ABSTRACT Power densities continue to increase in AI servers, high-performance computing (HPC) systems, electric vehicles, and semiconductor manufacturing equipment. As a result, thermal management has become a critical system-design requirement. Thermal solutions often fall short not because one material lacks performance, but because the complete … [Read more...]
Thermal Facts and Fairy Tales: Misusing Theta JA to Calculate Junction Temperature
A misconception that experienced thermal engineers have likely encountered is related to the improper use of Theta JA (θJA) of an electronic component. Many electrical and reliability engineers are taught that the junction temperature of an electronic component in any electronics packaging configuration or application may be calculated by the equation below. Here, TJ represents … [Read more...]
Summary of SEMI-THERM 42 Conference
The SEMI-THERM 42 Symposium was held March 9-12, 2026 at the Double Tree Hotel in San Jose, CA. Program organization was led by General Chair Dr. Navid Kazem (Arieca), Program Chair Dr. Claire Wemp (Qnity), and Program Vice Chair Dr. Mohamed Abo-Ras (Nanotest). It featured technical short courses, technical sessions, invited presentations, vendor exhibits and workshops, a panel … [Read more...]
Save Your Seat for Thermal Live Spring 2026, May 19
Registration is open for Thermal Live Spring 2026 Join Electronics Cooling on May 19 for a day of technical sessions and product demos focused on real-world thermal challenges. Register Now Thermal Live Spring 2026 brings together hundreds of engineers and technology leaders to share practical insight into the latest advances in cooling, materials, and system … [Read more...]
Vapor Chambers vs. Thermal Pads: How to Choose the Right Thermal Solution for High-Performance Electronics
Thermal management has become one of the defining challenges in modern electronics design. Across data centers, AI and machine learning hardware, power electronics, and compact consumer devices, heat generation continues to rise as performance expectations increase. Higher power densities, faster processing speeds, and smaller form factors are placing sustained pressure on … [Read more...]
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