Introduction Small-channel heat sinks provide an extremely compact and efficient vehicle for dissipation of large heat fluxes typically found in high power electronics. Fluid flow and heat transfer in small-sized channels, with hydraulic diameters on…read more
a case study to demonstrate the trade-offs between liquid and two-phase cooling schemes for small-channel heat sinks in high heat flux applications
April 30th, 2010
Posted in Applications, Heat Sinks, Liquid Cooling | No Comments »
Back to the Future with a Liquid Cooled Supercomputer
August 1st, 2009
Introduction: Evolution of Air and Water Cooling for Electronic Systems Since the development of the first electronic digital computers in the 1940s, efficient removal of heat has played a key role in insuring the reliable…read more
Posted in Coolers, Liquid Cooling | No Comments »
Packaging Challenges For High Heat Flux Devices
August 1st, 2006
Introduction It comes as no surprise to anyone in our industry that device power levels are increasing to support customer expectations of ever greater functionality and performance. The greatest thermal challenges in computing occur in…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement, TIMs | No Comments »
Heat transfer measurements in electronics cooling applications
September 1st, 1998
Introduction Increased performance in electronic systems along with higher packaging densities have made temperature a critical parameter. Measurements of temperature, velocity and heat transfer in electronic systems are challenging due to complex materials, configurations, and…read more
Posted in Design, Test & Measurement | No Comments »
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