2026 Summer Issue
New Issue of Electronics Cooling is Now Available | Summer 2026
Electronics Cooling, released four times yearly, provides practical technical insight, industry updates, and emerging technology coverage for engineers working across electronics thermal management.
The Summer 2026 issue focuses on two important pipelines shaping the field: the technical pipeline of new cooling methods and tools, and the human pipeline of engineers and researchers leading the charge toward thermal management advancement.
Specifically, you’ll find these articles and resources:
- Editorial: The Technical and Human Thermal Management Pipelines
- MEMS-Based Solid-State Airflow for Compact Thermal Management
- Use of Heat Transfer Coefficient and Pressure Drop Correlations for Liquid Cooling of Electronics
- Thermal Facts and Fairy Tales: Misusing Theta JA to Calculate Junction Temperature
- Summary of SEMI-THERM 42 Conference
- Upcoming Cooling Events
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