Bruce Guenin, PhD Associate Technical Editor The need to accommodate increasing chip power has led to improved package and heat sink designs having much lower thermal resistance values than previously. This has led to challenges…read more
Calculation Corner: Thermal Interactions Between High-Power Packages and Heat Sinks, Part 1
December 6th, 2010
Posted in Calculation Corner, Heat Sinks | No Comments »
Cooling Options And Challenges Of High Power Semiconductor Modules
November 1st, 2006
Introduction Trends in power electronics systems and devices over the last decade have placed increasing demands on the efficiencies of the thermal management systems used for power Metal Oxide Semiconductor Field-Effect Transistor (MOSFET) and Insulated…read more
Posted in Automotive, Design, Heat Sinks, Liquid Cooling, Power, Semiconductor | No Comments »
Critical Cooling Issues in High Power Radio Frequency Transmitter Amplifiers
May 1st, 2004
Introduction While emerging methodologies correctly insist that thermal engineers should be involved right from the early conceptual stages of electronics product design [1], many situations still require thermal analysis well after the introduction of the…read more
Posted in Aerospace, Communications, Defense, Design, Heat Sinks, Power, Test & Measurement, TIMs | No Comments »
Numerical Modeling and Experimental Verification of High-density Servers
November 1st, 2002
High-density hardware and software are developed as part of an initiative to greatly increase data center compute densities. Concept systems presented here are based on the Intel® Itanium™ processor family and are designed for a…read more
Posted in Blowers / Fans / Filters, Computer, Design, Heat Sinks, IT Products, Power, Semiconductor, Test & Measurement | No Comments »
Recent Posts
- New Business Development Specialist Seeks Position
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- Software Suite Handles Massive Data Flows Generated by Thermal Sensors
- Nanolaser Technology Room-Temperature Breakthrough Could Facilitate Faster Computer Operation
- Nanoscale Heat Transfer Research Awarded Air Force Grant
- Thermal Characterization Tools for Testing and Evaluation of TIM Materials
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