To protect electronics in an industrial environment, Hammond Manufacturing has added 36 new configurations to its Industry 4.0 1554 and 1555 sealed enclosure families. Available in ABS or polycarbonate with styled, opaque, clear or smoked lids, the six new sizes are 4.13 x 4.13 x 2.36 and 3.54 inches (105 x 105 x 60 and 90mm), 5.51 x 5.51 x 2.36 and 3.54 inches (140 x 140 x 60 … [Read more...]
What is the Right Temperature Set Point for My Electrical Enclosure?
Cooling units are necessary for hot enclosures, but selecting the proper temperature set point for yours can mean the difference between failure and enhanced performance Electrical enclosures serve to protect electrical devices from adverse environmental influences, such as dirt, other particulates, moisture, or chemicals that could damage components. What is more, by … [Read more...]
TC350 Plus Laminates for Higher Microwave & Industrial Heating Applications
Rogers Corp. has introduced TC350 Plus laminates. TC350 Plus laminates are ceramic filled PTFE-based woven glass reinforced composite materials providing a cost effective, high performance, thermally enhanced material for the circuit designer. With a thermal conductivity of 1.24W/mK, this next generation PTFE-based laminate is ideally suited for higher power microwave and … [Read more...]
New Diafilm TM220 from Element Six Offers Thermal Conductivity in Excess of 2200W/mK
At the 2019 International Microwave Symposium (IMS) Element Six, part of the De Beers Group, launched a new diamond thermal material grade designated Diafilm TM220. Said to be the world’s first diamond thermal material engineered to offer industrial users thermal conductivity in excess of 2200 W/mK, Diafilm TM220 was developed in response to the increasing demand for more … [Read more...]
Towards Green Technology: Modeling of a Compact Plate Heat Exchanger Condenser for Thermosyphon Cooling of Entire High Power Datacenter Racks
By Raffaele Luca Amalfi, Ph.D., Jackson Braz Marcinichen, and John Richard Thome, Ph.D. CONTEXT AND NEW COOLING TECHNOLOGY Heat dissipations of servers and their racks in datacenters are reaching ever increasing levels, breaching the economical heat removal limits of traditional air-based cooling technologies. Currently, about 40% to 45% of the total datacenter energy … [Read more...]
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