Thermal management has become one of the defining challenges in modern electronics design. Across data centers, AI and machine learning hardware, power electronics, and compact consumer devices, heat generation continues to rise as performance expectations increase. Higher power densities, faster processing speeds, and smaller form factors are placing sustained pressure on … [Read more...]
Monte-Carlo as a Tool for Robust Thermal Design
Introduction Parametric design plots are commonly used in early thermal architecture studies to understand sensitivity across the design space, often resulting in the selection of a single-point solution that achieves a key design objective. For example, the size of a passively cooled consumer electronics device may be selected such that it achieves the required thermal … [Read more...]
Siemens Expands Data Center Partner Ecosystem to Scale Next-Generation AI Infrastructure
Strategic investment in Emerald AI bridges gap between AI compute demand and grid constraints through IT/OT convergence Fluence Energy Inc. (Fluence) energy storage solutions are designed to accelerate grid connection and enable faster data center deployment PhysicsX collaboration introduces AI-accelerated modeling for data center power infrastructure, enabling faster … [Read more...]
Highlights From the 19th ASME InterPACK Conference
The 2025 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2025) was held from October 28–30, 2025, at the Hotel Fera Anaheim, a DoubleTree by Hilton, in Anaheim, California. Hosted by the ASME Electronic and Photonic Packaging Division (EPPD), the conference served as a premier forum for advancing … [Read more...]
Introducing THERM-A-GAP GEL 120: Parker Chomerics’ Highest Performing Thermal Gap Filler Gel
As electronic applications become more sophisticated and higher performing, the need for thermal performance that can keep pace is increasing. Parker is excited to continue pushing the bar and helping their customers accelerate innovation with THERM-A-GAP GEL 120 which offers a game-changing thermal conductivity of 12.0 W/m-K. THERM-A-GAP GEL 120 is a one-component, … [Read more...]
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