As electronic applications become more sophisticated and higher performing, the need for thermal performance that can keep pace is increasing. Parker is excited to continue pushing the bar and helping their customers accelerate innovation with THERM-A-GAP GEL 120 which offers a game-changing thermal conductivity of 12.0 W/m-K. THERM-A-GAP GEL 120 is a one-component, … [Read more...]
Choosing the Proper Thermocouple Types for Greatest Accuracy
Most engineers involved with temperature measurement know there are several methods for measuring temperatures of fluids and solids. The oldest and most common method for measuring the temperature of a fluid such as air is the standard mercury-in-glass thermometer. However, this is not acceptable for measuring surface temperatures of solid objects. For surface temperature … [Read more...]
Augmenting Development of Electronics Cooling Technologies with Machine Learning Tools – a Heat Pipe System Example
The traditional pathway for development of thermal management technologies for electronics has been to analyze using heat transfer theory augmented by computational tools such as finite difference or finite element methods, CFD tools, or thermal management system simulation tools, sometimes in tandem with prototype system fabrication and testing. Combining recently available … [Read more...]
Pfannenberg USA Introduces PTF 1200 High CFM Top-Mounted Filter Fan
Lancaster, NY – Pfannenberg, Inc., a global leader in thermal management and signaling technologies, proudly introduces the PTF 1200, an industry leading high CFM top-mounted filter fan designed to redefine cooling solutions for various industries. This compact yet powerful innovation boasts an unimpeded airflow rate of up to 589 CFM, making it a game-changer in the realm of … [Read more...]
Theta-JC Measurements: Steady-State Compared to Transient Methods
Thermal characterization plays a vital role in electronic package reliability testing, design, and verification of manufacturing processes. The reliability of electronic packages is controlled, in part, by ensuring the maximum junction temperature is not exceeded during operation. Systems such as cell phones, electric vehicles and computers, must operate with die temperatures … [Read more...]
- 1
- 2
- 3
- …
- 44
- Next Page »
