Light Emitting Diodes (LEDs) have the potential to fulfill this demand. LEDs are versatile components that are used as a light source in a vast number of products: indoor and outdoor lighting, … [Read more...]
Calculating Interface Resistance
Introduction The exposed surface area of many of today’s high-powered electronic packages is no longer sufficient for the removal of the heat generated during normal operation. Heat sinks are a commonly-used, low cost means of increasing the effective surface area for dissipating heat by means of convective air cooling. While the use of a heat sink lowers the fluid-side … [Read more...]
Sheetak Announces Product Line Expansion with CENTUM® C3 Multi-Stage Cooler Based on Novel Patented Thermoelectric Device Structures
CENTUM® C3 Chips are designed for higher performance low profile architecture of solid-state thermal management systems that is not possible with current designs January 10, 2023 AUSTIN, TX--Sheetak is expanding their flagship CENTUM® product line, based on newly patented thermoelectric device structures, that offer the highest temperature difference with significant … [Read more...]
Thermal Comfort Considerations for Electronics Cooling and Design
Written by: Mark Hepokoski, ThermoAnalytics and Alex Ockfen, Meta Reality Labs Introduction ASHRAE defines thermal comfort as “that condition of mind that expresses satisfaction with the thermal environment” [1]. While engineers and designers are typically familiar with the thermal safety and compliance standards required in their industry [2], thermal comfort is less well … [Read more...]
- 1
- 2
- 3
- …
- 335
- Next Page »
