Introduction Readers of ElectronicsCooling know about the rapid pace of technological developments towards an increasingly higher level of miniaturization and, hence, an incredible increase of dissipation power densities. Thus, restating some very well known facts (such as, we have already attained a level of power density that is comparable to nuclear power stations) would not … [Read more...]
Heat Spreading: Not a Trivial Problem
Introduction Heat spreading is essentially area enlarging: the larger the area, the more heat can be removed at the same temperature difference (subject to certain limits). Unfortunately, except for the simplest of cases, the equations describing heat spreading physics do not have an explicit mathematical solution. Hence, we have to rely on clever approximations or suitable … [Read more...]
Estimating Dew Point Temperature For Water Cooling Applications
Over the past several years thermal engineers and others in the computer industry have become acutely aware of the challenge of increasing power dissipation and the potential of liquid (principally water) cooling to provide a thermal management solution. A number of articles in ElectronicsCooling have addressed both the issue of increased power dissipation [1-4] and various … [Read more...]
2U Rack Mountable Vapor Compression Cooling System For High Power Electronics
Vapor compression refrigeration has long been used to cool telecommunications equipment and some high performance computers. On the whole, however, its usage has been confined to high-value, relatively large, and stationary applications. The advantages of vapor compression cooling (VCC) systems are fairly well known. They can provide heat sinks at below ambient temperatures … [Read more...]
Thermo-Reflectance Thermography For Submicron Temperature Measurements
The primary approach to maintaining the aggressive progress in the microelectronics industry has been to increase the density of elementary transistors and to reduce the size of their active areas. As a result, the removal of heat generated by various internal system components has become a major design challenge, further complicated by the lack of knowledge of the temperature … [Read more...]
- « Previous Page
- 1
- …
- 424
- 425
- 426
- 427
- 428
- …
- 484
- Next Page »
