Design

Heatsink 101: Everything You Ever Wanted to Know Web Seminar

March 26th, 2015

Wednesday, April 1, 2015 2:00 PM – 3:00 PM US/Eastern Online Event This web seminar focuses on how heatsinks work and how to design a heatsink while considering all the critical factors such as size,…read more

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Overheating Issues Stall Release of Sony’s Xperia Z4

March 24th, 2015

The release of Sony’s Xperia Z4 has been delayed due to heat dissipation issues in the Snapdragon 810 processor in the device. The Snapdragon 810 chip reportedly has overheating issues and Sony is working to…read more

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New Data Center Design Reduces Space; Increases Cooling Productivity

March 24th, 2015

One company hopes to create an entirely new design for data centers for the industry. Vapor IO introduces a new “Data Center Aisle” concept.  This vapor chamber design encompasses a room filled with round black…read more

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Clear Encapsulant Ideal for Outdoor LED Lighting Applications

March 23rd, 2015

Dow Corning introduces a new clear and reliable Encapsulant for harsh outdoor LED lighting applications. The EI-1184 Silicone Encapsulant features high transparency, high weatherability, long lasting protection in harsh outdoor and indoor environments, and protection…read more

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Circuit Card Assembly Heat Sinks Embedded With Oscillating Heat Pipes

March 20th, 2015

Joe Boswell, Chris Smoot, Elliot Short, Nate Francis Introduction In this study, lightweight two-phase heat sinks embedded with the Oscillating Heat Pipe (OHP) technology are developed for the thermal management of military circuit card assemblies…read more

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Design Optimization of a Multi-Device Single-Phase Branching Microchannel Cold Plate

March 20th, 2015

 Ercan M. Dede   INTRODUCTION Single-phase liquid cooling is an established approach to the thermal management of highly-reliable hybrid vehicle power electronics. However, as the electrification of hybrid vehicles increases, and under-hood space becomes further…read more

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Thermal Power Plane Enabling Dual-Side Electrical Interconnects for High-Performance Chip Stacks

March 20th, 2015

Thomas Brunschwiler, Gerd Schlottig, Hubert Harrer and Stefano Oggioni Abstract In this report the design and performance of a thermally enhanced laminate called thermal power plane (TPP) is reported. It enables dual-side electrical interconnects to…read more

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Application Builder Assists in Development of Simulation App

December 9th, 2014

Last month, APEI introduced its new Application Builder, and has now announced the development of a multiphysics simulation application using this application builder. This new app “allows COMSOL software users to build an intuitive interface…read more

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THERMAL LIVE 2015

November 25th, 2014

THERMAL LIVE 2015 October 6 – 8, 2015 Online Event Featuring practical thermal management techniques and topics, this event includes roundtables, webinars and videos; and there’s no cost to attend. Program Highlights: LED Design Data…read more

Graphene Improves Touchscreen Technology

October 10th, 2014

Most touch screen technology in electronic devices today, such as smartphones and tablets, are made of an expensive and inflexible material known as Indium Tin Oxide. A group of researchers from the University of Surrey…read more

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Physicists and Researchers Encounter New Discovery

September 22nd, 2014

A team of researchers at the University of Arkansas teamed up with a group of physicist from all over the world and have discovered important results after heating graphene. The teams discovered that by heating…read more

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Webinar on, “Thermal RC Modeling Using a Spreadsheet”

August 26th, 2014

Overview: In this webinar, we will take a look at thermal analysis and modeling using nothing more than your every-day spreadsheet program. In particular, we will focus on Foster-ladder thermal RC models, including how to…read more

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Webinar on, “Linear Superposition: Tutorial on Thermal-RC Networks”

August 26th, 2014

Overview This 45-minute seminar will show how some basic concepts of transient analysis of linear thermal systems can be applied to a real-world thermal system design. The mathematical concepts utilized will be presented as principles,…read more

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Electronics Cooling September 2014 Issue Now Online

August 19th, 2014

Don’t miss out on the September 2014 issue of Electronics Cooling, which includes feature articles on CVD Diamond – Integrating a Superior Thermal Material; An Inexpensive Multi-channel AC Heater Control System; Jet Impingement on Micro Pin…read more

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