MIDLAND, Mich. — May 18, 2026 — Dow (NYSE: DOW) today announced the launch of Dow Coolant Care Network, an end-to-end service model designed to help data center operators protect uptime, reduce operational risk, and confidently manage direct-to-chip liquid cooled systems using DOWFROST™ LC and DOWFROST™ HD Heat Transfer Fluids. As hyperscale and high-performance data centers … [Read more...]
Gates Introduces 3″ and 4″ Data Master™ MegaFlex™ Hoses to Unlock Higher-Capacity Cooling for Data Centers
New large-diameter hoses open access to more applications—supporting higher flow rates and improving installation efficiency across cooling loops. DENVER, May 11, 2026 -- Gates Corporation (NYSE: GTES), a global manufacturer of innovative, highly engineered power transmission and fluid power solutions, is expanding its Data Master MegaFlex hose portfolio with new 3-inch and … [Read more...]
Save Your Seat for Thermal Live Spring 2026, May 19
Registration is open for Thermal Live Spring 2026 Join Electronics Cooling on May 19 for a day of technical sessions and product demos focused on real-world thermal challenges. Register Now Thermal Live Spring 2026 brings together hundreds of engineers and technology leaders to share practical insight into the latest advances in cooling, materials, and system … [Read more...]
Alternative Battery Module Configuration for Fast Thermal Runaway Detection with a Reduced Number of Temperature Sensors
Abstract With increasingly strict regulations on lithium-ion battery (LIB) thermal runaway (TR) and safety, rapid detection has become essential to ensure passengers can evacuate safely in electric vehicles (EVs). Early TR detection requires temperature sensors to monitor battery behavior. Incorporating many sensors increases both cost and system complexity, so commercial … [Read more...]
Benefits of Boron Nitride Thermal Pads
Thermal interface materials (TIMs) must reduce interfacial thermal resistance while withstanding stresses such as vibration and humidity. Traditional TIMs cannot meet this requirement. Thermal paste, for example, performs well with micron-level surface matching and precise clamping, but is prone to contamination and increases the difficulty of automated assembly. Ordinary … [Read more...]
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