2025 Fall Issue
Electronics Cooling Fall 2025 Now Available!
Electronics Cooling, released four times yearly, is your guide to thermal management news, best practices, and emerging technologies.
The third release this year includes all the regulation updates, events, expert articles, and product news you expect from Electronics Cooling. Specifically, you’ll find these features and more:
- Editorial: SWaP-C and Holistic Thermal Design
- Remembrances of Clemens Lasance: Tributes from Industry Voices
- The Holy Books of Heat Transfer: Facts or Fairy Tales by Dr. Clemens Lasance (Reprint)
- Direct-Die Liquid Cooling: A Scalable Approach for Power Module Thermal Integration
- Simulation of Two-Phase Microchannel Heat Sink Performance: Refrigerant, Inlet Conditions, and Hot Spots Effects
- In-Package, Direct-on-chip Liquid Cooling with Lid-Compatible Manifold for Efficient AI Chip Thermal Management
- Summary of IEEE ITherm 2025 Conference
- Upcoming Cooling Events
Download Your FREE Copy Today!
