Posts tagged High Power

Calculation Corner: Thermal Interactions Between High-Power Packages and Heat Sinks, Part 1

December 6th, 2010

Bruce Guenin, PhD Associate Technical Editor The need to accommodate increasing chip power has led to improved package and heat sink designs having much lower thermal resistance values than previously. This has led to challenges…read more

Posted in Calculation Corner, Heat Sinks | No Comments »

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Cooling Options And Challenges Of High Power Semiconductor Modules

November 1st, 2006

Introduction Trends in power electronics systems and devices over the last decade have placed increasing demands on the efficiencies of the thermal management systems used for power Metal Oxide Semiconductor Field-Effect Transistor (MOSFET) and Insulated…read more

Posted in Automotive, Design, Heat Sinks, Liquid Cooling, Power, Semiconductor | No Comments »

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Critical Cooling Issues in High Power Radio Frequency Transmitter Amplifiers

May 1st, 2004

Introduction While emerging methodologies correctly insist that thermal engineers should be involved right from the early conceptual stages of electronics product design [1], many situations still require thermal analysis well after the introduction of the…read more

Posted in Aerospace, Communications, Defense, Design, Heat Sinks, Power, Test & Measurement, TIMs | No Comments »

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Numerical Modeling and Experimental Verification of High-density Servers

November 1st, 2002

High-density hardware and software are developed as part of an initiative to greatly increase data center compute densities. Concept systems presented here are based on the Intel® Itanium™ processor family and are designed for a…read more

Posted in Blowers / Fans / Filters, Computer, Design, Heat Sinks, IT Products, Power, Semiconductor, Test & Measurement | No Comments »

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