Modern data centers require advanced cooling solutions to operate at peak performance. As one of the most rapidly growing industries in the world, data centers are changing how we develop new cooling technology at a record pace. The data center market is projected to continue growing by 8.5% per year over the next five years, to over $600 billion by 2029.* Artificial … [Read more...]
Condenser Array Design for High-Density Data Centers
Introduction In recent years, the power density of server racks has surged past 100 kW/rack [1] to support compute-intensive workloads such as artificial intelligence and data analytics. Cooling systems play an increasingly important role in enabling such densification improvements and in improving overall data center energy consumption, equipment reliability, and total cost … [Read more...]
Engineering Leak-Free Performance for Mission-Critical Electronics
Chips are getting hotter, and liquid cooling is moving from niche to necessary. That transition changes what “good” looks like for fluid connections. Quick disconnect couplings have long lived in industrial settings, where design tolerances, qualification habits, and manufacturing controls matched those use cases. Data center liquid cooling—along with aerospace/defense and … [Read more...]
Airsys Introduces the PowerOne™ AI-Era Cooling Solutions for Modern Data Centers
As data-center rack densities climb and AI/HPC workloads expand, cooling infrastructure must evolve. Traditional approaches face growing limitations in capacity, scalability, efficiency and footprint. The Airsys PowerOne platform addresses these challenges through a modular, multi-medium cooling architecture engineered for modern compute environments. Technical Highlights … [Read more...]
Direct-Die Liquid Cooling: A Scalable Approach for Power Module Thermal Integration
Abstract This paper presents a novel thermal management approach for power semiconductor modules by integrating active liquid cooling directly into the substrate. Utilizing Direct Bond Copper (DBC) structures embedded within liquid cold plates, the method minimizes thermal interfaces, improves power density, and ensures better reliability. It contrasts traditional … [Read more...]
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