Design

Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense

May 21st, 2015

By: Dr. Alexander Yatskov; Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data…read more

Posted in Articles, Coolers, Data Centers, Design, Enclosures, Heat Exchanger, Heat Pipes | Comments Off on Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense

Data Center Energy Savings: Total Liquid Cooling versus Indirect Liquid Cooling

May 21st, 2015

By: Yong Quiang Chi, Peter Hopton and Keith Deakin, Iceotope Ltd Jonathan Summers, Alan Real, Nik Kapur and Harvey Thompson, University of Leeds Introduction Improvements in energy efficiency and performance of data centers are possible…read more

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Chinese Company Creates Data Center Tech Advances

May 12th, 2015

Shanghai Data Solution, a company owned by the Chinese government, says it is making large strides in the data center industry. “Shanghai Data Solution (SDS) built its first small network communications site in 2001, and…read more

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Thermal Foil Sheets Offer Advanced Thermal Management in Smartphones

April 13th, 2015

Angstron Materials Inc. has developed a family of thermal foil products ideal for smartphones, and other hand-held devices. The new thermal foil sheets have a thickness of from 5 um to 40 um and thermal…read more

Posted in Computer, Consumer, Design, Materials, Compounds, Adhesives, Substrates, New Products, TIMs | Comments Off on Thermal Foil Sheets Offer Advanced Thermal Management in Smartphones

ASU Engineer’s Computing Node Research Suggests Large Reduction in Energy Usage

April 7th, 2015

Carole-Jean Wu, computer scientist and engineer at Arizona State University, is gaining recognition for her work to improve energy efficiency of computing nodes, which includes everything from smartphones and tablets, to desktop processors and data…read more

Posted in Computer, Consumer, Coolers, Data Centers, Design, Heat Exchanger, Heat Sinks, News, TECs | Comments Off on ASU Engineer’s Computing Node Research Suggests Large Reduction in Energy Usage

Combination of Polymers Yields Advantages for Electronics Manufacturers and Lighting Industry

April 7th, 2015

The high cost of LED bulbs has resulted in manufacturers in the lighting industry to reduce costs and improve performance in the assembly process. Nicolas Sunderland, senior scientist, and Terry G. Davis, principal engineer of…read more

Posted in Consumer, Design, LED / Lighting, News | Comments Off on Combination of Polymers Yields Advantages for Electronics Manufacturers and Lighting Industry

Heatsink 101: Everything You Ever Wanted to Know Web Seminar

March 26th, 2015

Wednesday, April 1, 2015 2:00 PM – 3:00 PM US/Eastern Online Event This web seminar focuses on how heatsinks work and how to design a heatsink while considering all the critical factors such as size,…read more

Posted in Calendar, Design, Design, Heat Sinks | Comments Off on Heatsink 101: Everything You Ever Wanted to Know Web Seminar

Overheating Issues Stall Release of Sony’s Xperia Z4

March 24th, 2015

The release of Sony’s Xperia Z4 has been delayed due to heat dissipation issues in the Snapdragon 810 processor in the device. The Snapdragon 810 chip reportedly has overheating issues and Sony is working to…read more

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New Data Center Design Reduces Space; Increases Cooling Productivity

March 24th, 2015

One company hopes to create an entirely new design for data centers for the industry. Vapor IO introduces a new “Data Center Aisle” concept.  This vapor chamber design encompasses a room filled with round black…read more

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Clear Encapsulant Ideal for Outdoor LED Lighting Applications

March 23rd, 2015

Dow Corning introduces a new clear and reliable Encapsulant for harsh outdoor LED lighting applications. The EI-1184 Silicone Encapsulant features high transparency, high weatherability, long lasting protection in harsh outdoor and indoor environments, and protection…read more

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Circuit Card Assembly Heat Sinks Embedded With Oscillating Heat Pipes

March 20th, 2015

Joe Boswell, Chris Smoot, Elliot Short, Nate Francis Introduction In this study, lightweight two-phase heat sinks embedded with the Oscillating Heat Pipe (OHP) technology are developed for the thermal management of military circuit card assemblies…read more

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Design Optimization of a Multi-Device Single-Phase Branching Microchannel Cold Plate

March 20th, 2015

 Ercan M. Dede   INTRODUCTION Single-phase liquid cooling is an established approach to the thermal management of highly-reliable hybrid vehicle power electronics. However, as the electrification of hybrid vehicles increases, and under-hood space becomes further…read more

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Thermal Power Plane Enabling Dual-Side Electrical Interconnects for High-Performance Chip Stacks

March 20th, 2015

Thomas Brunschwiler, Gerd Schlottig, Hubert Harrer and Stefano Oggioni Abstract In this report the design and performance of a thermally enhanced laminate called thermal power plane (TPP) is reported. It enables dual-side electrical interconnects to…read more

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Application Builder Assists in Development of Simulation App

December 9th, 2014

Last month, APEI introduced its new Application Builder, and has now announced the development of a multiphysics simulation application using this application builder. This new app “allows COMSOL software users to build an intuitive interface…read more

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