Product: EP29LPTCHT Release Date: 11/21/2019 Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications. It does not need excessive heat for curing and has a long working life at room temperature. This system is electrically insulative and thermally conductive with very fine particle … [Read more...]
Low Compression Force Sarcon
Carteret, NJ — The compression characteristics of thermal gap fillers should be key considerations during a product’s early design phase. For applications that have delicate components or widely varying gap distances, Fujipoly® created a line of Low Compression Force gap filler pads. These TIMs help avoid overstressing the printed circuit board (PCB) and fragile solder joints … [Read more...]
125-19(SP)C-A Flexible, Non-flammable, High Conductive Temperature Resistant Conductive Ink and Coating
Ayer, MA, October 2019 Creative Materials introduces 125-19(SP)C, a flexible, non-flammable, high temperature resistant conductive ink and coating. This product features excellent bonding to most metal and plastic substrates and has the unique characteristic of bonding well to silicone. A key advantage of this product is that it is non-flammable, in contrast to most products … [Read more...]
Laird Introduces IceKap™ P30000, a Novel, Non-Silicone, High Performance Thermal Interface Material for Lidded and Non-lidded Device Applications
Improving Thermal Performance and Device Reliability September 5, 2019 – Cleveland, Ohio, USA – Laird Performance Materials, a global manufacturer enabling and protecting sensitive electronics, has introduced IceKap™ P30000, a silicone-free, high performance thermal interface material (TIM) which takes advantage of a new polymer … [Read more...]
Using Electrical Capacitance to Evaluate the Thermal Mechanical Stability of Thermal Interface Materials
BY: Lauren Boston, Andrew Yu, Timothy Chainer, Edward Yarmchuk, and Michael Gayness To improve cooling of electronic components, a heat spreader is typically attached to the component to spread the heat laterally and facilitate the heat removal by a heat sink. To ensure good thermal conduction between the heat spreader and heatsink, a thermal interface material is applied … [Read more...]
