Application Builder Assists in Development of Simulation App

December 9th, 2014

Last month, APEI introduced its new Application Builder, and has now announced the development of a multiphysics simulation application using this application builder. This new app “allows COMSOL software users to build an intuitive interface…read more

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November 25th, 2014

THERMAL LIVE 2015 October 6 – 8, 2015 Online Event Featuring practical thermal management techniques and topics, this event includes roundtables, webinars and videos; and there’s no cost to attend. Program Highlights: LED Design Data…read more

Graphene Improves Touchscreen Technology

October 10th, 2014

Most touch screen technology in electronic devices today, such as smartphones and tablets, are made of an expensive and inflexible material known as Indium Tin Oxide. A group of researchers from the University of Surrey…read more

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Physicists and Researchers Encounter New Discovery

September 22nd, 2014

A team of researchers at the University of Arkansas teamed up with a group of physicist from all over the world and have discovered important results after heating graphene. The teams discovered that by heating…read more

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Webinar on, “Thermal RC Modeling Using a Spreadsheet”

August 26th, 2014

Overview: In this webinar, we will take a look at thermal analysis and modeling using nothing more than your every-day spreadsheet program. In particular, we will focus on Foster-ladder thermal RC models, including how to…read more

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Webinar on, “Linear Superposition: Tutorial on Thermal-RC Networks”

August 26th, 2014

Overview This 45-minute seminar will show how some basic concepts of transient analysis of linear thermal systems can be applied to a real-world thermal system design. The mathematical concepts utilized will be presented as principles,…read more

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Electronics Cooling September 2014 Issue Now Online

August 19th, 2014

Don’t miss out on the September 2014 issue of Electronics Cooling, which includes feature articles on CVD Diamond – Integrating a Superior Thermal Material; An Inexpensive Multi-channel AC Heater Control System; Jet Impingement on Micro Pin…read more

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High-Pressure Torsion Method Could Yield More Efficient Thermoelectric Devices

July 14th, 2014

Scientists at Kyushu University in Japan have developed a novel way of reducing the thermoconductivity of crystalline silicon using high-pressure torsion that could result in a more efficient thermoelectric device. Thermoelectric energy devices, which rely…read more

Metal Organic Frameworks Applied in Layers Could Signal Cooling Revolution

June 26th, 2014

Researchers at Germany’s Fraunhofer Institute of Solar Energy Systems have developed highly-porous metal organic frameworks (MOFs) that can be applied in a thin layer to efficiently absorb large quantities of water vapor. MOFs, as determined…read more

Built-in Heat Spreading for Efficient Thermoelectric Cooling of Concentrated Heat Loads

May 29th, 2014

Jeff Hershberger, Robert Smythe, Xiaoyi Gu and Richard F. Hill Laird Technologies, Inc. INTRODUCTION Thermoelectric cooling is an active thermal management technique.  A thermoelectric cooler (TEC) has two circuit boards which are typically Al2O3 plates…read more

Solder Joint Lifetime of Rapidly Cycled LED Components

May 29th, 2014

Wendy Luiten Philips Research, Eindhoven, the Netherlands INTRODUCTION Active LEDs in a consumer TV product are boosted and dimmed with the video picture content. Boosting and dimming of the LEDs is a powerful means to…read more

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Challenges in Measuring Theta jc for High Thermal Performance Packages

May 29th, 2014

Jesse Galloway and Ted Okpe Amkor Technology One of the more challenging thermal resistance measurements to make for electronic packages is the junction-to-case resistance called Theta jc. The equation for Theta jc, equation (1), is…read more

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Estimating the Thermal Interaction between Multiple Side-by-Side Chips on a Multi-Chip Package

May 29th, 2014

Je-Young Chang and Ashish Gupta Intel Corporation INTRODUCTION Integration using multi-chip packaging (MCP) is an effective and popular technology option to increase transistor density in one component by integrating two or more dice or other…read more

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Advances in Vapor Compression Electronics Cooling

May 29th, 2014

James Burnett Aspen Systems INTRODUCTION Over the last 10 years, there has been a well-documented increase in the energy density of electronic devices.  As this­­ energy density has gone up, so has the heat dissipation…read more

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