Design

New Materials Technology Brochure Released

July 1st, 2015

Thermacore, Inc. released a new materials technology brochure which offers information about the company’s Materials Technology Division (MTD) including material development and processing capabilities. Some of the capabilities, products and services discussed in the brochure include…read more

Posted in Design, Design, Materials, Compounds, Adhesives, Substrates, New Products, Test & Measurement | Comments Off on New Materials Technology Brochure Released

German Associations to Research Efficient Car Battery Charging

June 30th, 2015

A group of companies and universities in Germany will research how car batteries can be charged more efficiently for a project called Luftstrom.  The project focuses on using new semiconductors and water cooling to increase…read more

Posted in Automotive, Consumer, Coolers, Design, Liquid Cooling, News, Research, Semiconductor | Comments Off on German Associations to Research Efficient Car Battery Charging

Discovered Material May Reduce Heat Buildup in Computer Chips

June 23rd, 2015

Researchers conducting x-ray studies at the U.S. Department of Energy’s SLAC National Accelerator Laboratory have observed a possible solution for reducing heat buildup in computer chips for the first time. The team observed “an exotic…read more

Posted in Computer, Consumer, Design, Design, Heat Exchanger, Materials, Compounds, Adhesives, Substrates, News, Power, Research | Comments Off on Discovered Material May Reduce Heat Buildup in Computer Chips

Liquid-cooled Superchargers Yield Faster Charging for Electric Cars

June 23rd, 2015

Tesla Motors introduces new liquid-cooled supercharging stations for its electric cars that offer faster charging and increase traveling range. Tesla’s Model S luxury sedan can now charge fully in only 30 minutes and its range…read more

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University Installs Liquid-cooling Solution

June 23rd, 2015

CoolIT Systems has successfully installed its liquid cooling DCLC rack at the Center for Biological Sequence Analysis at the Technical University of Denmark (DTU). The DCLC rack uses waste heat and converts it into usable…read more

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Reducing Reliance on Water for Cooling in Data Centers

June 9th, 2015

The severe drought in California has spiked concerns about the availability of water to operate data centers. Since water is extremely important for cooling facilities, other approaches of water usage in data centers reportedly need…read more

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Researchers Successfully Measure Thermoelectric Behavior for the First Time

June 9th, 2015

A team from Sandia National Laboratories has made the first measurement of thermoelectric behavior via nanoporous metal-organic framework (MOF). This discovery could produce a new class of materials in the future that would improve upon…read more

Posted in Computer, Consumer, Coolers, Design, Design, Heat Exchanger, Materials, Compounds, Adhesives, Substrates, News, Power, Research, TECs, Test & Measurement | Comments Off on Researchers Successfully Measure Thermoelectric Behavior for the First Time

Qualcomm Refutes Overheating Rumors

June 2nd, 2015

In March 2015, Sony’s Xperia Z4 reportedly experienced overheating issues in the Snapdragon 810 processor inside the device.  (Read original article here). The issue began when ArsTechnica tested and confirmed that the Snapdragon 808 runs…read more

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Largest Data Center in Asia to be Completed in July 2015

June 2nd, 2015

LG U+, a telecommunications company in Gyeonggi, South Korea, announced its mega data center will be completed in Pyeongchon in July 2015. When completed, it will be the largest data center in Asia and the…read more

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Optical Transport Could Replace Wires in Computers

June 2nd, 2015

An article published in Nature Photonics announces a breakthrough in creating faster and more efficient computers. Instead of using wires/electricity to send data back and forth in computers, the Stanford team, including electrical engineer Jelena…read more

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Doctoral Candidate’s Research Could Improve Efficiency of Data Centers

May 26th, 2015

Husam Alissa, a Binghamton University doctoral candidate in mechanical engineering, has been working to improve the efficiency of data centers at the university’s Center for Energy-Smart Electronic Systems (ES2). Alissa’s work focuses on reducing overheating,…read more

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Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense – Extended Article

May 26th, 2015

Dr. Alexander Yatskov Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center…read more

Posted in Articles, Blowers / Fans / Filters, CFD Software, Coolers, Data Centers, Design, Design, Enclosures, Free Air Cooling, Heat Exchanger, Heat Pipes, Heat Sinks, Liquid Cooling, Refrigeration | Comments Off on Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense – Extended Article

Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense

May 21st, 2015

By: Dr. Alexander Yatskov; Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data…read more

Posted in Articles, Coolers, Data Centers, Design, Enclosures, Heat Exchanger, Heat Pipes | Comments Off on Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense

Data Center Energy Savings: Total Liquid Cooling versus Indirect Liquid Cooling

May 21st, 2015

By: Yong Quiang Chi, Peter Hopton and Keith Deakin, Iceotope Ltd Jonathan Summers, Alan Real, Nik Kapur and Harvey Thompson, University of Leeds Introduction Improvements in energy efficiency and performance of data centers are possible…read more

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