This issue, we present an overview of a number of materials that are often used as thermal insulators. The world would have been much easier for thermal engineers if only the creator had provided us with a choice of materials showing the same range in thermal conductivity values as exists for electrical conductivity. Alas, this isn't the case. Thus, not a single one of the … [Read more...]
Understanding Phase Change Materials
Although phase change materials (PCM) were introduced nearly twenty years ago, it was not until the development of the high-powered Pentium processor that this class of interface material gained widespread acceptance. The large quantities of heat produced by these processors necessitated a carefully designed thermal path where all of the thermal resistances were minimized. For … [Read more...]
Diamonds are a Thermal Designer's Best Friends
Different forms of carbon, such as processed natural graphite, pyrolytic graphite, diamond-like carbon, and synthetic diamond, offer lots of possibilities for maximizing conductive heat transfer.Synthetic diamond has already found its place as a common solution for heat spreaders inside semiconductor laser components, where temperature stabilization is of utmost importance for … [Read more...]
High Resolution, Real Time Micro-thermal Imaging — Steady State and Pulse Measurements on Microscopic Semiconductor Targets
Thermal imaging of microscopic targets has evolved over the past 20 years to the point where real time "true-temperature" mapping with 50 milliKelvin sensitivity and 2.75 �m spatial resolution is possible. Recently, the capability to study and evaluate high frequency transient pulses has been added. Infrared imaging methods provide unequaled ease and flexibility for … [Read more...]
Thermal Issues in GaAs Analog RF Devices
Wireless communication and advanced radar systems require circuitry that can operate at frequencies greater than 2 GHz and at high power levels. Analog gallium arsenide (GaAs) semiconductors are frequently used in these applications and present additional challenges for thermal engineers compared to silicon semiconductors. Whereas thermal characterization modeling and … [Read more...]
- « Previous Page
- 1
- …
- 75
- 76
- 77
- 78
- 79
- …
- 86
- Next Page »











