The GTP thermal pad is an advanced graphene thermal conductive gasket developed for high-end electronics and precision optical equipment. It combines ultra-high thermal conductivity with stable interface performance, helping fill tiny gaps between heat sources and heat sinks to improve heat-transfer efficiency in compact assemblies.
Features
- Thermal Conductivity: 75.0W/mk
- Excellent flexibility, resilience and thermal stability.
- Low Thermal Resistance
- Highly efficient heat dissipation
- Excellent flammability resistance
- Can be supplied in custom shapes and sizes
Key Benefits
- Ultra-high thermal conductivity for high-power and space-constrained heat-transfer interfaces
- Stable heat transfer performance. Thermal resistance changes after high temperature aging and stays within the allowed range during testing.
- Ultra-low thermal resistance under compression for efficient heat path control.
- Outstanding compression resilience to help maintain interface contact over time.
- Low oil bleed and optics-friendly material direction for sensitive assemblies.
- Low density and optional adhesive construction for easier integration.
- Suitable for semiconductor, communications, graphics, LED, and display thermal management.
- Gap filling with recovery. The series is designed to balance high conductivity with resilience for longer lasting interface contact.
In addition to these benefits the thermal pad can either be supplied in 60x60mm sheet size or customised shapes or sizes. Various adhesive options are also available such as low tack adhesive, strong adhesive or both sides supplied with adhesive backing.
Typical Applications
Semiconductor Heat Sink: Suitable for high performance semiconductor heat transfer interfaces that need very low thermal resistance.
Communication & Power Equipment: Applicable to compact, high heat communication and power assemblies that need stable thermal contact.
Graphics Cards/Memory Modules: Good fit for electronic card thermal management where a thin, efficient TIM structure is required.
LED/LCD/Plasma TV: Suitable for display and lighting assemblies that need stable heat transfer and reduced contamination risk.
In these systems, engineers often lack space for large heat sinks, so spreading heat across the device is critical. Instead of just moving heat from the chip to the heat sink (Z-axis), graphene thermal pads excel at spreading the heat across its entire surface (X-Y axis). Essentially the TIM is acting as a micro radiator.
The standard sheet size of this part number is 50x50x0.3mm and is available in stock from our UK office. In addition to this, the product can be purchased from our distributor Digi-Key, and will soon be available to purchase from Farnell.
About AMEC Thermasol
AMEC Thermasol, 1-2 Steam Mill Lane, Great Yarmouth, Norfolk, NR31 0HP, UK
Website: www.amecthermasol.co.uk
Tel: +44 (0)1493 668622
Email: sales@amecthermasol.co.uk
