Design

A Cooler Microchip Design with a Black Semiconductor

June 13th, 2016

(June 12, 2016) Researchers and scientists at the University of California-Berkeley have found that layered, crystalline black phosphorus could “lead to a new microchip design that lets heat flow away and keeps electrons moving,” said…read more

Posted in Coolers, Design, Design, Materials, Compounds, Adhesives, Substrates, News, Semiconductor | Comments Off on A Cooler Microchip Design with a Black Semiconductor

Microfluidic Cooling Could Be Answer to Heat Buildup in Microchips

June 13th, 2016

(June 4, 2016) DARPA is seeking out solutions for the massive problem of heat buildup in microchips. They think they found it in microfluidic cooling. They’ve initiated a program called ICECool Applications (Intra/Interchip Enhanced Cooling), according to…read more

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New Cooling Fan Blade Design

June 8th, 2016

Cradle has released their new simpler, faster solution for fan design, SmartBlades. SmartBlades simplifies axial cooling fan design by automating generation of blade geometry CAD data. Engineers adjust parameters for blade number, profile, and twist.…read more

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How to Choose the Right Solution for Effective Heat Management

June 7th, 2016

(June 3, 2016) Because electronics have shrunk significantly in recent years, the solutions to cool them must be adjusted. Electropages.com suggests “a case-specific analysis must be performed as each application is subject to different circumstances,”…read more

Posted in Blowers / Fans / Filters, Ceramics, Coolers, Design, Enclosures, Free Air Cooling, Heat Exchanger, Heat Pipes, Heat Sinks, Liquid Cooling, News, Research, Semiconductor | Comments Off on How to Choose the Right Solution for Effective Heat Management

Laser Storage in Data Centers Could Mean Less Heating

June 7th, 2016

(June 3, 2016) Davide Bossini from the University of Tokyo has found a possible solution to control the demand for smaller, faster, devices to store, manage, and process data in data centers without compromising cooling.…read more

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Thermoelectric Modules That Achieve Higher Heat Flux Densities For Cooling Industrial Lasers

May 23rd, 2016

Laird has recently developed a high heat flux density thermoelectric module (TEM) designed to achieve a higher heat pumping capacity than standard TEMs, called UltraTEC. “The UltraTEC Series TEM has a heat pumping capacity up…read more

Posted in Coolers, Design, Industrial, New Products, Semiconductor, TECs | Comments Off on Thermoelectric Modules That Achieve Higher Heat Flux Densities For Cooling Industrial Lasers

Recall On Overheating Laptop Battery Packs

May 17th, 2016

(March 31, 2016) Toshiba recently issued a voluntary recall on its laptop battery packs for potential burn and fire hazards from overheating. According to ConsumerReports.org, the battery packs were manufactured by Panasonic and installed in…read more

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Laptops May Start Producing Far Less Heat

May 17th, 2016

(May 10, 2016) Massachusetts Institute of Technology’s postdoc Cui-Zu Chang and his colleagues have been “working to create devices with components which have little [to no] resistance to the flow of electricity” in laptops, according…read more

Posted in Blowers / Fans / Filters, Computer, Consumer, Design, Design, Enclosures, Materials, Compounds, Adhesives, Substrates, News | Comments Off on Laptops May Start Producing Far Less Heat

Tesla Powerwall Comes with Unexpected, Loud Electronic Hum

May 9th, 2016

With the recent residential installations of Tesla’s Powerwall home battery systems, customers have been reporting an unwanted loud electronic humming sound . Breitbart.com reported, “a German customer measured a noise level from a Powerwall installed…read more

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New Material Cools Solar Cells Yet Absorbs Sunlight

May 9th, 2016

Recently, researchers from Stanford University have achieved a combination of cooling and maintaining sunlight absorption with a wafer made of silica to better cool solar cells, according to BusinessWire.com. BusinessWire.com explained, “The researchers etched tapered…read more

Posted in Automotive, Consumer, Design, Design, Industrial, Materials, Compounds, Adhesives, Substrates, News, Research, TECs | Comments Off on New Material Cools Solar Cells Yet Absorbs Sunlight

Liquid Cooling Used in New Off-Grid Power Generator and Water Purifier

May 3rd, 2016

(April 7, 2016) Watly has recently launched an Indiegogo campaign to raise the final needed funds for the release of its water sanitizing and electricity generating computer powered entirely by solar energy. The Watly 3.0…read more

Posted in Communications, Computer, Design, Liquid Cooling, News, Power | Comments Off on Liquid Cooling Used in New Off-Grid Power Generator and Water Purifier

Software Update Leads to Device Failure by Overheating

May 2nd, 2016

(April 29, 2016) The new Nextfit Robin, an Android-based smartphone, experienced a major cooling malfunction after a recent software update which resulted in the phones overheating. The device normally heats up a bit when performing everyday…read more

Posted in Blowers / Fans / Filters, Communications, Computer, Consumer, Coolers, Design, Design, News, Plastics, Power, Software/Modeling | Comments Off on Software Update Leads to Device Failure by Overheating

BIG Thermal Test for the JWST Test Model

April 25th, 2016

(April 22nd, 2016) The James Webb Space Telescope had an “observatory core” test model twin of itself constructed for the biggest thermal test Goddard mechanical integration technician, Chris Matthews, has ever had. Matthews’ team of…read more

Posted in Aerospace, Design, Design, News, Software/Modeling, Test & Measurement | Comments Off on BIG Thermal Test for the JWST Test Model

New “Form-In-Place” Product with Process Demonstration Video

April 22nd, 2016

JONES TECH recently released their newest “Form-In-Place” Product with a video that demonstrates their FIP process. Their thermal product offerings include thermal pads, thermal greases, thermal gels, phase change materials, and synthetic graphite. Jones Tech…read more

Posted in Computer, Design, Design, Materials, Compounds, Adhesives, Substrates, New Products, Thermal Imaging | Comments Off on New “Form-In-Place” Product with Process Demonstration Video