Carteret, NJ — The compression characteristics of thermal gap fillers should be key considerations during a product’s early design phase. For applications that have delicate components or widely varying gap distances, Fujipoly® created a line of Low Compression Force gap filler pads. These TIMs help avoid overstressing the printed circuit board (PCB) and fragile solder joints … [Read more...]
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Electronics Cooling
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
Europe Data Center Cooling Market Size to Exceed $6 Billion by 2024
According to the Graphical Research new growth forecast report titled “Europe Data Center Cooling Market Size By Component (Solution {Chilling Unit, Air Conditioner, Cooling Tower, Control System, Economizer, Liquid Cooling System}, Service {Consulting, Maintenance & Support, Installation & Deployment}), By Cooling Technique (Rack/Row Based, Room Based), By Application … [Read more...]
125-19(SP)C-A Flexible, Non-flammable, High Conductive Temperature Resistant Conductive Ink and Coating
Ayer, MA, October 2019 Creative Materials introduces 125-19(SP)C, a flexible, non-flammable, high temperature resistant conductive ink and coating. This product features excellent bonding to most metal and plastic substrates and has the unique characteristic of bonding well to silicone. A key advantage of this product is that it is non-flammable, in contrast to most products … [Read more...]
Schneider Electric Announces Partnership with Avnet and Iceotope to Develop Liquid-Cooled Data Center Solutions
BARCELONA, Spain, Oct. 2, 2019 /PRNewswire/ -- Schneider Electric, the leader in digital transformation of energy management and automation, announced today that it is teaming up with Avnet and Iceotope to jointly develop innovative, chassis-level immersive liquid cooling solutions for data centers. This newly announced partnership brings together three global technology … [Read more...]
Cadence Launches Celsius Thermal Solver, Delivering the Industry’s First Complete Electrical-Thermal Co-Simulation for System Analysis
Innovative multi-physics technology furthers Cadence’s expansion into fast-growing system analysis and design market SAN JOSE, Calif., September 17, 2019—Cadence Design Systems, Inc. (NASDAQ: CDNS) today expanded its presence in the system analysis and design market with the introduction of the Cadence® Celsius™ Thermal Solver, the industry’s first complete … [Read more...]
