Thermal energy transfer associated with a change of phase can be a valuable phenomenon for engineers designing systems for electronics cooling. Solid to liquid phase change materials were described in the May 2005 Technical Data column and the topic for this issue is liquid to vapor phase change. The energy required to change a substance from a liquid state to a vapor state is … [Read more...]
A Simple Method to Estimate the Physical Characteristics of a Thermoelectric Cooler from Vendor Datasheets
Introduction A thermoelectric cooler (TEC) is a solid-state refrigerator that operates on the Peltier effect. The absence of moving parts, compact size, precise temperature control ability and reliability all combine to make the TEC a unique refrigerator. TECs find application [1, 2] in many fields from simple food and beverage coolers for an afternoon picnic to extremely … [Read more...]
Thermal Conductivity Of Liquid Metals
This column deals with the thermal conductivity and melting points of liquid metals. Thinking about liquid metals, many people associate them with high temperatures. It is not widely known that some metallic alloys are liquid below 0�C, with the exception of course of mercury which was already known in ancient times. China's first emperor is said to have been buried in rivers … [Read more...]
On The Hate/Love Relationship Between The U.S. And SI
Last year I devoted some words on correligion: the religious belief in the usefulness of correlations to solve real-life problems. I forgot to mention that correlations have one big advantage; they are dimensionless meaning that they are the same for everyone, including people from outside the US. Unfortunately this is not the case for most common units, and the struggle for … [Read more...]
On The Challenges of Thermal Characterization of High-Power, High-Brightness LED Packages
Introduction In recent years, high-power, high-brightness Light Emitting Diodes (LEDs) have penetrated into an ever-increasing number of lighting applications. For such devices, maintaining a low die temperature is becoming a huge challenge because of the escalating power density (e.g., 200-300 W/cm2 for the latest generation). Active cooling solutions are rarely considered as … [Read more...]
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