Warpage of FC-PBGA Packages Flip chip technology has emerged as an important chip-level package solution to meet the ever-increasing demand of high I/O requirements. The flip chip technology was implemented originally for a multi-layer ceramic…read more
Optical Measurement Of Flip-Chip Package Warpage And Its Effect On Thermal Interfaces
February 1st, 2003
Posted in Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement, TIMs | No Comments »
Interaction of the system and module-level thermal phenomena- a flip-chip/BGA example
May 1st, 1998
Fig. 1: Levels in a computer environment. Introduction Increasing demands for higher performance in microprocessors have a direct effect on chip power and heat generation. Increased function and miniaturization of the packages result in thermal…read more
Posted in Blowers / Fans / Filters, Computer, Data Centers, Design, Heat Sinks, IT Products, Semiconductor, Test & Measurement | No Comments »
Packaging: designing for thermal performance
May 1st, 1997
Figure 1. Various leadframe and BGA packages Introduction The well-established trend within the electronics industry to provide everincreasing computing power at less cost seems to defy the laws of economics.However, this industry has not been…read more
Posted in Design | No Comments »
Recent Posts
- Apple Releases Software Update to Fix Fan Speed Problem in 2013 Retina MacBook Pro Models
- Asetek Files Patent Infringement Lawsuit Against Cooler Master
- Thermally Conductive Acrylic Interface Pads Provide ‘Excellent Conformability’ and ‘Compressive Stress Relaxation’
- Electronics Cooling Simulation Software Enables ‘Earlier Virtual Prototyping’, ‘Fewer Design Iterations’ in MDA and EDA Domains
- Special Evening Program at SEMI-THERM March 20
- Workshop on Composite Preforms at SEMI-THERM
- Fourth Quarter Financial Results Conference Call
- Heat Transfer at ‘Any Temperature’ Makes Thermal Interface Film Suitable for Cold Plate Applications
Latest Issue
Don’t miss out on
the March 2013 issue
of Electronics Cooling, which includes feature articles on the Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, and more.
View Issue »
Popular Posts
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 2 comment(s)
- The Seebeck Coefficient 3 comment(s)
- The Thermal Conductivity of Moist Air 5 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Heat pipes for electronics cooling applications 8 comment(s)
- Notes on Using Thermocouples 11 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 11 comment(s)
- Thermal Conductivity of Solders 2 comment(s)
