A previous Electronics Cooling article, which discussed the process for analyzing the thermal performance of cooling fans [1], mentioned the need of accounting for the increasing coolant temperature as air passes through a heat sink. That article used an ‘average’ air temperature, which was defined as the midpoint between the inlet and outlet air temperatures. This article … [Read more...]
Better Cooling by Removing Material, Instead of Adding Material, to Unlock the Full Power of GaN Electronics
As society is moving from fossil fuels to more sustainable electrical power, the systems for converting and delivering this electrical power are becoming increasingly important. These power electronic systems are responsible for controlling and shaping the electricity between the sources, such as solar and wind, and the end-use destination, such as driving a motor or charging … [Read more...]
Superior Thermal Transfer from New Form-In-Place Gap Filler
Fujipoly® America announces the release of its new SARCON® SPG-70A. It is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0 W/m°K and has the lowest thermal resistance among our dispensable SPG products. When applied between heat-generating components and a nearby heat sink or spreader, the form stable thermal material completely … [Read more...]
Thermal Adhesive Tape with Extremely Low Thermal Resistance Reflects Synergistic Innovation Between DuPont and its Laird Performance Materials Acquisition
The Laird™ Ttape™ 1000A thermally conductive adhesive tape delivers best-in-class thermal resistance WILMINGTON, Del., June 3, 2022 - Laird Performance Materials, part of DuPont Interconnect Solutions, has capitalized on collaborative innovation with DuPont to introduce Laird™ Ttape™ 1000A thermally conductive adhesive tape, a standalone 50µm adhesive that offers extremely … [Read more...]
Arieca Announces $6.5M Series A Funding Round
Company will use the investment to accelerate product development and scale up manufacturing of its Liquid Metal-based thermal interface materials (TIMs). May 17, 2022 8:00 AM Eastern Daylight Time PITTSBURGH--(BUSINESS WIRE)--Arieca Inc., the leader in liquid-metal based thermal interface materials for high performance computing and high power semiconductor devices, … [Read more...]
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