Submer Technologies was founded In 2015 by Daniel Pope and Pol Valls. The creation of the company with offices, an R&D lab and a manufacturing plant located in Barcelona, Spain answered a precise intuition and need: cooling is the single biggest challenge for datacenters, Supercomputer applications, and Hyperscale deployments. Pol and Daniel had the dream to make operating and constructing datacenters more eco-friendly and so they assembled a multi-disciplined team bringing together skills and experience in datacenter operations, thermal engineering, HW & SW development, service delivery, innovation management, design, marketing and communications. In 2018, Submer came out of R&D and brought the SmartPod Immersion Cooling system to market. In 2019, Submer has further expanded its market scope with deployments all over the world.
Matt graduated with his PhD in Materials Science and Engineering from Georgia Tech spring 2017 and is currently co-founder and CEO of TCPoly. Matt has over 15 combined publications and pending patents and is a Fellow in the Innovation Crossroads Program at Oak Ridge National Labs. He earned degrees at Wake Forest (B.A. Economics) and Oregon Tech (B.Sci. Renewable Energy Engineering) while also playing basketball.
Raffaele Luca Amalfi is a Lead Researcher at Nokia Bell Labs New Jersey, where he performs cutting-edge research in the field of thermal management of high-performance communications and computing systems across multiple scales. He is the Principal Investigator on behalf of Nokia of America Corporation and Bell Labs for the Eurostars Project PCOOLDATA focused on the development of innovative cooling solutions for data centers. Since 2016 he worked as Scientific Collaborator and Lab Manager at the Swiss Federal Institute of Technology of Lausanne (EPFL), at the Heat and Mass Transfer Lab, in Switzerland. In 2015 he joined Alcatel-Lucent Bell Labs in New Jersey, where he performed disruptive research on hybrid cooling technologies for telecom equipment. In 2012 he joined IBM Research Lab in Switzerland where he developed a novel cooling system for high-power electronics. He has received a Ph.D. in Energy Engineering from EPFL and he has authored more than 30 scientific publications.
Rick Beyerle is a senior development engineer and heat transfer specialist at NeoGraf Solutions, LLC, which was formerly the advanced electronics materials division of GrafTech International. Rick is responsible for developing measurement and modeling techniques for graphite heat spreaders, TIMs, and gap pads, as well as non-electronics applications of graphite. His work on SpreaderCalc, a web-based app for simulating heat flow in highly anisotropic graphite foils, was featured in IEEE Spectrum and NASA Tech Briefs. This article was excerpted from “Development of Heat Transfer Tools for Sizing Flexible Graphite Spreaders in Mobile Applications" delivered at the ASME InterPACK 2015.
rbeyerle@neograf.com
Michael Gaynes retired from IBM T. J. Watson Research Center as a Senior Technical Staff Member in 2016, having worked at IBM for 37 years. He held technical leadership positions that covered a wide spectrum of electronic packaging in manufacturing and development. He is currently working as a Process Research Engineer for the Advanced Process Lab at Universal Instruments, Inc. He is a coauthor on 50 technical publications and has over 150 US patents issued. He received a BS degree in Chemical Engineering from Brigham Young University.
gaynesma@gmail.com
Edward Yarmchuk retired from IBM T. J. Watson Research Center as a Research Staff Member in 2009, having worked at IBM for 28 years. He currently develops camera trap technology for Panthera, a wildlife conservation organiza- tion dedicated to preserving large cats in the wild. Dr. Yarmchuk received his PhD in Low Temperature Physics from Rutgers University.
edward.yarmchuk@gmail.com
Timothy Chainer is a Principal Research Staff Member at the IBM T.J. Watson Research Center and leads a team on Subsystem Cooling and Integration. As Principal Investigator of the IBM DARPA ICECool Fundamentals and Applications programs, he led the development of Embedded Two-Phase Cooling for High Performance Computing. He was also Principal Investigator of the IBM DOE program on Economizer Based Data Center Liquid Cooling. He is a Senior Member of the IEEE and a member of the IBM Academy of Technology. He has over 200 Patents and has co-authored more than 40 technical papers. Dr. Chainer received his PhD in Low Temperature Experimental Physics from Rutgers University.
tchainer@us.ibm.com
