The SEMI-THERM 42 Symposium was held March 9-12, 2026 at the Double Tree Hotel in San Jose, CA. Program organization was led by General Chair Dr. Navid Kazem (Arieca), Program Chair Dr. Claire Wemp (Qnity), and Program Vice Chair Dr. Mohamed Abo-Ras (Nanotest). It featured technical short courses, technical sessions, invited presentations, vendor exhibits and workshops, a panel … [Read more...]
From Materials to Manufacturing: A System-Level Approach to Thermal Management
Executive Summary Thermal management is becoming a defining factor in system performance across advanced electronics. Demand is accelerating in AI and high-performance computing, data center infrastructure, electric vehicles, semiconductors, industrial systems, and other high-reliability applications, where increasing power density and extended operating cycles place sustained … [Read more...]
Save Your Seat for Thermal Live Spring 2026, May 19
Registration is open for Thermal Live Spring 2026 Join Electronics Cooling on May 19 for a day of technical sessions and product demos focused on real-world thermal challenges. Register Now Thermal Live Spring 2026 brings together hundreds of engineers and technology leaders to share practical insight into the latest advances in cooling, materials, and system … [Read more...]
Benefits of Boron Nitride Thermal Pads
Thermal interface materials (TIMs) must reduce interfacial thermal resistance while withstanding stresses such as vibration and humidity. Traditional TIMs cannot meet this requirement. Thermal paste, for example, performs well with micron-level surface matching and precise clamping, but is prone to contamination and increases the difficulty of automated assembly. Ordinary … [Read more...]
Vapor Chambers vs. Thermal Pads: How to Choose the Right Thermal Solution for High-Performance Electronics
Thermal management has become one of the defining challenges in modern electronics design. Across data centers, AI and machine learning hardware, power electronics, and compact consumer devices, heat generation continues to rise as performance expectations increase. Higher power densities, faster processing speeds, and smaller form factors are placing sustained pressure on … [Read more...]
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