Introduction of bare-die jet cooling in package With the rising demand for more powerful, efficient, high-performance computation (HPC) systems, power densities of devices have increased dramatically. To cope with the increasing heat flux challenge for future data center servers beyond 1 kW/cm2, efficient liquid cooling solutions are needed to address those thermal … [Read more...]
Inventec Thermasolv™ Fluorinated Fluids vs. Hydrocarbons for Immersion Cooling
At the Thermal Live Spring Summit 2024 hosted by Electronics Cooling, discussions revolved around groundbreaking developments in thermal cooling technologies. Here is a detailed summary of key takeaways from Inventec's presentation: 1. Industry-specific Development — ThermoSolv Fluorinated Fluids vs. Hydrocarbons: The session kicked off with an in-depth exploration of the … [Read more...]
7 Most Common Myths About Heat Pipes
Overview Over many decades, Boyd has led innovation of superior heat pipe and two-phase thermal management solutions across many major industries from mobile and consumer electronics to NASA applications and next-generation enterprise and 5G equipment. We’ve observed many misconceptions about heat pipes, how they work, and how to best utilize them in applications while working … [Read more...]
Will PFAS be the Death of Two-phase Cooling?
At this year's Thermal Live Spring Summit, Inventec discussed a pivotal topic — PFAS (per- and polyfluoroalkyl substances) and their crucial role in cooling systems extensively used by data centers. This topical content springs debates about alternative approaches such as 2 phase immersion cooling, regulation of PFAS across various regions, concerns related to the health and … [Read more...]
Adding Function, Value, and Performance to Direct-to-Chip (DTC) Cold Plates With Ultrasonic Additive Manufacturing
Lance Dumigan Fabrisonic, LLC Mark Norfolk Fabrisonic, LLC Practical Knowledge Gained “The performance of DTC cold plates can be enhanced by a new method of fabrication called Ultrasonic Additive Manufacturing (UAM). Building DTC cold plates with UAM could enhance performance and functionality.” The direction of Artificial intelligence and High Power Computing … [Read more...]
- 1
- 2
- 3
- …
- 62
- Next Page »
