Posts tagged heat flux

a case study to demonstrate the trade-offs between liquid and two-phase cooling schemes for small-channel heat sinks in high heat flux applications

April 30th, 2010

Introduction Small-channel heat sinks provide an extremely compact and efficient vehicle for dissipation of large heat fluxes typically found in high power electronics. Fluid flow and heat transfer in small-sized channels, with hydraulic diameters on…read more

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Back to the Future with a Liquid Cooled Supercomputer

August 1st, 2009

Introduction: Evolution of Air and Water Cooling for Electronic Systems Since the development of the first electronic digital computers in the 1940s, efficient removal of heat has played a key role in insuring the reliable…read more

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Packaging Challenges For High Heat Flux Devices

August 1st, 2006

Introduction It comes as no surprise to anyone in our industry that device power levels are increasing to support customer expectations of ever greater functionality and performance. The greatest thermal challenges in computing occur in…read more

Posted in Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement, TIMs | Comments Off

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Heat transfer measurements in electronics cooling applications

September 1st, 1998

Introduction Increased performance in electronic systems along with higher packaging densities have made temperature a critical parameter. Measurements of temperature, velocity and heat transfer in electronic systems are challenging due to complex materials, configurations, and…read more

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