Posts tagged ALSiC

Future trends in heat sink design

February 1st, 2001

In today’s electronics equipment, total system dissipated power levels are increasing with every new design. Increases in power levels combined with the market expectation of reduced package sizes lead to heat problems that, if uncontrolled,…read more

Posted in Blowers / Fans / Filters, Ceramics, Coolers, Design, Heat Pipes, Heat Sinks, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, Test & Measurement | 4 Comments »

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