Design

High-Pressure Torsion Method Could Yield More Efficient Thermoelectric Devices

July 14th, 2014

Scientists at Kyushu University in Japan have developed a novel way of reducing the thermoconductivity of crystalline silicon using high-pressure torsion that could result in a more efficient thermoelectric device. Thermoelectric energy devices, which rely…read more

Metal Organic Frameworks Applied in Layers Could Signal Cooling Revolution

June 26th, 2014

Researchers at Germany’s Fraunhofer Institute of Solar Energy Systems have developed highly-porous metal organic frameworks (MOFs) that can be applied in a thin layer to efficiently absorb large quantities of water vapor. MOFs, as determined…read more

Built-in Heat Spreading for Efficient Thermoelectric Cooling of Concentrated Heat Loads

May 29th, 2014

Jeff Hershberger, Robert Smythe, Xiaoyi Gu and Richard F. Hill Laird Technologies, Inc. INTRODUCTION Thermoelectric cooling is an active thermal management technique.  A thermoelectric cooler (TEC) has two circuit boards which are typically Al2O3 plates…read more

Solder Joint Lifetime of Rapidly Cycled LED Components

May 29th, 2014

Wendy Luiten Philips Research, Eindhoven, the Netherlands INTRODUCTION Active LEDs in a consumer TV product are boosted and dimmed with the video picture content. Boosting and dimming of the LEDs is a powerful means to…read more

Challenges in Measuring Theta jc for High Thermal Performance Packages

May 29th, 2014

Jesse Galloway and Ted Okpe Amkor Technology One of the more challenging thermal resistance measurements to make for electronic packages is the junction-to-case resistance called Theta jc. The equation for Theta jc, equation (1), is…read more

Estimating the Thermal Interaction between Multiple Side-by-Side Chips on a Multi-Chip Package

May 29th, 2014

Je-Young Chang and Ashish Gupta Intel Corporation INTRODUCTION Integration using multi-chip packaging (MCP) is an effective and popular technology option to increase transistor density in one component by integrating two or more dice or other…read more

Advances in Vapor Compression Electronics Cooling

May 29th, 2014

James Burnett Aspen Systems INTRODUCTION Over the last 10 years, there has been a well-documented increase in the energy density of electronic devices.  As this­­ energy density has gone up, so has the heat dissipation…read more

Technical Guide Offers In-Depth Product Dispensing Information

May 5th, 2014

Chomerics, a division of Parker-Hannifin Corporation, has released a new thermal interface material dispensing guide. The 16-page guide contains product and in-depth technical information on the company’s range of THERM-A-GAP gels, THERM-A-FORM cure-in-place compounds and…read more

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SEMI-THERM 30 Media

March 11th, 2014

Photos Videos Colder Products Company Discusses New Products at SEMI-THERM 30. The Bergquist Company Discusses Products at SEMI-THERM 30.

Gummy Electrolyte Could Reduce Battery Fire Hazard

March 10th, 2014

Researchers at Washington State University have developed a new conductive gum-like material that could improve the safety of lithium ion batteries. Used in laptops, smartphones and other electronic devices, lithium ion batteries are capable of…read more

TTI Analyzers Offer Low-Cost Solution for Non-Invasive Thermal Design Verification

March 7th, 2014

Microsanj, a supplier of high-resolution thermoreflectance thermal imaging systems, tools and consulting services, has announced the availability of its NT100/NT110 thermoreflectance thermal image analyzers starting at $45,000. The availability of the NT100 sub-micon spatial resolution…read more

Magnetic Refrigeration Could Replace Compressor Systems

March 7th, 2014

Researchers working in GE labs have used special magnetic materials to generate temperatures cold enough to freeze water in a breakthrough that could find its way into commercial refrigerators by the end of the decade.…read more

Ultra-Thin Titanium Based Thermal Solution for Electronic Applications

February 28th, 2014

Payam Bozorgi and George Fleischman PiMEMS, Inc. Introduction As electronic system technology advances with continual increases in requirements leading to greater demand for higher power consumption, there have been growing challenges related to the design…read more

Bitcoin 2-Phase Immersion Cooling and the Implications for High Performance Computing

February 28th, 2014

Alex Kampl Allied Control Company Abstract Recently, Bitcoin and Bitcoin mining have aroused international interest.  This article describes the cooling challenges faced by Bitcoin miners and discusses the implications on the future of cooling for…read more