In today’s electronics equipment, total system dissipated power levels are increasing with every new design. Increases in power levels combined with the market expectation of reduced package sizes lead to heat problems that, if uncontrolled,…read more
Future trends in heat sink design
February 1st, 2001
Posted in Blowers / Fans / Filters, Ceramics, Coolers, Design, Heat Pipes, Heat Sinks, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, Test & Measurement | 1 Comment »
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