Save your spot for Thermal Live Fall 2026, live October 14–15. Electronics Cooling’s flagship virtual event returns for two days of technical presentations and product demonstrations focused on the thermal management challenges engineers are facing today. Register for Thermal Live Fall 2026 Thermal Live brings together engineers, designers, and industry experts to … [Read more...]
Celebrating ITherm’s 25th Conference: A Summary of the 2026 Meeting
The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the JW Marriott Grande Lakes, Orlando, FL, May 26–29, 2026. This was the 25th ITherm, which was first held in 1988. The conference was historically held every other year until 2016 when it switched to an annual schedule, so ITherm 2026 marked the series’ 25th … [Read more...]
Molex Engineer Q&A: Why High-Density Racks Need Liquid-Cooled Busbars
The rapid rise of AI accelerators and high-performance computing has pushed rack power densities to unprecedented levels. While direct-to-chip liquid cooling successfully manages heat at the processor, the power delivery path itself has emerged as the next critical thermal bottleneck. Recently, Electronics Cooling sat down with Vic Geevarghese, Director of Operations of … [Read more...]
Introducing AMEC Thermasol Graphene Thermal Pads
The GTP thermal pad is an advanced graphene thermal conductive gasket developed for high-end electronics and precision optical equipment. It combines ultra-high thermal conductivity with stable interface performance, helping fill tiny gaps between heat sources and heat sinks to improve heat-transfer efficiency in compact assemblies. Features Thermal Conductivity: … [Read more...]
MEMS-Based Solid-State Airflow for Compact Thermal Management
As consumer electronics continue their rapid evolution, each new generation is defined by a familiar yet intensifying mandate: deliver more performance in less space. Today’s devices — whether smartphones, wearables, or portable computing platforms — are expected to be thinner, lighter, and more power-efficient, while simultaneously supporting increasingly demanding workloads … [Read more...]
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