Rogers Corporation is pleased to introduce CLTE-MW™ laminates. These laminates are ceramic filled, woven glass reinforced PTFE composites. CLTE-MW laminates were developed to provide a cost effective, high performance material for the circuit designer. This unique laminate system is well suited for applications that have limitations in thickness due to either physical or … [Read more...]
Reliability of Nano-sintered Silver Die Attach Materials
Coauthored by: Ross Wilcoxon, Mark Dimke, Chenggang Xie Rockwell Collins INTRODUCTION Die attach can play a significant role in the package level thermal resistance of wire bonded devices. Die with moderate heat flux can often be attached to the carrier substrate with organic, Silver Filled Die Attach (SFDA) materials that require relatively benign processing requirements … [Read more...]
New Adhesive Transfer Tapes Introduced
Polyonics introduces a new family of adhesive transfer tapes at the International Converting Exhibition in Orlando 25-27 April. The tapes are designed specifically for high temperature bonding of electronic, transportation and general industrial components. The solvent-based, double linered adhesives are available in acrylic and ultra-high temperature silicone. They provide … [Read more...]
SEMI-THERM 33 2017 Exhibits Highlights – Part 2
Editor’s Note: This is the 2nd of a two-part summary from SEMI-THERM 33. Click here for Part 1. SEMI-THERM 33 concluded last week at Silicon Valley, CA and Electronics Cooling was the only media and content provider present on the exhibit floor. We take this opportunity to thank our readers and contributors who stopped by our booth to learn about our plans for this year … [Read more...]
Recent Research in TIMs
Please find below some recent research in Thermal Interface Materials (TIMs). Low melting alloy composites as thermal interface materials with low thermal resistance Haoran Wen, Yaqiang Ji Kai Zhang, Matthew M.F. Yuen, S.W. Ricky Lee, Xian-Zhu Fu, Rong Sun & Ching-Ping Wong Low melting alloy is mixed with Cu filler as thermal interface materials. The thermal … [Read more...]
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