Design

Design Considerations When Using Heat Pipes

August 25th, 2016

By George Meyer, Celsia Inc. Introduction This article is intended to offer design guidance when using heat pipes for the most prevalent types of electronics applications: mobile to embedded computing and server type applications with power…read more

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Webinar and Report Available On-Demand Now

August 18th, 2016

The Critical Power Expo has recently released their report and webinar on “Key Trends on the Design and Operation of Power Systems for Mission-Critical Environments” free and on-demand. The exclusive report explores the key trends…read more

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3D Printed Smartphone Case to Include Cooling Fans for Sustained Pokemon Go Play

July 19th, 2016

(July 18, 2016) A 3D printed smartphone case that may better support and cool smartphones has recently been designed and prototype printed. Made to look like a real life Pokédex, SparkFun user NPOOLE created the…read more

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Electric Cars Will Not Meet the Same Fate as HoverBoards’ Overheated Batteries

July 12th, 2016

(July 11, 2016) Where electric cars and hoverboards both use lithium-ion cells, electric cars will have a more diligent manufacturing process and thus more heat control. According to blog CarAndDriver.com, “Automotive-grade cells are very, very…read more

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3D Printed Heat Sink Performs as Well as Conventional Heat Sinks with Annealing Process

July 12th, 2016

(July 8, 2016) Recently, Tong Wu, of the University of Tennessee and Oak Ridge National Laboratory, led a team of researchers who have discovered that manufacturers can create 3D printed heat sinks that can perform…read more

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Calculation Corner: Estimating The Effect Of Flow Bypass On Parallel Plate-Fin Heat Sink Performance

July 8th, 2016

by Bob Simons – Reprinted from ElectronicsCooling, Feb., 2004 [Formatted by B. Guenin, 4/4/16] In past issues of ElectronicsCooling, methodologies were presented for estimating parallel plate-fin heat sink thermal resistance [1] and pressure drop [2].…read more

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Thermal Facts and Fairy Tales: Understanding and Defining Electronics Cooling Requirements

July 8th, 2016

Jim Wilson My experience in electronics cooling has taught me that it is often a fairy tale that thermal engineers fully understand requirements related to their designs and analyses, or that they fully understand the…read more

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New Software Creates Heat Sink Geometries

July 5th, 2016

From Cradle, HeatDesigner is a fast, efficient, and easy to use thermal analysis tool for electronics cooling. It includes a one time saving feature, a Parametric Study Tool, and plate heat sink creation. With a…read more

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Liquid Cooled Data Center with More Power and No Leakage

July 5th, 2016

(June 29, 2016) Recently, eBay, Dell, and Intel claimed to have made “major strides in channeling the potential of liquid cooling” to enable greater processing power without excessive consumption “that could have implications for the…read more

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Special Design of All-Electric Supercar is Efficient Cooling Step Forward

June 28th, 2016

(June 27, 2016) In a recent interview with Faraday Future’s head of global design, Richard Kim explained their new FFZERO1 Concept car’s efficient cooling platform. “With the FFZERO1 we looked to push the limit in…read more

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A Cooler Microchip Design with a Black Semiconductor

June 13th, 2016

(June 12, 2016) Researchers and scientists at the University of California-Berkeley have found that layered, crystalline black phosphorus could “lead to a new microchip design that lets heat flow away and keeps electrons moving,” said…read more

Posted in Coolers, Design, Design, Materials, Compounds, Adhesives, Substrates, News, Semiconductor | Comments Off on A Cooler Microchip Design with a Black Semiconductor

Microfluidic Cooling Could Be Answer to Heat Buildup in Microchips

June 13th, 2016

(June 4, 2016) DARPA is seeking out solutions for the massive problem of heat buildup in microchips. They think they found it in microfluidic cooling. They’ve initiated a program called ICECool Applications (Intra/Interchip Enhanced Cooling), according to…read more

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New Cooling Fan Blade Design

June 8th, 2016

Cradle has released their new simpler, faster solution for fan design, SmartBlades. SmartBlades simplifies axial cooling fan design by automating generation of blade geometry CAD data. Engineers adjust parameters for blade number, profile, and twist.…read more

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How to Choose the Right Solution for Effective Heat Management

June 7th, 2016

(June 3, 2016) Because electronics have shrunk significantly in recent years, the solutions to cool them must be adjusted. Electropages.com suggests “a case-specific analysis must be performed as each application is subject to different circumstances,”…read more

Posted in Blowers / Fans / Filters, Ceramics, Coolers, Design, Enclosures, Free Air Cooling, Heat Exchanger, Heat Pipes, Heat Sinks, Liquid Cooling, News, Research, Semiconductor | Comments Off on How to Choose the Right Solution for Effective Heat Management