2026 Spring Issue
New Issue of Electronics Cooling is Now Available
Released four times yearly, Electronics Cooling is your guide to thermal management news, best practices, and emerging technologies.
The first release this year includes all the insights, updates, events, and expertise you expect from Electronics Cooling. Specifically, you’ll find these features and more:
- Editorial: Thermal management is the linchpin of electronic innovation (Victor Chiriac, PhD, Associate Technical Editor)
- Alternative Battery Module Configuration for Fast Thermal Runaway Detection with a Reduced Number of Temperature Sensors
- High Performance Copper Tungsten Cold Plates for Direct-to-Chip Single-Phase Liquid Cooling
- The Physics of Cooling in Confined Spaces
- Monte-Carlo as a Tool for Robust Thermal Design
- Summary of InterPack 2025
- Upcoming Cooling Events
Download Your FREE Copy Today!
