TECs

Thermal Facts and Fairy Tales: A System Perspective for Electronics Cooling

June 16th, 2013

A friend of mine who was an aspiring plumber once stated that all you need to know to be a plumber is that you get paid on Friday and that waste flows downhill. Maybe there…read more

“Transverse” Thermoelectric Effect May Lead to Better Cooling Devices

June 10th, 2013

Northwestern University researchers are investigating the possibility of vertical heat transport for better cooling devices. A new paper published in Physical Review Letters by researchers at Northwestern University in Illinois explores the idea of using…read more

Temperature Controller for Thermoelectric Modules and Supplemental Resistive Heaters

May 17th, 2013

Oven Industries, a supplier of custom temperature controllers and sensors for a variety of industries, has released the new 5R7-001 PID bi-directional temperature controller for independent thermoelectric modules or for use in conjunction with auxiliary…read more

Programmable Digital Temperature Control for Electronic Enclosures

May 17th, 2013

EIC Solutions Inc., a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has released a digital temperature control (DTC) for fine-tuned temperature control inside air-conditioned electronic enclosures. “[While] our standard bimetallic thermostat meets…read more

Nanoscale Heat Transfer Research Awarded Air Force Grant

April 22nd, 2013

An Arizona State University engineer has been awarded a grant from the U.S. Air Force Office of Scientific Research for nanoscale heat transfer research that could help improve thermoelectric devices and thermal barrier coatings. An…read more

Thermoelectric Air Conditioner for Use in Mobile Military and Defense Applications

April 5th, 2013

Thermoelectric air conditioner manufacturer EIC Solutions, Inc. has released the ThermoTEC 145 series 1500 BTU military-grade air conditioner for use in transit cases for mobile military and defense applications. According to Jamie Alletag, EIC Solutions…read more

Refrigerator Super-Cools Advanced Sensors Using Quantum Physics

March 25th, 2013

A tiny solid-state refrigerator that employs quantum physics in micro- and nanostructures to cool larger objects to extremely low temperatures has been demonstrated by researchers at the National Institute of Standards and Technology (NIST). According…read more

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Advanced Circuitry Option for Thermoelectric Cooling Unit Enables Maximum Cooling Output “Regardless of Available Power Supply or Integrity of Voltage Flow”

March 8th, 2013

EIC Solutions, Inc., a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has announced the availability of an advanced circuitry engineering option for the company’s thermoelectric cooling units that enables “maximum cooling output…read more

Laird Technologies Acquires Thermoelectric Technology Developer Nextreme Thermal Solutions

February 22nd, 2013

Laird Technologies, a developer of components and solutions for electromagnetic interference protection and thermal protection of electronics, has announced the acquisition of U.S.-based manufacturer of thin-film thermoelectric technologies Nextreme Thermal Solutions. Though Nextreme and Laird…read more

Researchers Enhance Thermoelectric Device Efficiency with Embedded Nanoparticles

February 7th, 2013

Researchers at the Massachusetts Institute of Technology (MIT) and Rutgers University have developed a new method of enhancing the efficiency of thermoelectric devices using embedded nanoparticles, structures created by embedding one material into another. The…read more

3200 BTU Thermoelectric Air Conditioner

August 6th, 2012

EIC Solutions has introduced a 3,200 BTU thermoelectric air conditioner. The new air conditioner employs 50 percent more thermoelectric chips (TECs) with a minimal change in the overall dimensions of the unit. The footprint is…read more

Research Program Attempts Embedded Cooling

June 11th, 2012

DARPA’s Intrachip/Interchip Enhanced Cooling (ICECool) program seeks to explore embedded thermal management by bringing microfluidic cooling inside the substrate, chip or package by including thermal management in the earliest stages of electronics design. This embedded…read more

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New Panel Coolers Decrease Noise Level

June 11th, 2012

Nex Flow™ Air Products introduces a simple and inexpensive solution to heat related problems in Industrial Control Enclosures while addressing the increasing concern about noise levels in the work environment. Silent X-Stream ™ Frigid –X™…read more

Thin-film TEC Improves Cooling Performance

June 11th, 2012

Nextreme Thermal Solutions announced the availability of new thin-film thermoelectric cooling products that offer 55°C of cooling performance at an ambient temperature of 25°C. This new level of performance translates to improved cooling efficiency, lower…read more